Abstract: An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.

Abstract: A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.

Abstract: Regarding a singulation apparatus for singulating a resin encapsulated substrate to manufacture an electronic component, the present invention brings about shortening the delivery period, reducing the footprint, and reducing the cost in compliance with a specification requested by a user. A singulation apparatus for an electronic component has: a basic unit including a receiving unit, singulation unit, and delivery unit; a cleaning unit mounted between the singulation unit and the delivery unit; and an examination unit mounted on the cleaning unit. The singulation unit is appropriately selected in accordance with the requested specification by the user, and a cutting mechanism used in the singulation unit has a rotary blade, water jet, laser light, wire saw, band saw, etc. The cleaning unit and examination unit, both mounted on the basic unit, are each appropriately selected and mounted in accordance with the requested specification by the user.

Abstract: The present invention provides a system 1A for supplying processing water 3, which is used in the operation of processing a target object with a highly pressurized jet of processing water 3 containing an abrasive, including: a tank 2 for storing the processing water 3, having a lower portion substantially tapering downwards; a supply pipe 5 for supplying the processing water 3 to the tank 2; a delivery pipe 8 having an opening 9 located inside the tank 2; a pressure mechanism 7 located outside the tank 2, for pressurizing the processing water 3; and a suction port 10 provided in the side surface of the delivery pipe 8. The processing water 3 in the tank 2 is stratified into a deposition portion 4A, which is a portion where the abrasive is deposited, and a clear-water portion 4W, which is a portion other than the deposition portion 4A and formed by clear water substantially free from the abrasive.

Abstract: A cutting apparatus includes a fixing table where a position of an encapsulated body that is an example of a workpiece is fixed, and a nozzle from which an abrasive waterjet containing abrasive grains for cutting the encapsulated body is sprayed out. The fixing table includes a plurality of protrusions and a plurality of bases. Each of the plurality of protrusions is partitioned by a groove so as to correspond to a plurality of package products subsequent to cutting of the encapsulated body, and includes a through hole to draw in by suction the encapsulated body or one of the plurality of package products. Each of the plurality of bases links protrusions together aligned along at least one direction among the plurality of protrusions. A region of the plurality of protrusions or the plurality of bases against which the abrasive waterjet collides is formed of a material higher in hardness than the abrasive grains.

Abstract: An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).

Abstract: According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which the semiconductor device is mounted is prepared and then the device-mounted substrate is set in one mold part. A release film is thereafter provided between the device-mounted substrate and the other mold part opposite to that one mold part. The one and other mold parts are then closed to press the release film against the portion of the semiconductor device. The device-mounted substrate has a projection enclosing the portion of the semiconductor device for preventing resin flash from being formed. When the mold parts are closed, the release film is pressed against the projection to allow the projection to dig into the release film.

Abstract: A composite material used for a resin mold for forming hardened resin by hardening fluid resin is provided. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.

Abstract: A resin molding apparatus includes a fixing member to which a top mold is attached, a movable member to which a bottom mold is attached, a push-up member provided below the movable member, a drive mechanism moving the push-up member in upward/downward direction, and a flexible joint provided between the movable member and the push-up member. The push-up force of the drive mechanism is transmitted from the push-up member via the flexible joint to the movable member. Thus, a crack does not occur at a connection portion between the push-up member and the movable member. Therefore, a gap is not created between the top mold and the bottom mold. As a result, an excellent molded product is formed.

Abstract: Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.

Abstract: A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 ?m; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.

Abstract: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions.

Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Abstract: A composition contains 0.1 to 10 g of dried Hercampuri extract obtained by extracting the essence of dried whole Hercampuri plant with 60 to 80% aqueous ethanol. It has a function of prevention or curative treatment of lifestyle-related disorders induced by accumulation of visceral fat resulting from excessive calorie intake. It is useful for maintaining, and improving health.

Abstract: First, an intermediate plate and a lower mold are clamped. Thus, a release film is sandwiched between a mold surface of the intermediate plate and a mold surface of the lower mold. In this state, the clamping of an upper mold and the intermediate plate begins. Thus, an enclosed space is formed. Thereafter, the enclosed space is forcibly evacuated. At this time, the upper mold and the intermediate plate is gradually clamped. As a result, the enclosed space is filled with a molten resin and the resin encapsulation mold is completed. According to this method, the release film is prevented from moving into the enclosed space. Thus, deformation or severing of a wire is avoided when the resin encapsulation molding is performed.

Abstract: A substrate with a plurality of semiconductor chips mounted thereon is set in a die. The die is then clamped. The die thus clamped forms a space, into which resin is introduced. In doing so, a member is provided to fill a gap between an upper surface of each chip and the die. The member is elastic and thus elastically deforms when the die is clamped. Thus from the elastic member to each chip's upper surface a substantially uniform pressure is exerted. The elastic member is a film extending substantially parallel to each chip's upper surface and contacts the upper surface as the member is tensioned in its in-plane direction. The above resin introduction step can prevent the semiconductor chip from having an upper surface with resin flash.

Abstract: A space portion is present between the upper surface of a semiconductor chip of a semiconductor chip mounted substrate fitted into a cavity (concave portion for setting) of a lower mold section and the top surface of a cavity of an upper mold section. The upper and lower mold sections are closed while a resin member having a thickness larger than the height of the space portion is inserted in the space portion. At this time, clamping force between the upper and lower mold sections is applied to the semiconductor chip through the resin member. The resin member is deformed in response to the shape of the space portion. Underfill is molded between the semiconductor chip and the substrate while the resin member adheres to both of the upper surface of the semiconductor chip and the top surface of the cavity of the upper mold section.

Abstract: The pressing method includes the first step of displacing a sub-piston provided within a sub-cylinder from its initial position to press working fluid such that the working fluid is introduced via a check valve into a main cylinder to displace a main piston provided therein, and the second step of causing the sub-piston to return to the initial position such that the working fluid is supplied to the sub-cylinder. The first and second steps are repeated successively until the working fluid in the main cylinder attains a prescribed pressure level. With this method, variation in the way of pressing an object is alleviated, contamination due to the working fluid is prevented, and downsizing of the pressing mechanism is enabled.

Abstract: A resin mold material includes a number of one-dimensional communicating holes extending substantially linearly from a mold surface toward inside and having diameter from 1 nm order to 100 nm order; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface, layer; and a number of three-dimensional communicating holes provided to communicate to the one-dimensional communicating holes in the support layer and having 1 &mgr;m order diameter. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing contact area of the mold surface and the liquid resin, i.e., the mold surface being repellant to the liquid resin. Gas in a cavity is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, release property of a molded product from the mold surface is improved and generation of voids is suppressed.

Abstract: A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.