Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.

Abstract: A device includes a memory array, bit line pairs, word lines, a modulation circuit and a control signal generator. The memory array has bit cells arranged in rows and columns. Each bit line pair is connected to a respective column of bit cells. Each word line is connected to a respective row of bit cells. The modulation circuit is coupled with at least one bit line pair. The control signal generator is coupled with the modulation circuit. The control signal generator includes a tracking wiring with a tracking length positively correlated with a depth distance of the word lines. The control signal generator is configured to produce a control signal, switching to a first voltage level for a first time duration in reference with the tracking length, for controlling the modulation circuit. A method of controlling aforesaid device is also disclosed.

Abstract: A method is provided and includes several operations: forming a first group of macros in a first region, wherein the first group of macros are aligned with a first boundary of a channel that is coupled thereto through pins of the first group of macros; forming a second group of macros in the first region to align with a second boundary of the channel that is coupled thereto through pins of the second group of macros, wherein the first and second groups of macros are coupled to a first register; and forming a third group of macros in a second region different from the first region. A first macro and a second macro that are in the third group of macros are aligned with the first and second boundaries respectively. The third group of macros are coupled to a second register different from the first register.

Abstract: A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, manufacturing the integrated circuit according to the integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit and a burn-in heat distribution across the integrated circuit. The integrated circuit design corresponds to the integrated circuit. The integrated circuit is coupled to the test circuit board. The integrated circuit includes a set of circuit blocks and a first set of heaters.

Abstract: A device includes a first memory subarray, a first modulation circuit, a second memory subarray, a second modulation circuit and a control signal generator. The first modulation circuit is coupled to the first memory subarray. The second memory subarray is located between the first memory subarray and the first modulation circuit along a direction. The second modulation circuit is coupled to the second memory subarray. The control signal generator is configured to generate a first control signal to trigger the first modulation circuit according to a first length of the first memory subarray along the direction, and configured to generate a second control signal to trigger the second modulation circuit according to a second length of the second memory subarray along the direction.

Abstract: An integrated circuit (IC) structure includes a continuous well including first through third well portions. The continuous well is one of an n-well or a p-well, the first well portion extends in a first direction, the second well portion extends from the first well portion in a second direction perpendicular to the first direction, and the third well portion extends from the first well portion in the second direction parallel to the second well portion.

Abstract: A memory device includes a first transistor, a second transistor and a third transistor. The first transistor is coupled to a first word line at a first node. The second transistor is coupled to a second word line different from the first word line at a second node. A control terminal of the first transistor is coupled to a control terminal of the second transistor. The third transistor is coupled between a ground and a third node which is coupled to each of the first node and the second node. In a layout view, each of the first transistor and the second transistor has a first length along a direction. The first transistor, the third transistor and second transistor are arranged in order along the direction. A method is also disclosed herein.

Abstract: An integrated circuit (IC) device includes at least one delay circuit having an input and an output, and an output connector electrically coupled to the output. The delay circuit further includes a plurality of transistors electrically coupled with each other between the input and the output. The plurality of transistors is configured to delay an input signal received at the input to generate a delayed signal at the output. The output is in a first metal layer. The output connector includes a first conductive pattern in the first metal layer, and a second conductive pattern in a second metal layer different from the first metal layer. The second conductive pattern electrically couples the output to the first conductive pattern.

Abstract: A method includes forming a fin structure including a plurality of first semiconductor layers and a plurality of second semiconductor layers alternately stacked over a substrate. A dummy gate structure is formed across the fin structure. The exposed second portions of the fin structure are removed. A selective etching process is performed, using a gas mixture including a hydrogen-containing gas and a fluorine-containing gas, to laterally recess the first semiconductor layers. Inner spacers are formed on opposite end surfaces of the laterally recessed first semiconductor layers. Source/drain epitaxial structures are formed on opposite end surfaces of the second semiconductor layers. The dummy gate structure is removed to expose the first portion of the fin structure. The laterally recessed first semiconductor layers are removed. A gate structure is formed to surround each of the second semiconductor layers.

Abstract: A method is provided and includes several operations: arranging multiple channels extending in a first direction; arranging, in accordance with multiple weights of multiple macros, a first portion of the macro closer to a centroid of a core region of an integrated circuit than a second portion of the macros; and arranging the macros on opposite sides of the channels. The macros have multiple pins coupled to the channels interposed between the macros.

Abstract: An integrated circuit (IC) package includes a logic die, a substrate, a memory die positioned between the logic die and the substrate, and a power distribution structure configured to electrically couple the logic die to the substrate. The power distribution structure includes a plurality of conductive segments positioned between the logic die and the memory die, a plurality of bump structures positioned between the memory die and the substrate, and a plurality of through-silicon vias (TSVs) electrically coupled to the plurality of conductive segments and the plurality of bump structures, and a TSV of the plurality of TSVs extends through, and is electrically isolated from, a memory macro of the memory die.

Abstract: A circuit includes an input circuit, a level shifter circuit and an output circuit. The input circuit is coupled to a first voltage supply, and configured to receive a first input signal, and to generate at least a second or a third input signal. The level shifter circuit is coupled to the input circuit and a second voltage supply, and configured to receive a first enable signal, the second or third input signal, and to generate a first signal responsive to the first enable signal, the second input signal or the third input signal. The level shifter circuit includes a header circuit coupled to a first node, and is configured to enable or disable the level shifter circuit responsive to the first enable signal. The output circuit is coupled to at least the level shifter circuit and the second voltage supply, and is configured to generate an output signal.

Abstract: An integrated circuit includes a clocking transistor, a first enabling transistor, a second enabling transistor, a branch-one transistor, a branch-two transistor, and a clock gating circuit. The first enabling transistor is coupled between the clocking transistor and a first node. The second enabling transistor is coupled between the clocking transistor and a second node. The branch-one transistor is coupled between a first power supply and the first node. The gate terminal of the branch-one transistor is electrically connected to the second node. The branch-two transistor is coupled between the first power supply and the second node. The gate terminal of the branch-two transistor is electrically connected to the first node. The clock gating circuit for generating a gated clock signal receives a latch output signal which is latched to a logic level of either a first node signal or a second node signal.

Abstract: An IC structure includes first and second gates, first and second source regions, a shared drain region, and an isolation region. The first gate has a first portion extending along a first direction and a second portion extending along a second direction. The second gate has a first portion extending along the first direction and a second portion extending along the second direction. The shared drain region extends from the first portion of the first gate to the first portion of the second gate. The first source region is spaced apart from the shared drain region by the first gate. The second source region is spaced apart from the shared drain region by the second gate. The isolation region is between the first portion of the first gate and the first portion of the second gate, and resembles a quadrilateral pattern bordering the shared drain region.

Abstract: A semiconductor device has a cell region including active regions that extend in a first direction and in which are formed components of transistors. The transistors of the cell region are arranged to function as a scan insertion D flip flop (SDFQ). The SDFQ includes a multiplexer serially connected at an internal node to a D flip-flop (FF). The transistors of the multiplexer include data transistors for selecting a data input signal, the data transistors having a first channel configuration with a first channel size, and scan transistors of the multiplexer for selecting a scan input signal, the scan transistors having a second channel configuration with a second channel size. The second channel size is smaller than the first channel size.

Abstract: A circuit comprises a memory array, a tracking bit line and a timing control circuit. The memory array comprises a plurality of tracking cells. The tracking bit line is coupled between a first node and the plurality of tracking cells. The timing control circuit is coupled to the first node and comprises a Schmitt trigger. The Schmitt trigger generates a negative bit line enable signal in response to that a voltage level on the first node being below a low threshold voltage value of the Schmitt trigger. The timing control circuit generates a negative bit line trigger signal according to the negative bit line enable signal for adjusting voltage levels of a plurality of bit lines of the memory array.

Abstract: A memory device includes a memory array, a first latch and a first logic element. The memory array is configured to operate according to a first global write signal. The first latch is configured to generate a first latch write data based on a clock signal. The first logic element is configured to generate the first global write signal based on the clock signal and the first latch write data.

Abstract: An integrated circuit (IC) device includes first and second power rails extending in a first direction, a third power rail extending in the first direction between the first and second power rails, gate structures extending perpendicular to the first direction, each of two endmost gate structures extending continuously between endpoints underlying the first and second power rails, and first through fourth pluralities of active areas extending in the first direction between the endmost gate structures. Active areas of each of the first through fourth pluralities of active areas are aligned in the first direction, a first portion of the gate structures and first through fourth pluralities of active areas is configured as a functional circuit, and a second portion of the gate structures and first through fourth pluralities of active areas is configured as one of a decoupling capacitor or an antenna diode.

Abstract: A method includes: forming first, second, and third NWs; forming form first to fourth transistors in corresponding first to fourth groups of active regions, connecting selected transistors amongst the first and second transistors to form first and second input circuits respectively receiving a first input signal in a first domain and a second input signal in the first domain; connecting selected transistors amongst the first and third transistors and amongst the first and fourth transistors to respectively form a first single bit level shifter (SBLS) and a second SBLS; each SBLS operates in the second domain and receives correspondingly versions of the first and second input signals; and connecting selected transistors amongst the first and third transistors to form a control circuit for toggling the first and second SBLSs between a normal and a standby state, a portion of the control circuit and the first SBLS sharing the second NW.

Abstract: An IC structure includes first and second gates, first and second source/drain regions, and an isolation region. The first and second gates each have a first portion extending along a first direction and a second portion extending along a second direction. The first source/drain regions are respectively on opposite sides of the first portion of the first gate. The second source/drain regions are respectively on opposite sides of the first portion of the second gate. The isolation region has a lower portion between a first one of the first source/drain regions and a first one of the second source/drain regions, and an upper portion partially overlapping with the second portion of first gate and the second portion of the second gate. A width of the lower portion is a less than a width of the upper portion.