Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.

Abstract: A system having a light guide adapted to collect light from a light source, a light detector attached to the light guide, a controller electrically connected to an output of the light detector, and a driver for driving the light source detachably connected to an output of the controller. The driver includes a memory that stores a calibration value for the light source.

Abstract: A radiation device is disclosed. The device includes a light cavity including a top surface, a bottom surface, and side walls. A light source array including at least one light source is formed on a first side wall. The device also includes a reflective coating formed on at least the bottom surface. The top surface allows light transmission and includes a light conversion layer.

Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.

Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.

Abstract: A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.

Abstract: A light-emitting diode (LED) package system includes a LED disposed over a surface of a substrate. A molding material covers the LED. A phosphor-containing material is disposed over and spaced from the LED by the molding material.

Abstract: The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board. The lighting instrument also includes a plurality of light-emitting devices disposed on the substrate. The light-emitting devices may be light-emitting diode (LED) dies. The LED dies belong to a plurality of different bins. The bins are categorized based on the light output performance of the LED dies. In some embodiments, the LED dies may be binned based on the wavelength or radiant flux of the light output. The LED dies are distributed on the substrate according to a predefined pattern based on their bins. In some embodiments, the LED dies are bin-mixed in an interleaving manner.

Abstract: An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.

Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

Abstract: A light-emitting diode (LED) device is provided. The LED device has a substrate and an LED structure overlying the substrate. Embedded elements are embedded within one or more layers of the LED structure. In an embodiment, the embedded elements include a dielectric material extending through the LED structure such that the embedded elements are surrounded by the LED structure. In another embodiment, the embedded elements only extend through an upper layer of the LED structure, or alternatively, partially through the upper layer of the LED structure. Another conductive layer may be formed over the upper layer of the LED structure and the embedded elements.

Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

Abstract: A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.

Abstract: Non-planar via designs for sub-mounts on which to mount a LED or other optoelectronic device include a continuous layer of metal to conduct the current from the front-side (e.g., LED side) to the backside (e.g., SMD side) through the via and to provide a sufficiently stable and reliable under bump metallization for SMD soldering. Each UBM can be structured so that it does not fully cover the sidewall surfaces of the via that forms the front-to-backside interconnect. In some implementations, each via structure for the feedthrough metallization extends to a respective side-edge of the sub-mount.

Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.

Abstract: A system and method for manufacturing a light-generating device is described. A preferred embodiment comprises a plurality of LEDs formed on a substrate. Each LED preferably has spacers along the sidewalls of the LED, and a reflective surface is formed on the substrate between the LEDs. The reflective surface is preferably located lower than the active layer of the individual LEDs.

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract: The present disclosure provides an illuminating system including a light emitting diode (LED); and a tunable luminescent material disposed approximate the light-emitting diode, wherein the tunable luminescent material includes alkaline earth metal (AE) and silicon aluminum nitride doped by a rare earth element (RE), formulated as (AE)Si6?pAlpN8, wherein p is a parameter defining a relative aluminum content in weight and p is greater than zero.

Abstract: A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.