Abstract: An apparatus includes a data processing array having a plurality of array tiles. Each array tile can include a random-access memory (RAM) having a local memory interface accessible by circuitry within the array tile and an adjacent memory interface accessible by circuitry disposed within an adjacent array tile. Each adjacent memory interface of each array tile can include isolation logic that is programmable to allow the circuitry disposed within the adjacent array tile to access the RAM or prevent the circuitry disposed within the adjacent array tile from accessing the RAM. The data processing array can be subdivided into a plurality of partitions wherein the isolation logic of the adjacent memory interfaces is programmed to prevent array tiles from accessing RAMs across a boundary between the plurality of partitions.

Abstract: A design tool determines features of a circuit design and applies a first model to the features. The first model indicates a predicted value of a metric based on the plurality of features. The design tool applies an explanation model to the features, and the explanation model indicates levels of contributions by the features to the predicted value of the metric, respectively. The design tool selects a feature of the plurality of features based on the respective levels of contributions and looks up a recipe associated with the feature in a database having possible features associated with recipes. The design tool processes the circuit design according to the recipe into implementation data that is suitable for making an integrated circuit (IC).

Abstract: A design tool determines features of a circuit design and applies a first model to the features. The first model indicates a predicted value of a metric based on the plurality of features. The design tool applies an explanation model to the features, and the explanation model indicates levels of contributions by the features to the predicted value of the metric, respectively. The design tool selects a feature of the plurality of features based on the respective levels of contributions and looks up a recipe associated with the feature in a database having possible features associated with recipes. The design tool processes the circuit design according to the recipe into implementation data that is suitable for making an integrated circuit (IC).

Abstract: Embodiments herein describe a multiple die system that includes an interposer that connects a first die to a second die. Each die has a bump interface structure that is connected to the other structure using traces in the interposer. However, the bump interface structures may have different orientations relative to each other, or one of the interface structures defines fewer signals than the other. Directly connecting the corresponding signals defined by the structures to each other may be impossible to do in the interposer, or make the interposer too costly. Instead, the embodiments here simplify routing in the interposer by connecting the signals in the bump interface structures in a way that simplifies the routing but jumbles the signals. The jumbled signals can then be corrected using reordering circuitry in the dies (e.g., in the link layer and physical layer).

Abstract: Implementing a circuit design using time-division multiplexing (TDM) can include determining a net signature for each of a plurality of nets of a circuit design. For each net, the net signature specifies location information for a driver and one or more loads of the net. The plurality of nets having a same net signature can be grouped according to distance between drivers of the respective nets. One or more subgroups can be generated based on a TDM ratio for each group. For one or more of the subgroups, a TDM transmitter circuit is connected to a TDM receiver circuit through a selected interconnect, the drivers of the nets of the subgroup are connected to the TDM transmitter circuit, and loads of the nets of the subgroup are connected to the TDM receiver circuit.

Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.

Abstract: In one example, a command pattern sequencer includes a set of registers to store values used to configure a command sequence for configuring a memory. The command pattern sequencer further includes state machine circuitry coupled to the set of registers, the state machine circuitry configured to generate and execute the command sequence. The command pattern sequencer still further includes timing circuitry configured to manage timing between commands of the command sequence.

Abstract: A disclosed circuit arrangement detects the supply voltage level to the “device” (SoC, chip, SiP, etc.) and adjusts bias voltages to receiver and transmitter circuits of the device to levels suitable for the device in response to the supply voltage ramping-up during a power-on reset (“POR”) sequence. The circuitry holds the receiver output at a constant logic value while the supply voltage is ramping up and the POR signal is asserted. The disclosed circuitry also protects the transceiver as the voltage domain of the input signal is unknown and the voltage between any two terminals of a transistor of the transceiver cannot exceed a certain level.

Abstract: An example programmable device includes a configuration memory configured to store configuration data; a programmable logic having a configurable functionality based on the configuration data in the configuration memory; a signal conversion circuit; a digital processing circuit; an endpoint circuit coupled to the signal conversion circuit through the digital processing circuit; wherein the digital processing circuit includes a first one or more digital processing functions implemented as hardened circuits each having a predetermined functionality, and a second one or more processing functions implemented by the configurable functionality of the programmable logic.

Abstract: Static and automatic realization of inter-basic block burst transfers for high-level synthesis can include generating an intermediate representation of a design specified in a high-level programming language, wherein the intermediate representation is specified as a control flow graph, and detecting a plurality of basic blocks in the control flow graph. A determination can be made that plurality of basic blocks represent a plurality of consecutive memory accesses. A sequential access object specifying the plurality of consecutive memory accesses of the plurality of basic blocks is generated. A hardware description language (HDL) version of the design is generated, wherein the plurality of consecutive memory accesses are designated in the HDL version for implementation in hardware using a burst mode.

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

Abstract: Approaches for logic compaction include inputting an optimization directive that specifies one of area optimization or speed optimization to a synthesis tool executing on a computer processor. The synthesis tool identifies a multiplier and/or an adder specified in a circuit design and synthesizing the multiplier into logic having LUT-to-LUT connections between LUTs on separate slices of a programmable integrated circuit (IC) in response to the optimization directive specifying speed optimization. The synthesis tool synthesizes the multiplier and/or adder into logic having LUT-carry connections between LUTs and carry logic within a single slice of the programmable IC in response to the optimization directive specifying area optimization. The method includes implementing a circuit on the programmable IC from the logic having LUT-carry connections in response to the optimization directive specifying area optimization.

Abstract: A programmable, non-linear (PNL) activation engine for a neural network is capable of receiving input data within a circuit. In response to receiving an instruction corresponding to the input data, the PNL activation engine is capable of selecting a first non-linear activation function from a plurality of non-linear activation functions by decoding the instruction. The PNL activation engine is capable of fetching a first set of coefficients corresponding to the first non-linear activation function from a memory. The PNL activation engine is capable of performing a polynomial approximation of the first non-linear activation function on the input data using the first set of coefficients. The PNL activation engine is capable of outputting a result from the polynomial approximation of the first non-linear activation function.

Abstract: Analog-to-digital converter circuitry includes comparator circuitry, capacitor analog-to-digital converter circuitry (CDA), and successive approximation register (SAR) circuitry. The comparator circuitry includes a non-inverting input and an inverting input to selectively receive a differential voltage signal, and an output. The CDAC circuitry includes a first capacitor network having a first plurality of capacitors. A first capacitor of the first plurality of capacitors includes a first terminal connected to the non-inverting input and a second terminal selectively connected to a first voltage potential and a second voltage potential. The first voltage potential is greater than the second voltage potential. The SAR circuitry is connected to the output and the first capacitor network, and connects, during a first period, the second terminal of the first capacitor to the second voltage potential.

Abstract: Examples described herein provide for determining a recipe for identifying from which buckets integrated circuit chips are taken to form units of a multi-chip apparatus. In an example, a method uses a processor-based system and uses a Markov Decision Process. Buckets are defined based on respective characteristics of manufactured chips. Each of the manufactured chips is binned into a respective one of the buckets based on the characteristic of the respective manufactured chip. A recipe for identifying from which of the buckets to take one or more of the manufactured chips to incorporate into respective ones of the units of the multi-chip apparatus is generated.

Abstract: An electronic device and methods for fabricating the same are disclosed herein that utilize a dam formed on a printed circuit board (PCB) that is positioned to substantially prevent edge bond material, utilized to secure a chip package to the PCB, from interfacing with the solder balls transmitting signals between the PCB and chip package.

Abstract: Static and automatic realization of inter-basic block burst transfers for high-level synthesis can include generating an intermediate representation of a design specified in a high-level programming language, wherein the intermediate representation is specified as a control flow graph, and detecting a plurality of basic blocks in the control flow graph. A determination can be made that plurality of basic blocks represent a plurality of consecutive memory accesses. A sequential access object specifying the plurality of consecutive memory accesses of the plurality of basic blocks is generated. A hardware description language (HDL) version of the design is generated, wherein the plurality of consecutive memory accesses are designated in the HDL version for implementation in hardware using a burst mode.

Abstract: A System-on-Chip includes a data processing engine array. The data processing engine array includes a plurality of data processing engines organized in a grid. The plurality of data processing engines are partitioned into at least a first partition and a second partition. The first partition includes one or more first data processing engines of the plurality of data processing engines. The second partition includes one or more second data processing engines of the plurality of data processing engines. Each partition is configured to implement an application that executes independently of the other partition.

Abstract: A machine learning-based process includes identifying a first set of features that includes features of a reference implementation of a circuit design and features of a synthesized version of a modified version of the circuit design. A first classification model is applied to the first set of features, and the first classification model indicates a full implementation flow or an incremental implementation flow. The full implementation flow is performed on the synthesized version of the modified version in response to the first classification model indicating the full implementation flow, and the incremental implementation flow is performed on the synthesized version of the modified version in response to the first classification model indicating the incremental implementation flow. The full and incremental implementation flows generate implementation data that is suitable for making an integrated circuit (IC).

Abstract: Automatically generating a hardware image based on programming model types includes determining by a design tool, types of programming models used in specifications of blocks of a circuit design, in response to a user control input to generate a hardware image to configure a programmable integrated circuit (IC). The design tool can generate a model-type compiler script for each of the types of programming models. Each compiler script initiates compilation of blocks having specifications based on one of the types of programming model into an accelerator representation. The design tool can generate a build script configured to execute the compiler scripts and link the accelerator representations into linked accelerator representations. Execution of the build script builds a hardware image from the linked accelerator representations for configuring the programmable IC to implement a circuit according to the circuit design.