Abstract: This disclosure relates generally to continuous time linear equalization. In an example of a continuous time linear equalizer, a variable gain circuit includes transistors having gate nodes respectively as a first and a second input node. A first transimpedance circuit is connected between the first input node and a first output node. A second transimpedance circuit is connected between the second input node and a second output node. A source node of each of the first transistor and the second transistor are commonly connected to one another. In the same or another equalizer, output nodes of a first frequency peaking circuit are connected to input nodes of a second frequency peaking circuit. In such a same or another equalizer, an RC feedback circuit has tap-off nodes and summing nodes respectively connected at the output nodes of the first frequency peaking circuit.

Abstract: Methods and systems are presented in this disclosure for implementing forward error correction in cloud and data center storage devices based on low-density parity-check (LDPC) channel coding. A forward error correction circuit presented herein includes a first LDPC decoder configured to perform hard-decision LDPC decoding of data read from a storage medium through a first read channel. The forward error correction circuit further includes a hybrid LDPC decoder selectively configurable to perform a selected one of hard-decision LDPC decoding and soft-decision LDPC decoding of data read from the storage medium through a second read channel, wherein, responsive to a control signal generated based, at least in part, on one or more parameters indicative of condition of the storage medium, the hybrid LDPC decoder is switchable between hard-decision LDPC decoding and soft-decision LDPC decoding.

Abstract: A clock and data recovery (CDR) circuit includes a phase detector, a digital loop filter, and a lock detector. The phase detector generates a phase detect result signal in response to phase detection of a plurality of samples. The plurality of samples are generated by sampling a received signal based on a sampling clock a sampling clock provided by a phase interpolator. The digital loop filter includes a phase path and a frequency path for providing a phase path correction signal and a frequency path correction signal based on the phase detect result signal respectively. A phase interpolator code generator generates a phase interpolator code for controlling the phase interpolator based on the phase path correction signal and frequency path correction signal. The lock detector generates a lock condition signal based on the frequency path correction signal, the lock condition signal indicating a lock condition of the CDR circuit.

Abstract: In an example, an input buffer includes: first buffer circuit having an output, a first voltage control node, and a second voltage control node; a first transistor having a gate coupled to the output of the first buffer circuit, a drain, and a source; a second buffer circuit having an input coupled to a reference voltage and an output coupled to the source of the first transistor; and a first current source having a reference output coupled to the drain of the first transistor, a first output coupled to the first voltage control node of the first buffer circuit, and a second output coupled to the second voltage control node of the second buffer circuit.

Abstract: Disclosed approaches for configuring a memory include generating by a high-level synthesis (HLS) tool executing on a computer system, a first mapping of elements of a high-level language (HLL) program to elements of a hardware language finite state machine that represents a circuit implementation of the HLL program. The HLS tool further generates a second mapping of lines of the HLL program to states of the hardware language finite state machine and stores the information describing the first mapping and the second mapping in a data structure of a database in the memory.

Abstract: An example integrated circuit (IC) package includes: a processing system and a programmable IC disposed on a substrate, the processing system coupled to the programmable IC through interconnect of the substrate; the processing system including components coupled to a ring interconnect, the components including a processor and an interface controller. The programmable IC includes: an interface endpoint coupled to the interface controller through the interconnect; and at least one peripheral coupled to the interface endpoint and configured for communication with the ring interconnect of the processing system through the interconnect endpoint and the interface controller.

Abstract: A disclosed network on chip includes a semiconductor die and switches disposed on the semiconductor die. Each switch has ports configured to receive packets from and transmit packets to at least two other switches. Each switch includes first circuitry that specifies a first mapping of interface identifiers of interfaces on the semiconductor die to port identifiers, and second circuitry that specifies a second mapping of region identifiers of regions of the semiconductor die to port identifiers. Each switch further includes third circuitry coupled to the first and second circuitry. The third circuitry is configured to select, in response to an input packet that specifies a destination region and a destination interface, a port based on the specification of the destination region, specification of the destination interface, first mapping, and second mapping, and output the packet on the selected port.

Abstract: A device may include a voltage-to-current converter circuit having an operational transconductance amplifier (OTA), the voltage-to-current converter circuit for generating a bias current that is proportional to a reference voltage at a reference voltage input port of the OTA, and a bias current feedback path for providing the bias current to a bias current input port of the OTA. The device may further include a startup current generator circuit coupled to the bias current input port of the OTA, the startup current generator circuit controllable to provide a startup current to the bias current input port during a startup of the device and to be deactivated after the startup of the device.

Abstract: Circuit design implementation can include selecting a first and second load each having a control pin of a same type driven by a different driver, determining whether the driver of the first load matches the driver of the second load, and modifying the circuit design to drive the control pins of the first load and the second load using the driver of the first load. Circuit design implementation can include selecting a net having a driver and a plurality of loads exceeding a threshold, determining a selected module of the circuit design having a number of the plurality of loads of the net that meet a cloning criteria, and, in response, modifying the circuit design by creating a clone of the driver within the selected module and driving each load of the net within the selected module with the clone of the driver.

Abstract: In an example, an apparatus includes an analog switch having an n-type metal oxide semiconductor (NMOS) circuit in parallel with a p-type metal oxide semiconductor (PMOS) circuit between a switch input and a switch output. The analog switch is responsive to an enable signal that determines switch state thereof. The NMOS circuit includes a switch N-channel transistor coupled to a buffer N-channel transistor, a gate of the switch N-channel transistor coupled to the enable signal and a gate of the buffer N-channel transistor coupled to a modulated N-channel gate voltage. The PMOS circuit including a switch P-channel transistor coupled to a buffer P-channel transistor, a gate of the switch P-channel transistor coupled to a complement of the enable signal and a gate of the buffer P-channel transistor coupled to a modulated P-channel gate voltage.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a conformal lid to improve the chip package assembly from deformation. In one example, a chip package assembly is provided that includes integrated circuit (IC) dies, a packaging substrate, and a lid. The packaging substrate has a die receiving area that is defined by the laterally outermost extents of the IC dies mounted to the packaging substrate. The lid a surface that includes a first region and a second region. The first region is disposed over the first IC die while the second region of the lid extends below the second surface the first IC die and is spaced above the packaging substrate. At least a portion of the second region of the lid is overlapped with the die receiving area.

Abstract: An approach for debugging a circuit implementation of a software specification includes translating a high-level language debugging command into a hardware debugging command that specifies the value(s) of a condition in the circuit implementation, and a storage element(s) at which the value(s) of the condition is stored. The hardware debugging command is transmitted to a debug controller circuit that generates a single clock pulse to the circuit implementation. The debug controller circuit reads a value(s) from the storage element(s) specified by the hardware debugging command and determines whether or not the value(s) satisfies the condition. The debug controller circuit generates another single clock pulse in response to the value(s) read from the storage element(s) not satisfying the condition. Generation of pulses of the clock signal is suspended and data indicative of a breakpoint is output in response to the value(s) read from the storage element(s) satisfying the condition.

Abstract: A method of making measurements in a testing arrangement having a plurality of devices under test is described. The method comprises configuring a device interface board with the plurality of devices under test; running a set of test vectors in a plurality of loops on each device under test of the plurality of devices under test, wherein the set of test vectors is run in parallel on the plurality of devices under test and comprises edge shifted test vectors which are shifted by a predetermined edge shift step during each loop; receiving test result data for the plurality of devices under test; and determining, for each device under test, fail information to identify when the device under test failed based upon a number of edge shift steps. A system for making measurements in a testing arrangement having a plurality of devices under test is also described.

Abstract: A disclosed integrated circuit includes first and second clock generation circuits, a stagger circuit, and a plurality of scan chains. The first clock generation circuit receives a first clock signal and generates a first set of clock pulses having a first frequency in response to receipt of a first clock trigger signal and a first enable signal. The second clock generation circuit receives a second clock signal and generates a second set of clock pulses having a second frequency in response to receipt of a second clock trigger signal and a second enable signal. The stagger circuit generates the first and second clock trigger signals from the global trigger signal at different times. The first set of clock pulses are staggered relative to the second set of clock pulses. The plurality of scan chains test functionality of logic circuitry within the IC chip using the first and second set of clock pulses.

Abstract: A circuit for asynchronous clock generation is described. The circuit comprises a first comparator configured to receive an analog input signal; a second comparator configured to receive the analog input signal; and a clocking circuit coupled to the first comparator and the second comparator; wherein the clocking circuit generates a first asynchronous clock signal for the first comparator and a second asynchronous clock signal for the second comparator. A method of providing asynchronous clock generation is also described.

Abstract: A neural network system includes an input layer, one or more hidden layers, and an output layer. The input layer receives a training set including a sequence of batches and provides to its following layer output activations associated with the sequence of batches respectively. A first hidden layer receives, from its preceding layer, a first input activation associated with a first batch, receive a first input gradient associated with a second batch preceding the first batch, and provide, to its following layer a first output activation associated with the first batch based on the first input activation and first input gradient. The first and second batches have a delay factor associated with at least two batches. The output layer receives, from its preceding layer, a second input activation, and provide, to its preceding layer, a first output gradient based on the second input activation and the first training set.

Abstract: An example receiver includes: a pad splitter circuit coupled to a pad, the pad splitter circuit configured to generate a first logic signal and a second logic signal; a wide-range receiver coupled to the pad splitter circuit to receive the first and second logic signals, the wide-range receiver comprising a combination of a first Schmitt trigger receiver and a second Schmitt trigger receiver; a control circuit coupled to the pad splitter circuit and the wide-range receiver; and a bias generator circuit coupled to the pad splitter circuit and the wide-range receiver.

Abstract: Aspects of various embodiments of the present disclosure are directed to methods and circuits preventing hold violations in clock synchronized circuits. In an example implementation, a circuit includes a logic circuit having a set of inputs. Signal propagation time on a signal path to at least one of the set of inputs presents a hold violation. The circuit includes first and second level-sensitive latches. The first level-sensitive latch has an output connected to the one of the plurality of inputs. The second level-sensitive latch has an input connected to an output of the logic circuit. A latch control circuit is configured to remove the hold violation on the input by providing a pulsed clock signal to a clock input of the second level-sensitive latch and an inversion of the pulsed clock signal to a clock input of the first level-sensitive latch.

Abstract: A circuit for implementing a multifunction output generator is described. The circuit comprises an amplifier circuit having a first input and a second input; a voltage generator coupled at a first node to a first input of the amplifier circuit; a controllable current source configured to provide a variable current to the first node; and a switching circuit enabling the operation of the amplifier circuit in a first mode for sensing a temperature and a second mode for providing a reference voltage. A method of implementing a multifunction output generator is described.

Abstract: An example clock and data recovery (CDR) circuit includes a phase interpolator, a fractional-N phase locked loop (PLL) configured to supply a clock signal to the phase interpolator, and a phase detector configured to generate a phase detect result signal in response to phase detection of data samples and crossing samples of a received signal, the data samples and the crossing samples being generated based on a data phase and a crossing phase, respectively, or a sampling clock supplied by a phase interpolator. The CDR circuit further includes a digital loop filter configured to generate a phase interpolator code for controlling the phase interpolator, the digital loop filter including a phase path and a frequency path. The CDR circuit further includes a control circuit configured to control the digital loop filter to disconnect the frequency path from the phase path and to connect the frequency path to a control input of the fractional-N PLL.