Abstract: Methods and systems are disclosed for transferring data using descriptors to reference memory locations at which data is to be written to or read from. Each descriptor references a respective linked list of descriptor blocks. Each of the descriptor blocks includes a contiguous portion of the memory that stores a plurality of addresses, at which data is to be written to or read from. In response to receiving the data transfer request, a set of data is transferred from a first set of addresses specified in a first descriptor to a second set of addresses specified in a second descriptor by traversing the linked lists of descriptor blocks in the first and second descriptors.

Abstract: A disclosed circuit arrangement includes an interconnect circuit, a processor, a first memory circuit, a proxy memory circuit, and a decryption circuit. The interconnect circuit receives a first transaction from one of the one or more processors and transmits the first transaction to the proxy memory circuit in response to a first address in a first transaction. The proxy memory circuit translates the first address into a second address of the first memory circuit, generates a second transaction including the second address, transmits the second transaction to the interconnect circuit, and receives encrypted data from the first memory circuit in a response to the second transaction. The decryption circuit decrypts the encrypted data into decrypted data, and the proxy memory circuit transmits the decrypted data to the one processor in a response to the first transaction.

Abstract: Embodiments herein describe techniques for preparing and executing tasks related to a database query in a database accelerator. In one embodiment, the database accelerator is separate from a host CPU. A database management system (DBMS) can offload tasks corresponding to a database query to the database accelerator. The DBMS can request data from the database relevant to the query and then convert that data into one or more data blocks that are suitable for processing by the database accelerator. In one embodiment, the database accelerator contains individual hardware processing units (PUs) that can process data in parallel or concurrently. In order to process the data concurrently, the data block includes individual PU data blocks that are each intended for a respective PU in the database accelerator.

Abstract: Approaches for capturing states of signals of a circuit-under-test are disclosed. A logic analyzer circuit is coupled to the circuit-under-test and is configured to receive a plurality of probe signals and a plurality of trigger signals from the circuit-under-test. The logic analyzer circuit inputs data identifying a subset of the probe signals and a subset of the trigger signals. The logic analyzer circuit selects the subset of trigger signals for input to trigger logic and selects the subset of probe signals in the logic analyzer circuit after the logic analyzer circuit and the circuit-under-test are active. The logic analyzer circuit samples states of the subset of probe signals in response to the trigger logic and stores the sampled states of the subset of probe signals in a memory.

Abstract: Disclosed approaches for processing a circuit design targeted to a programmable integrated circuit (IC) include inputting the circuit design to a programmed processor. Each path of the circuit design specifies a plurality of circuit elements of the programmable IC. For each circuit element specified in a path of the plurality of paths the processor looks up in a memory a mean delay associated with the circuit element, looks up a sigma factor associated with the circuit element, and looks up a delta factor associated with the circuit element. The processor determines a delay of the path as a function of the mean delay, sigma factor, and delta factor of each circuit element in the path.

Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.

Abstract: Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to a qualified stacked silicon interconnect (SSI) technology programmable integrated circuit (IC) region by providing an interface (e.g., an HBM buffer region implemented with a hierarchical switch network) between the added feature device and the programmable IC region. One example apparatus generally includes a programmable IC region and an interface region configured to couple the programmable IC region to at least one fixed feature die via a first plurality of ports associated with the at least one fixed feature die and a second plurality of ports associated with the programmable IC region. The interface region is configured as a switch network between the first plurality of ports and the second plurality of ports, and the switch network includes a plurality of full crossbar switch networks.

Abstract: An example dynamic element matching (DEM) circuit includes: a plurality of bipolar junction transistors (BJTs), each of the plurality of BJTs having a base terminal and a collector terminal coupled to electrical ground; a plurality of pairs of force switches, each pair of force switches coupled to an emitter of a respective one of the plurality of BJTs; a plurality of pairs of sense switches, where each pair of sense switches is coupled to the emitter of a respective one of the plurality of BJTs, a first switch in each pair of sense switches is coupled to a first node, and a second switch in each pair of sense switches is coupled to a second node; a first current source coupled to a first switch in each pair of force switches; and a second current source coupled to a second switch in each pair of force switches.

Abstract: A method and apparatus are provided that includes an electronic device, a chip package and a method for cooling a chip package in an electronic device. In one example, the chip package includes an interposer or package substrate having a first IC die and a second IC die mounted thereon. The second IC die has a maximum safe operating temperature that is greater than a maximum safe operating temperature of the first IC die. An indicia is disposed on the chip package. The indicia designates an installation orientation of the interposer or package substrate which positions the first IC die upstream of the second IC die relative to a direction of cooling fluid flow.

Abstract: Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.

Abstract: An example semiconductor device includes a first integrated circuit (IC) die including a first column of cascade-coupled resource blocks; a second IC die including a second column of cascade-coupled resource blocks, where an active side of the second IC die is mounted to an active side of the first IC die; and a plurality of electrical connections between the active side of the first IC and the active side of the second IC, the plurality of electrical connections including at least one electrical connection between the first column of cascade-coupled resource blocks and the second column of cascade-coupled resource blocks.

Abstract: An integrated circuit device having a vertical connection interfaces for coupling stacked components are provided that improve communication between the stacked components. The techniques described herein allow for increased signal connection density while reducing potential for crosstalk. For example, a ground to signal ratio of connections between components in a vertical interface configured to carry ground signals relative to connections configured to carry data signals within a bank of connections has an edge to center gradient which reduces the amount of ground connections needed to meet crosstalk thresholds, while increasing the amount of signal connections available for communication between components across the vertical interface.

Abstract: Apparatuses and method for an integrated circuit device are described. In an apparatus thereof, there is a plurality of memory controllers coupled to a plurality of memory banks. A network of switches is coupled to the plurality of memory controllers. A plurality of data processing devices is coupled to the network of switches and is configured to generate memory requests. A network controller is coupled to the network of switches and is configured to queue the memory requests and selectively issue requests to memory from the memory requests queued responsive to corresponding response times associated with the plurality of memory banks.

Abstract: Processing a circuit design that specifies application logic and debugging logic includes partitioning the circuit design. Each partition includes a part of the application logic and a part of the debugging logic, each partition is specified for implementation on a respective IC die, and the circuit design specifies connections between a part of the application logic in one partition and a part of the debugging logic in another partition. The connections between the part of the application logic in the one partition and the part of the debugging logic in the other partition are changed to connections from the part of the application logic in the one partition to a part of the debugging logic in the one partition. The part of the application logic and the part of the debugging logic of each partition are placed and routed on the respective IC die.

Abstract: An example test circuit for an integrated circuit (IC) having a plurality of scan chains includes: a first circuit and a second circuit; and a scan chain router coupled between the first circuit and the plurality of scan chains and coupled between the second circuit and the plurality of scan chains, the scan chain router responsive to an enable signal to: (1) couple the first circuit to each of the plurality of scan chains; or (2) couple the second circuit to one or more concatenated scan chains, where each concatenated scan chain includes a concatenation of two or more of the plurality of scan chains.

Abstract: A circuit arrangement for handling write and read requests between a master circuit and a slave circuit in different clock domains includes first and second write FIFO circuits, a read FIFO circuit, and a write acknowledgment circuit. The first write FIFO circuit is configured and arranged to receive and buffer write addresses of write requests received from a master circuit and addressed to a slave circuit. The second write FIFO circuit is configured and arranged to receive and buffer write data associated with the write addresses of the write requests. The read FIFO circuit is configured and arranged to receive and buffer read addresses of read requests received from the master circuit and addressed to the slave circuit. The write acknowledgment control circuit is configured and arranged to transmit an acknowledgement to a write request to the master circuit before the slave circuit issues a response to the write request.

Abstract: An example method of trimming a voltage reference in an integrated circuit (IC) includes at a first temperature, sequencing through a first plurality of trim codes for a reference circuit of the voltage reference configured to generate a proportional-to-temperature current and a corresponding first control voltage, and a complementary-to-temperature current and a corresponding second control voltage. The method further includes measuring a voltage output of the voltage reference for each of the first plurality of trim codes to obtain first voltage output values. The method further includes at a second temperature, sequencing through a second plurality of trim codes for the reference circuit. The method further includes measuring the voltage output of the voltage reference for each of the second plurality of trim codes to obtain second voltage output values. The method further includes selecting a trim code for the reference circuit based on the first voltage output values and the second voltage output values.

Abstract: In an example, an integrated circuit (IC) includes a memory including at least one random access memory (RAM). Each of the at least one RAM stores bits representing match vectors indicative of whether search keys match ternary rules. The IC further includes a verification circuit, coupled to the memory, operable to verify the bits stored in the at least one RAM by performing at least one of: decoding at least one of the ternary rules from the bits stored in the at least one RAM; or checking the bits stored in the at least one RAM against expected content of at least one of the ternary rules.

Abstract: An apparatus and method therefor for a receiver are disclosed. In this apparatus, at least one delay line is configured to receive input data from a communication lane and provide repetitions of the input data delayed with respect to one another. An exclusive disjunction combinatorial circuit is configured to receive the input data and the repetitions thereof and to generate a discontinuity-detection signal for codeword alignment responsive to successive linear combination by exclusive disjunction of the input data and the repetitions thereof to cancel out portions of repeated sequences of the input data for detection of at least one type of discontinuity in the input data.

Abstract: An integrated circuit (IC) includes an encoder circuit. The encoder circuit includes an encoding input configured to receive an input message including one or more data symbols. Each data symbol has N bits and N is a positive integer. The encoder circuit includes an encoding unit configured to perform Reed-Solomon encoding to the one or more data symbols to generate one or more coding symbols. The Reed-Solomon encoding uses a Galois field having an order that is less than 2N. A coded message that includes the one or more data symbols and the one or more coding symbols is provided at an encoding output of the encoder circuit.