Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces, Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.

Abstract: The present invention provides a glove that can reduce a humid feeling during usage while realizing a grip force, usability, workability, and breathability. The glove of the present invention includes a hand-shaped base layer (2a, 2b) made of fibers having a stretching property, a coating (3a, 3b) formed on the surface of the base layer (2a, 2b), at least on the surface of a palm of the base layer, and a plurality of breathing pores (4a, 4b) formed in the coating (3a, 3b), wherein the opening areas of the breathing pores (4b) when the glove is worn are larger than the opening areas of the breathing pores (4a) when the glove is not worn.

Abstract: A method for forming a resin surface on which recessed portions different in size are formed randomly includes: forming first recessed portions by allowing all or some granular and/or powdery adhering material to adhere to a surface of an unset resin composition containing air bubbles so that at least a portion of the granular and/or powdery adhering material bites into the surface and by removing the adhering material after the resin composition is set; and forming second recessed portions smaller than the first recessed portions in size by allowing some of the air bubbles contained in the unset or set resin composition to open on the aforementioned surface of the resin composition.

Abstract: A glove which can ensure flexibility thereof and can prevent peeling-off of a resin film formed on a surface of a glove base body is provided. Also provided is a manufacturing method of the glove. The glove (G) includes a glove base body (1) constituted of a knitted glove, a first resin film layer (2) formed on a surface of the glove base body (1), and a second resin film layer (3) formed on the first resin film layer (2). The first resin film layer (2) and the second resin film layer (3) cover a palm portion and side portions of the glove base body (1), a palm side and side parts of respective fingers, and areas ranging from fingertip portions to a back portion of the glove base body (1) including the fingertip portions. An uncovered back portion (4) where a resin film layer is not present is formed on a remaining portion of the back portion. The second resin film layer (3) is formed on the first resin film layer (2) in an overlapping manner.

Abstract: In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: A compression resin sealing apparatus includes cooling means (64, 104) for each of an upper die (6) and a lower die (10). A gate nozzle (15) including cooling means (154a) is provided in the upper die (6). A cavity (106) for mounting a single substrate is provided in the lower die (10). In this apparatus, a liquid thermosetting resin material (R) in a required amount is supplied into the cavity (106) through the gate nozzle (15). Then, a substrate is supplied between the upper die (6) and the lower die (10), and the upper die (6) and the lower die (10) are clamped to each other. As a result, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106). That is, compression resin molding is performed. Here, a temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).

Abstract: The present invention aims at effectively decreasing the installation space of an entire semiconductor chip compression molding apparatus and effectively decreasing the clamping force in dies which are provided in the apparatus. It further aims at performing a clamping, in the case where substrates having a different thickness are used, with an efficient adjustment in accordance with the thicknesses of the substrates. To this end, the semiconductor chip compression molding includes two semiconductor chip compression molding dies (top and bottom dies), and a die opening/closing means for closing the die surfaces of top dies and those of bottom dies in each of the upper and lower dies. The die opening/closing means includes a die opening/closing mechanism having two racks and one pinion, and a thickness adjustment mechanism for adjusting the gaps in accordance with the thicknesses of the substrates supplied to each of the upper and lower dies.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.

Abstract: A mold material is mounted on a mold material mount portion of a cutting/working apparatus and rotated about the C-axis serving as the rotation center while a cutting tool is driven and moved in directions X and Y. Then, a desired position of the mold material is cut with the cutting tool at a relatively formed desired cutting speed and elliptically vibrated/cut with the cutting tool, for forming a Fresnel lens molding cavity having an opening of a desired shape and a working surface (concave surface, for example) of a desired shape. The productivity of an optical component mold employed as the structure can be efficiently improved when the mold for molding an optical component such as a Fresnel lens is worked by cutting the mold material employed as a workpiece with the cutting tool in a four-spindle lathe-type cutting/working apparatus including X-, Y-, Z- and C-axes of rotation.

Abstract: A glove which can ensure flexibility thereof and can prevent peeling-off of a resin film formed on a surface of a glove base body is provided. Also provided is a manufacturing method of the glove. The glove (G) includes a glove base body (1) constituted of a knitted glove, a first resin film layer (2) formed on a surface of the glove base body (1), and a second resin film layer (3) formed on the first resin film layer (2). The first resin film layer (2) and the second resin film layer (3) cover a palm portion and side portions of the glove base body (1), a palm side and side parts of respective fingers, and areas ranging from finger tip portions to a back portion of the glove base body (1) including the finger tip portions. An uncovered back portion (4) where a resin film layer is not present is formed on a remaining portion of the back portion.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.

Abstract: A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.

Abstract: In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.

Abstract: A method of compression-molding light emitting elements is provided, which can efficiently prevent the formation of a resin burr on a frame on which LED chips (light-emitting elements) are mounted. A tape for resin burr prevention is adhered to a surface of the frame, i.e. the surface on which no light-emitting element is mounted, to form a tape-applied frame. The tape-applied frame is supplied and set onto a setting section of an upper die, with the LED chips directed downwards. A required amount of transparent liquid resin material is dripped by a dispenser into a large cavity including small cavities. Then, both the upper and lower dies are clamped with a required clamping pressure, whereby the LED chips are individually immersed in the resin contained in the small cavities inside the large cavity and compression-molded to form a molded frame (light emitters).

Abstract: The manufacturing efficiency of a light emitter (product) having a lens member and a light emitting device is efficiently improved. With a molding die for forming a light emitter, a frame before the molding and bonding process, with a required number of light-emitting devices mounted thereon, is set on a setting section provided in an upper die. A required amount of transparent liquid resin material is supplied by a dispenser into each of cavities of cavity blocks provided in a lower die in correspondence to the light-emitting devices, respectively. A molding die is closed so as to elastically press the mouths of the cavities onto the light emission surfaces of the light emitting devices, respectively.