Abstract: A control device controls an operation of a processing apparatus for performing a processing in a processing container that accommodates a substrate. The control device includes: a temperature acquisition unit configured to acquire a temperature inside the processing container; a storage unit configured to store relationship information indicating a relationship between the temperature inside the processing container and an etching rate, and film thickness information including a cumulative film thickness of a deposited film inside the processing container; a rate calculator configured to calculate an etching rate of the deposited film based on the temperature acquired by the temperature acquisition unit and the relationship information stored in the storage unit; and a time calculator configured to calculate an etching time for removing the deposited film based on the etching rate calculated by the rate calculator and the film thickness information stored in the storage unit.

Abstract: A control device of an injection molding machine, the injection molding machine including: a mold clamping device that advances and retracts a movable mold with respect to a fixed mold; and an injection device that injects and fills a molten material into a cavity formed between both the molds, the control device including: a display unit that displays a setting screen for setting molding conditions of the injection molding machine; and a setting unit that sets the molding conditions based on information displayed on the setting screen.

Abstract: A method for operating an injection-molding machine, including the steps: a) in a current injection-molding cycle, after an accepted-part reference injection-molding cycle learned in a learning phase: detecting a compound pressure change k1 relative to an accepted-part reference compound pressure pmasse, ref during at least part of an injection phase of the current injection-molding cycle by measuring a current compound pressure pmasse, act and comparing the current compound pressure pmasse,act with the accepted-part reference compound pressure pmasse,ref, b) determining a target mold internal pressure curve pwkz,soll (t) for a holding-pressure phase of the current injection-molding cycle, wherein for this purpose a mold internal pressure curve pwkz,ref (t) of the accepted-part reference injection-molding cycle is adjusted at least in dependence on the compound pressure change k1 detected in step a), and c) traveling the holding-pressure curve pmasse, Hld, act (t) of the current injection-molding cycle in suc

Abstract: This application is directed to a display assistant device that acts as a voice-activated user interface device. The display assistant device includes a base, a screen and a speaker. The base is configured for sitting on a surface. The screen has a rear surface and is supported by the base at the rear surface. A bottom edge of the screen is configured to be held above the surface by a predefined height, and the base is substantially hidden behind the screen from a front view of the display assistant device. The speaker is concealed inside the base and configured to project sound substantially towards the front view of the display assistant device.