Abstract: Provided are a semiconductor memory device with guard pillars and a manufacturing method thereof. The semiconductor memory device includes a substrate having a memory region and a periphery region surrounding the memory region, a plurality of bit line structures, a plurality of contacts, a plurality of guard pillars and a plurality of capacitors. The bit line structures are arranged parallel to each other on the substrate in the memory region. The contacts are disposed between the adjacent bit line structures and electrically connected to the substrate. The guard pillars are disposed on the substrate and located between the adjacent bit line structures at the boundary between the memory region and the periphery region. The capacitors are disposed on the plurality of contacts to be electrically connected to the plurality of contacts.

Abstract: A method manufacturing of a semiconductor structure including following steps is provided. A material layer is provided. A first mask layer is formed on the material layer. Core patterns are formed on the first mask layer. A spacer material layer is conformally formed on the core patterns. An etch-back process is performed on the spacer material layer. A portion of the spacer material layer located on two ends of the core pattern is removed, then spacer structures are formed. Each spacer structure includes a merged spacer and a non-merged spacer. The core patterns are removed. The first patterned mask layer is formed to cover a portion of the merged spacer and expose another portion of the merged spacer and the non-merged spacer. The first patterned mask layer and the spacer structure are used as a mask, and the first mask layer is patterned into a second patterned mask layer.

Abstract: A semiconductor apparatus implementing a high speed data output and compensating a resetting of a latch circuit is provided. A readout method of a NAND type flash memory includes: a pre-charging step performing a pre-charging on a bit line and a NAND string connected to the bit line through a sense node (SNS); a resetting step performing a resetting on the latch circuit after the pre-charging; and a discharging step performing a discharging on the NAND string after the resetting.

Abstract: A NAND flash memory capable of reducing the planar size of a memory cell is provided. The three-dimensional NAND flash memory includes a substrate, an insulating layer, a lower conductive layer (a source), a three-dimensional memory cell structure, and a bit line. The memory cell structure includes a plurality of strip-shaped gate stacks including stacks of insulators and conductors stacked along a vertical direction from the substrate; and a plurality of channel stacks separately arranged along one side of the gate stack. An upper end of the channel stack is electrically connected to the orthogonal bit line, and a lower end of the channel stack is electrically connected to the lower conductive layer.

Abstract: A RRAM and its manufacturing method are provided. The RRAM includes a first dielectric layer formed on a substrate, and two memory cells. The two memory cells include two bottom electrode structures separated from each other. Each bottom electrode structure fills one of two trenches in the first dielectric layer. The two memory cells also include a resistance switching layer and a top electrode structure. The resistance switching layer is conformity formed on the surface of an opening in the first dielectric layer, and the opening is between the two trenches. The top electrode structure is on the resistance switching layer and fills the opening. A top surface of the first dielectric layer, top surfaces of the bottom electrode structures, a top surface of the resistance switching layer, and a top surface of the top electrode structure are coplanar.

Abstract: The disclosure provides a semiconductor storage device and a reading method that can achieve high-speed processing of error detection and correction and miniaturization. The flash memory of the disclosure has a NAND chip and an ECC chip. The NAND chip includes a memory array, and a page buffer/sensing circuit including a latch (L1) and a latch (L2). The ECC chip includes RAM_E and RAM_O. The RAM_E and RAM_O hold the read data output from the latches (L1, L2) of the NAND chip. RAM_E holds the data of the even-numbered sectors, and RAM_O holds the data of the odd-numbered sectors. Making RAM_E or RAM_O alternately hold the data of the sectors can reduce the data size of RAM_E and RAM_O.

Abstract: A memory array and its operation method are provided. The array includes plural sets of word lines; plural bit lines; and plural memory cell each arranged at intersection of the plural sets of word lines and the plural bit lines. Each memory cell has first and second conductive filament component and a switch circuit, and one ends of the first and the second conductive filament components are coupled to corresponding bit lines and the other ends thereof are coupled to the switch circuit. In the differential mode, read is performed based on the reading currents of the first and the second conductive filament components. In the single-ended mode, read is performed based on a reference current and a reading current of the first or the second conductive filament component that is formed successfully.

Abstract: The invention provides a semiconductor device and a continuous reading method for suppressing fluctuations of a precharging voltage caused by an increase in a precharging time. The continuous reading method of a NAND flash memory of the invention includes the following steps: a first voltage (VCLMP1+Vth) is applied to a gate of a transistor (BLCLAMP) connected to a bit line and a voltage is supplied to the bit line via the transistor (BLCLAMP) to start precharging of the bit line; and a second voltage (VCLMP1+Vth??) lower than the first voltage is applied to the gate of the transistor (BLCLAMP) when the precharging time caused by the application of the first voltage has elapsed for a certain period of time.

Abstract: A self-aligned multiple patterning mark is provided. The mark includes a group of patterns disposed on the substrate and a cover layer. The group of patterns includes a plurality of strip patterns extending in a first direction and arranged parallel to each other, and the ends of two adjacent strip patterns are connected to each other to form an independent ring. The cover layer is disposed on the substrate and covers the group of patterns. The cover layer has an opening extending in a second direction across the first direction, and the cover layer covers two opposite ends of each strip pattern.

Abstract: A memory and a sense amplifying device are provided. The sense amplifying device includes a differential amplifier, a first pre-charge circuit, and a control voltage generator. The differential amplifier has a first input terminal and a second input terminal to receive a data signal and a reference signal, respectively. The first pre-charge circuit is coupled to the first input terminal of the differential amplifier. The first pre-charge circuit, based on a power voltage, performs a pre-charge operation on the first input terminal of the differential amplifier according to a pre-charge enable signal and a control voltage. The control voltage generator generates the control voltage according to the power voltage, and the control voltage and the power voltage are in a positive correlation.

Abstract: Provided is a resistive random access memory (RRAM) including a first electrode layer and a second electrode layer disposed opposite to each other, a variable resistance layer located between the first electrode layer and the second electrode layer, an oxygen exchange layer located between the variable resistance layer and the second electrode layer, a conductive layer laterally surrounding a sidewall of the oxygen exchange layer, a first barrier layer located between the conductive layer and the oxygen exchange layer and between the oxygen exchange layer and the variable resistance layer, and a second barrier layer located between the conductive layer and the second electrode layer and between the second electrode layer and the oxygen exchange layer.

Abstract: Provided is a memory device including a substrate, a plurality of stack structures, a protective layer, and a plurality of contact plugs. The stack structures are disposed over the substrate. The protective layer conformally covers top surfaces and sidewalls of the stack structures. The contact plugs are respectively disposed over the substrate between the stack structures. One of the contact plugs includes a narrower portion and a wider portion over the narrower portion. In a top view, the wider portion is separated from an adjacent protective layer by a distance.

Abstract: A method of manufacturing a dynamic random access memory including the following steps is provided. A bit line is formed on a substrate. A sidewall structure is formed on a sidewall of the bit line. The sidewall structure includes a first insulation layer, a second insulation layer, and a shield conductor layer. The first insulation layer is disposed on the sidewall of the bit line. The second insulation layer is disposed on the first insulation layer. The shield conductor layer is disposed between the first insulation layer and the second insulation layer. An interconnection structure electrically connected to the shield conductor layer is formed.

Abstract: A memory, including a selected memory cell block and a first sense amplifying device, is provided. The selected memory cell block and the first sense amplifying device are both coupled to a first global bit line. The first sense amplifying device is configured to: in a leakage current detection mode, detect a leakage current of the selected memory cell block on a first global bit line to generate leakage current information; and in a data reading mode, provide a reference signal according to the leakage current information, and compare a readout signal on the first global bit line with the reference signal to generate readout data, wherein the leakage current detection mode happens before the data reading mode.

Abstract: A memory device and a computing method are provided. The memory device includes a memory array, comprising a first and second memory blocks, and a comparator. The first memory block performs a multiplication and accumulation (MAC) operation according to a first weight matrix and a first input matrix to generate a first sum. The second memory block performs the MAC operation according to a second weight matrix and a second input matrix to generate a second sum. The comparator compares the first and second sums. In a first configuration, each value of the input and second input matrixes are the same and each value of the first and second weight matrixes are complements. In a second configuration, each value of the first and second input matrixes are complements and each value of the first and second weight matrixes are the same.

Abstract: A three-dimensional semiconductor device includes multiple semiconductor device layers on a substrate, wherein each layer includes a first stacked structure, a first gate dielectric layer, a first semiconductor layer, a first channel layer, a first source region, a first drain region, and a first resistive random access memory cell. The first stacked structure on the substrate includes a first insulating layer and a first gate conductor layer. The first gate dielectric layer surrounds a sidewall of the first stacked structure. The first semiconductor layer surrounds a sidewall of the first gate dielectric layer. The first channel layer is in the first semiconductor layer. The first source region and the first drain region are on both sides of the first channel layer in the first semiconductor layer. The first resistive random access memory cell is on a first sidewall of the first semiconductor layer and connected to the first drain region.

Abstract: Provided is a method of manufacturing a resistive random access memory (RRAM) including: forming a lower electrode protruding from a top surface of a dielectric layer; conformally forming a data storage layer on the lower electrode and the dielectric layer; forming an oxygen reservoir material layer on the data storage layer; forming an opening in the oxygen reservoir material layer to expose the data storage layer on the lower electrode; forming an isolation structure in the opening, wherein the isolation structure divides the oxygen reservoir material layer into a first oxygen reservoir layer and a second oxygen reservoir layer; and forming an upper electrode on the first and second oxygen reservoir layers, wherein the first and second oxygen reservoir layers share the upper electrode.

Abstract: An error detection and correction method for a flash memory includes: a setting step, setting selection information to select a first error detection and correction function for performing 1-bit error detection and correction or a second error detection and correction function for performing multiple-bit error detection and correction; and an executing step, performing the first error detection and correction function or the second error detection and correction function based on the selection information during a read operation or a write operation.

Abstract: A filament forming method includes: performing first stage to apply first bias including gate and drain voltages to a resistive memory unit plural times until read current reaches first saturating state, latching read current in first saturating state as saturating read current, determining whether increasing rate of saturating read current is less than first threshold value; when increasing rate of saturating read current is not less than first threshold value, performing second stage to apply second bias, by increasing gate voltage and decreasing drain voltage, to the resistive memory unit plural times until read current reaches second saturating state, latching read current in second saturating state as saturating read current and determining whether increasing rate of saturating read current is less than first threshold value; finishing the method when increasing rate of saturating read current is less than first threshold value and saturating read current reaches target current value.

Abstract: A semiconductor memory structure includes a semiconductor substrate, a bit line disposed on the semiconductor substrate, and a capacitor contact disposed on the side of the bit line. The capacitor contact includes a semiconductor plug disposed on the semiconductor substrate, a metal plug disposed on the semiconductor plug, a metal silicide liner extending along the sidewalls and bottom of the metal plug, and a nitride layer disposed on the metal silicide liner. The top surface of the metal silicide liner is lower than the top surface of the metal plug. The nitride layer surrounds the top portion of the metal plug.