Abstract: An integrated circuit (IC) includes a downlink unit including an input to receive a first plurality of frequency domain (FD) symbols associated with data symbols for a plurality of users, and an iteration unit to perform a plurality of iterations based on adjustment values. Each iteration includes generating a second plurality of FD symbols by performing a precoding process based on the first plurality of FD symbols, generating a third plurality of time domain (TD) symbols by performing a first modulation process based on the second plurality of FD symbols, generating a fourth plurality of TD symbols by performing a dynamic range reduction process based on absolute values of the third plurality of TD symbols, and updating the adjustment values. The downlink unit further includes a decision unit configured to generate transmit TD symbols for transmission through a channel to the plurality of users.

Abstract: Disclosed approaches for processing a circuit design include identifying duplicate instances of a module in a representation of the circuit design. A processor circuit performs folding operations for at least one pair of the duplicate instances of the module. One instance of the duplicates is removed from the circuit design, and a multiplexer is inserted. The multiplexer receives and selects one of the input signals to the duplicate instances and provides the selected input signal to the remaining instance. For each flip-flop in the remaining instance, a pipelined flip-flop is inserted. Connections to a first clock signal in the remaining instance are replaced with connections to a second clock signal having twice the frequency of the first clock signal. An alignment circuit is inserted to receive the output signal from the first instance and provide concurrent first and second output signals.

Abstract: The phase interpolator comprises a first charge pump configured to receive a first differential clock signal having a first clock phase, wherein the first charge pump has a first current path and a second current path coupled between a first pull-up current source and a first pull-down current source, wherein the first current path comprises a first NMOS steering switch coupled between a first output node and the first pull-down current source and the second current path comprises a second NMOS steering switch coupled between a second output node and the first pull-down current source; and a second charge pump configured to receive a second differential clock signal having a second clock phase, wherein the second charge pump has a third current path and a fourth current path coupled between a second pull-up current source and a second pull-down current source, and wherein the third current path comprises a third NMOS steering switch coupled between the first output node and the second pull-down current source

Abstract: In an example implementation, an alignment detection circuit includes a buffer, a candidate selection circuit, and a correlator circuit. The buffer is configured to receive a data stream from a data lane, the data stream including alignment markers delineating data frames, each of the alignment markers having a predefined bit pattern. The candidate selection circuit is configured to identify candidate data blocks in successive data blocks of the data stream provided by the buffer, each of the candidate blocks having a measure of symmetry satisfying a threshold metric indicative of the predefined bit pattern. The correlator circuit is configured to search for at least one of the alignment markers in each of the candidate blocks and adjust alignment of the data stream in the buffer in response to locating the at least one alignment marker.

Abstract: A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, the testing system includes a robot disposed in an enclosure and having a range of motion operable to transfer a chip package assembly between any of a first queuing station, a second queuing station and a plurality of test stations. The system also includes an automatic identification and data capture (AIDC) device operable to read an identification tag affixed to a carrier disposed in the first and second queuing stations, and a controller configured to control placement of chip package assemblies by the robot in response information obtained from a carrier disposed in at least one of the first and second queuing stations, the predefined test routine of the test processor of the first test station, and the predefined test routine of the test processor of the second test station.

Abstract: The disclosed voting circuit includes a pull-up circuit connected to an output node and to a positive supply voltage. A pull-down circuit is connected to the output node and to ground, and the output node is coupled to receive true output of a first bi-stable circuit. The pull-up circuit pulls the output node to the positive supply voltage in response to complementary output signals from second and third bi-stable circuits being in a first state, and the pull-down circuit pulls the output node to ground in response to complementary output signals from second and third bi-stable circuits being in a second state that is opposite the first state.

Abstract: A method, non-transitory computer readable medium, and circuit for clock phase generation are disclosed. The circuit includes an injection locked oscillator, a loop controller, and a phase interpolator. The injection locked oscillator includes an input for receiving an injected clock signal and an output for forwarding a set of fixed clock phases. The loop controller includes an input for receiving a phase separation error of the fixed clock phases and an output for forwarding a supply voltage derived from the phase separation error. The supply voltage matches the free running frequency of the injection locked oscillator to a frequency of the injected clock signal. The phase interpolator includes an input for receiving the set of fixed clock phases directly from the injection locked oscillator, an input for receiving the supply voltage from the loop controller, and an output for forwarding an arbitrary clock phase.

Abstract: An example method of manufacturing a semiconductor assembly includes: forming first integrated circuit (IC) dies and dummy dies; forming an interposer wafer including a top side having first mounting sites for the first IC dies and second mounting sites for second IC dies; attaching the first IC dies to the interposer wafer at the first mounting sites and the dummy dies to the interposer wafer at the second mounting sites; processing a backside and the top side of the interposer wafer; removing the dummy dies from the top side of the interposer wafer to expose the second mounting sites; and attaching the second IC dies to the interposer wafer at the exposed second mounting sites.

Abstract: Methods and systems are disclosed for placement and routing of a circuit design. A set of timing constraints is retrieved that specifies timing for objects included in a first shell circuit design configured to provide an interface for communication between the circuit design and the set of dedicated hardware resources on an IC. One or more objects of the first shell circuit design that do not affect timing of the circuit design are identified and removed from the first shell circuit design to produce a second shell circuit design. The circuit design is placed and routed according to timing constraints specified for objects of the first shell circuit design that are included in the second shell circuit design. The placed and routed circuit design is stored in a memory circuit.

Abstract: Implementing hardware accelerators using programmable integrated circuits may include performing, using a processor, a design flow on a static circuit design. The static circuit design may specify a region reserved for a hardware accelerator and a static region comprising interface circuitry configured to couple the hardware accelerator with an external node. The design flow may generate an implemented static circuit design. Metadata describing the interface circuitry may be generated using a processor. A device support archive including the implemented static circuit design and the metadata may be written, using the processor, to a computer readable storage medium.

Abstract: An integrated circuit (IC) that includes a processor circuit can be booted by receiving, using a storage interface circuit of the IC, a first boot image from a nonvolatile memory chip. The first boot image is executed on a processor circuit of the IC to configure a bus interface module that is designed to communicate with a host device over a communication bus that links multiple devices and the IC. Using the bus interface module, a second boot image is received from the memory of the host device to a memory of the IC. The IC is booted by executing the second boot image.

Abstract: A digital predistortion (DPD) system includes an input configured to receive a DPD input signal. The DPD system includes a first predistortion circuit configured to provide a first signal path coupled to the input to generate a first predistortion signal. The first predistortion circuit includes a first infinite impulse response (IIR) filter. A second predistortion circuit is configured to provide a second signal path coupled to the input in parallel with the first signal path to generate a second predistortion signal. The second predistortion circuit includes a second IIR filter. A combiner circuit is configured to combine the first predistortion signal and the second predistortion signal to generate a DPD output signal.

Abstract: In an example, a programmable integrated circuit (IC) includes external contacts configured to interface with a substrate and a plurality of configurable logic elements (CLEs) distributed across a programmable fabric. The programmable IC further includes interconnect circuits disposed between the plurality of CLEs and the external contacts. A plurality of the interconnect circuits is disposed in the plurality of CLEs.

Abstract: A memory device can be used with a shared routing resource that provides access to the memory device. The memory device can include a random access memory (RAM) circuit that includes a plurality of ports configured to provide access to the RAM circuit by the shared routing resource. A memory partition register circuit can be configured to store a plurality of addresses specifying respective context partitions within the RAM circuit. A plurality of pointer register circuits that can each be associated with a corresponding port of the plurality of ports and can be configured to store a respective set of pointers that specify a location in the RAM circuit relative to a respective context partition. Addressing logic that can be configured to provide access to the RAM circuit using the respective set of pointers for each port.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a conformal lid to improve the chip package assembly from deformation. In one example, a chip package assembly is provided that includes integrated circuit (IC) dies, a packaging substrate, and a lid. The packaging substrate has a die receiving area that is defined by the laterally outermost extents of the IC dies mounted to the packaging substrate. The lid a surface that includes a first region and a second region. The first region is disposed over the first IC die while the second region of the lid extends below the second surface the first IC die and is spaced above the packaging substrate. At least a portion of the second region of the lid is overlapped with the die receiving area.

Abstract: A circuit for implementing a scan chain in programmable resources of an integrated circuit is described. The circuit comprises a programmable element configured to receive an input signal and generate an output signal based upon the input signal; a selection circuit configured to receive the output signal generated by the programmable element at a first input and to receive a scan chain input signal at a second input, wherein the selection circuit generates a selected output signal in response to a selection circuit control signal; and a register configured to receive the selected output signal of the selection circuit.

Abstract: An example output driver includes a plurality of output circuits coupled in parallel between a first voltage supply node and a second voltage supply node. Each of the plurality of output circuits includes a differential input that is coupled to receive a logic signal of a plurality of logic signals and a differential output that is coupled to a common output node. The output driver further includes voltage regulator(s), coupled to the voltage supply node(s), and a current compensation circuit. The current compensation circuit includes a switch coupled in series with a current source, where the switch and the current source are coupled between the first voltage supply node and the second voltage supply node. An event detector is coupled to the switch to supply an enable signal and to control state of the enable signal based on presence of a pattern in the plurality of logic signals.

Abstract: An example transmitter includes first and second circuit stages and interface circuits. The first circuit stage is configured to generate modulated signals each having a different carrier frequency from baseband signals. The second circuit stage is configured to generate radio frequency (RF) energy to be radiated by antenna(s). The interface circuits are coupled between the first circuit stage and the second circuit stage. The second circuit stage and the interface circuits are configurable to provide a first mode and a second mode. In the first mode, the second circuit stage provides transmit paths and the interface circuits couple each of the modulated signals to a respective one of the transmit paths. In the second mode, the second circuit stage provides a first transmit path and the interface circuits couple a sum of at least two of the modulated signals to the first transmit path.

Abstract: In an example, an IC package includes a package substrate including a plurality of bumps configured for coupling to a printed circuit board, the package substrate including a core disposed between a plurality of top-side conductive layers and a plurality of bottom-side conductive layers. The IC package further includes an IC die coupled to the package substrate and disposed on top of the plurality of top-side conductive layers. The IC die further includes a voltage regulator IC die disposed on the package substrate adjacent to the IC die, the voltage regulator IC die being coupled to the IC die using two of four top-most layers of the plurality of top-side conductive layers nearest the IC die.

Abstract: In an example, a system-on-chip (SoC) includes a hardware power-on-reset (POR) sequencer circuit coupled to a POR pin. The SoC further includes a platform management unit (PMU) circuit, coupled to the hardware POR sequencer circuit, the PMU including one or more central processing units (CPUs) and a read only memory (ROM). The SoC further includes one or more processing units configured to execute a boot process. The hardware POR sequencer circuit is configured to initialize the PMU. The one or more CPUs of the PMU are configured to execute code stored in the ROM to perform a pre-boot initialization.