Abstract: Device(s) and method(s) related generally to a wafer or die stack are disclosed. In one such device, a die stack of two or more integrated circuit dies has associated therewith test circuits corresponding to each level of the die stack each with a set of pads. A test data-input path includes being from: a test data-in pad through a test circuit to a test data-out pad of each of the test circuits; and the test data-out pad to the test data-in pad between consecutive levels of the test circuits. Each of the set of pads includes the test data-in pad and the test data-out pad respectively thereof. A test data-output path is coupled to the test data-out pad of a level of the levels.

Abstract: Bootstrapping a programmable integrated circuit (IC) based network interface card (NIC) can include implementing, within the programmable IC, a first circuitry by loading a first stage configuration bitstream, wherein the first circuitry includes a bus endpoint configured to communicate with a host computer via a communication bus, a platform processor, and a first bootloader. The platform processor, executing the first bootloader, loads a first firmware within the programmable IC. A second circuitry is implemented within the programmable IC by the platform processor executing the first firmware to load a second stage configuration bitstream. The second circuitry includes a NIC controller. The platform processor, executing the first firmware, loads a second firmware within the programmable IC. The second firmware is executable to configure the second circuitry.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating transaction associations in a waveform display. One of the methods includes receiving data representing a main signal for a selected transaction in a waveform display, the main signal including a plurality of main signal events. A search is performed for data representing one or more side signals associated with the main signal for the selected transaction, each side signal including a plurality of side signal events representing other transactions that are associated with the main signal at a time indicated by a corresponding main signal event. A visual indication is generated within the waveform display of an association between the selected transaction and one or more transactions identified by the one or more side signals associated with the main signal for the selected transaction.

Abstract: Techniques for electrostatic discharge (ESD) protection in integrated circuit (IC) chip packages methods for testing the same are described that are configured to directs the risk of ESD events through ground and power interconnects preferentially over I/O interconnects to enhance ESD protection in chip packages. In one example, a chip package is provided that includes an IC die, a substrate, and a plurality of interconnects. The plurality of interconnects are exposed on a side of the substrate opposite the IC die. The interconnects provide terminations for substrate circuitry formed within the substrate. At least one of the last 5 interconnects of the plurality of interconnects respectively comprising rows and columns of interconnects disposed along the edges of the substrate that closest to each corner of substrate project farther from the substrate than interconnects within those rows and columns that are configured as I/O interconnects.

Abstract: An example method of encoding a video includes selecting blocks of pixels in a frame of the video, the blocks having luminance (Y) blocks, red color difference (Cr) blocks, and blue color difference (Cb) blocks; performing intra-estimation based on reconstructed pixels of at the blocks of pixels to generate predicted blocks and then subtracting the predicted blocks from the blocks of pixels to generate residual data, the residual data comprising respective residual data for the Y-blocks interleaved with respective residual data for the Cr-blocks and the Cb-blocks; and generating new reconstructed pixels using a pipeline of a video encoder by processing the residual data for the blocks.

Abstract: Examples described herein provide for an isolation design for an inductor of a stacked integrated circuit device. An example is a multi-chip device comprising a chip stack comprising: a plurality of chips, neighboring pairs of the plurality of chips being bonded together, each chip comprising a semiconductor substrate, and a front side dielectric layer on a front side of the semiconductor substrate; an inductor disposed in a backside dielectric layer of a first chip of the plurality of chips, the backside dielectric layer being on a backside of the semiconductor substrate of the first chip opposite from the front side of the semiconductor substrate of the first chip; and an isolation wall extending from the backside dielectric layer of the first chip to the front side dielectric layer, the isolation wall comprising a through substrate via of the first chip, the isolation wall being disposed around the inductor.

Abstract: Embodiments herein describe techniques for validating binary files used to configure a hardware card in a computing system. In one embodiment, the hardware card (e.g., an FPGA) includes programmable logic which the binary file can configure to perform a specialized function. In one embodiment, multiple users can configure the hardware card to perform their specialized tasks. For example, the computing system may be server on the cloud that hosts multiple VMs or a shared workstation. Permitting multiple users to directly configure and use the hardware card may present a security risk. To mitigate this risk, the embodiments herein describe techniques for validating encrypted binary files.

Abstract: A device includes an amplifier, a plurality of selector circuitries, and a plurality of fabric dies. The amplifier is configured to output a supply power signal. Each selector circuitry of the plurality of selector circuitries receives the supply power signal from the amplifier. Each fabric die of the plurality of fabric dies has a corresponding selector circuitry of the plurality of selector circuitries. Each selector circuitry corresponding to a die of the plurality of dies is configured to provide the supply power signal received from the amplifier to its corresponding die responsive to a selection signal being asserted. Selector circuitries of the plurality of selector circuitries corresponding to unselected dies of the plurality of dies pull address supply power for the unselected dies to an input other than the supply power signal of the selector circuitries corresponding to the unselected die.

Abstract: A network interface device, said network interface device has a data transmission path configured to receive data for transmission. The data for transmission is to be sent over a network by the network interface device. A monitor is configured to monitor the data transmission path to determine if an underrun condition is associated with the data transmission path. If so, an indication is included in the transmitted data packet.

Abstract: Active-on-active microelectronic devices are described. For example, a first die is on a second die with a bottom surface of a first substrate facing a top surface of a second substrate, respectively, to provide a die stack. The first and second dies each have metal layers in ILD layers to provide a first stack structure and a second stack structure, respectively. The first stack structure is interconnected to an upper end of a TSV of the first die. A metal layer of the second stack structure near a bottom surface of the first substrate is interconnected to a lower end of the TSV. A power distribution network layer of the second stack structure is located between lower and upper layers of the metal layers thereof. A transistor located at least in part in the second substrate is interconnected to the power distribution network layer to receive supply voltage or ground.

Abstract: Examples described herein generally relate to forming and/or configuring a die stack in a multi-chip device. An example is a method of forming a multi-chip device. Dies are formed. At least two or more of the dies are interchangeable. Characteristics of the at least two or more of the dies that are interchangeable are determined. A die stack comprising the at least two or more of the dies that are interchangeable is formed. Respective placements within the die stack of the at least two or more of the dies that are interchangeable are based on the characteristics.

Abstract: A method relates generally to comparison of a communications system modelled with a behavioral model and implemented with a circuit realization. In this method, operation of the communications system is simulated with the behavioral model on a computing device to obtain a first pulse response. The simulating includes first equalizing first data with a first equalizer of the behavioral model to obtain the first pulse response. The circuit realization is operated to obtain a second pulse response. The operating includes: second equalizing second data corresponding to the first data with a second equalizer of the circuit realization to obtain the second pulse response. The second pulse response from the circuit realization is loaded to memory of the computing device. The first pulse is loaded to the memory of the computing device. The first pulse response and the second pulse response are compared with one another by the computing device.

Abstract: Methods and apparatus are described for simultaneously buffering and reformatting (e.g., transposing) a matrix for high-speed data streaming in general matrix multiplication (GEMM), which may be implemented by a programmable integrated circuit (IC). Examples of the present disclosure increase the effective double data rate (DDR) memory throughput for streaming data into GEMM digital signal processing (DSP) engine multifold, as well as eliminate slow data reformatting on a host central processing unit (CPU). This may be accomplished through software-defined (e.g., C++) data structures and access patterns that result in hardware logic that simultaneously buffers and reorganizes the data to achieve linear DDR addressing.

Abstract: Examples herein describe techniques for generating dataflow graphs using source code for defining kernels and communication links between those kernels. In one embodiment, the graph is formed using nodes (e.g., kernels) which are communicatively coupled by edges. A compiler converts the source code into a bit stream and/or object code which configures a heterogeneous processing environment of a SoC to execute the graph. Before implementing the dataflow graph on the SoC, the programmer may wish to simulate the dataflow graph. In one embodiment, each kernel in the dataflow graph is assigned a respective thread. Additionally, the simulator can include a runtime library for simulating the different types of communication links between the kernels. Even those these communication links are different protocols or have different semantics, using the simulation components in the library makes the different types of communication links composable so they can inter-operate in the same simulation environment.

Abstract: An integrated circuit (IC) includes a plurality of dies. The IC includes a plurality of memory channel interfaces configured to communicate with a memory, wherein the plurality of memory channel interfaces are disposed within a first die of the plurality of dies. The IC may include a compute array distributed across the plurality of dies and a plurality of remote buffers distributed across the plurality of dies. The plurality of remote buffers are coupled to the plurality of memory channels and to the compute array. The IC further includes a controller configured to determine that each of the plurality of remote buffers has data stored therein and, in response, broadcast a read enable signal to each of the plurality of remote buffers initiating data transfers from the plurality of remote buffers to the compute array across the plurality of dies.

Abstract: A data processing system and method are provided. A host computing device comprises at least one processor. A network interface device is arranged to couple the host computing device to a network. The network interface device comprises a buffer for receiving data for transmission from the host computing device. The processor is configured to execute instructions to transfer the data for transmission to the buffer. The data processing system further comprises an indicator store configured to store an indication that at least some of the data for transmission has been transferred to the buffer wherein the indication is associated with a descriptor pointing to the buffer.

Abstract: An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.

Abstract: Examples described herein provide a method for disabling a defective portion of a fabric die of a stacked IC device. The method includes receiving a signal indicating that a portion of a fabric die of a stacked IC device including at least two fabric dies is defective. The method further includes, in response to the signal, pulling a source voltage rail of the defective portion to ground, thereby disabling the portion, and operating the remainder of the fabric die without interference from or contention with the disabled portion. In one example, the stacked IC device is an active on active (AoA) device, and the portion of the fabric die includes a configuration memory cell. In one example, the signal is received after power-up of the stacked IC device.

Abstract: An integrated circuit (IC) die is provided, which includes a die body; electrostatic discharge (ESD) circuitry formed in the die body; contact pads exposed on an active side of the die body; a first conductive tower formed in the die body and electrically coupling a first contact pad to the ESD circuitry. The first conductive tower comprises first, second, third, and fourth segments formed from metal layers of the die body; a first via electrically coupling the first segment to the second segment; a second via electrically coupling the first segment to the third segment; a third via electrically coupling the second segment to the fourth segment; and a fourth via electrically coupling the third segment to the fourth segment, the second segment electrically parallel with the third segment. The IC die further comprises at least a first data line disposed between the first, second, third, and fourth segments.

Abstract: Examples herein describe techniques for communicating directly between cores in an array of data processing engines. In one embodiment, the array is a 2D array where each of the data processing engines includes one or more cores. In addition to the cores, the data processing engines can include a memory module (with memory banks for storing data) and an interconnect which provides connectivity between the cores. Using the interconnect, however, can add latency when transmitting data between the cores. In the embodiments herein, the array includes core-to-core communication links that directly connect one core in the array to another core. The cores can use these communication links to bypass the interconnect and the memory module to transmit data directly.