Abstract: Provided are methods and apparatus for exposing multiple substrates within a single exposing apparatus using only a single light source wherein a first substrate is exposed in a series of steps or shots during which light transmitted along a primary optical path is directed onto a primary surface of the substrate with the substrate being repositioned between sequential shots. A second substrate is exposed during the period of time while the first substrate is being repositioned by altering the optical path to divert the light from the light source into a secondary optical path that will expose a region on the second substrate. When the first substrate has been repositioned, the diversion of the light is terminated so that the light will again be transmitted along the primary optical path in order to expose the next sequential shot on the primary surface of the first substrate.

Abstract: A lithographic projection apparatus in which a balance mass is supported by a base frame using at least one supporting member which is coupled to both the base frame and balance mass. Free horizontal movement is provided by providing the supporting member with at least two pivot points.

Abstract: In an immersion lithography apparatus, ultrasonic waves are used to atomize liquid on a surface of the substrate.

Abstract: A method for aligning a substrate in a lithographic apparatus includes determining from a geometric reference of the substrate a position of a window on the substrate. The window indicates an area in which an alignment mark of the substrate may be expected. Then, a position of the alignment mark is measured in the window. A relationship between the measured position of the alignment mark and the position of the window is determined. The relationship is stored in a database and the substrate is aligned making use of the measured position of the alignment mark. The above may be repeated for a following aligning of the substrate, prior however to the measuring of the position of the alignment mark in the window, the position of the window is amended making use of the relationship between the measured position of the alignment mark and the position of the window as stored in the database for one or more preceding alignings.

Abstract: The invention relates to a method for positioning a substrate relative to a substrate table, is presented. When the substrate is positioned on the substrate table for a first time, a first relative position of the substrate with respect to the substrate table is determined. When the substrate is positioned on the substrate table a second subsequent time, a second relative position of the substrate with respect to the substrate table is determined and the position of the substrate table with respect to the substrate is adjusted based on the first and second relative positions, so that the substrate is positioned with respect to the substrate table substantially equally to the first relative position.

Abstract: An optical image is formed in a resist layer (5) by a number of subilluminations, in each of which an array of light valves (21 25) and a corresponding array (40) of light converging elements are used to form a pattern of spots in the resist layer according to a sub image Between the sub illuminations, the resist layer (5) is displaced relative to the arrays (21 25, 40) The scale of the optical image in the resist layer (5) is measured and this scale is compared with the scale of the image required to be written If there is a difference, the spacing between the light converging elements (43) is physically altered to adjust the substrate scale.

Abstract: An optical system, particularly an illumination system, of a microlithographic projection exposure apparatus contains at least one plane reflecting surface for folding the beam path. The at least one reflecting surface is arranged with respect to an optical axis of the optical system such that the intensity ratio between two mutually perpendicular polarization directions is at least substantially preserved for an axially parallel light ray deviated by the at least one reflecting surface. In accordance with a second aspect, the at least one reflecting surface is arranged such that a maximum effect on the polarization of the projection light is achieved, so as to be able to compensate for polarization dependencies which occur in other components of the illumination system.

Abstract: A rework station and a metrology device(s) are incorporated into a lithographic processing cell so that a faulty substrate can be reworked directly and reprocessed without, for example, an overhead involved in changing masks, etc.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern on a reticle onto an object to be exposed, a reference mark that serves as a reference for an alignment between the reticle and the object, a first fluid that has a refractive index of 1 or greater, and fills a space between at least part of the projection optical system and the object and a space between at least part of the projection optical system and the reference mark, and an alignment mechanism for aligning the object by using the projection optical system and the first fluid.

Abstract: An apparatus and method are used to form patterns on a substrate. The comprise a projection system, a patterning device, a low-pass filter, and a data manipulation device. The projection system projects a beam of radiation onto the substrate as an array of sub-beams of radiation. The patterning device modulates the sub-beams of radiation to substantially produce a requested dose pattern on the substrate. The low-pass filter operates on pattern data derived from the requested dose pattern in order to form a frequency-clipped target dose pattern that comprises only spatial frequency components below a selected threshold frequency. The data manipulation device produces a control signal comprising spot exposure intensities to be produced by the patterning device, based on a direct algebraic least-squares fit of the spot exposure intensities to the frequency-clipped target dose pattern. In various examples, filters for pattern sharpening, image log slope control, and/or CD biasing can also be used.

Abstract: A system and method utilize a birefringence inducer to induce or change birefringence of an optical element to change an index of refraction within the optical element to produce a polarization-retarded light beam that passes through the optical element. The optical element can include one or more optical plates or adjustable optical compensators. The birefringence inducer can apply external forces on the optical element, such as mechanical, electrical, magnetic, or acoustical forces. A linear polarizer polarizes the output beam from the optical element to produce a linear polarized modified intensity light beam with a desired intensity distribution. A control system for controlling the inducing of birefringence can include an intensity detector and controller, and can provide a control signal to the birefringence inducer.

Abstract: For irradiating a layer a radiation beam is directed and focussed to a spot on the layer, relative movement of the layer relative to the optical element is caused so that, successively, different portions of the layer are irradiated and an interspace between a surface of the optical element nearest to the layer is maintained. Furthermore, at least a portion of the interspace through which the radiation irradiates the spot on the layer is maintained filled with a liquid, the liquid being supplied via a supply conduit and flowing out of an outflow opening through a total projected cross-sectional passage area in a plane parallel to the layer. The outflow opening or a plurality of the outflow openings are positioned such that, seen in a direction perpendicular to the layer, the total cross-sectional area has a centre in the portion of the interspace through which the radiation irradiates the spot.

Abstract: A lithographic apparatus comprises an illumination system for providing a projection beam of radiation. A support structure is provided for supporting a patterning device, the patterning device serving to impart the projection beam with a pattern in its cross-section. A substrate table holds a substrate, while a projection system projects the patterned beam onto a target portion of the substrate. The illumination system comprises a field defining element arranged to define an illuminating field in the plane of the patterning device or in a plane conjugate thereto, the field being off-axis with respect to the optical axis of the illuminating system.

Abstract: The exposure system comprises a projection optical system that irradiates exposure light emitted from a mask onto a substrate, a first support member that supports the projection optical system, and a support structure that supports the first support member, wherein the support member supports the first support member at a position that is higher than the position at which the first support member supports the projection optical system.

Abstract: An exposure apparatus generates an interlock signal to stop an exposure process when defocus is detected in real time. Leveling data for at least one wafer, and a predetermined threshold value are stored in a memory of the exposure apparatus. A value indicative of the defocus is calculated from the leveling data. An interlock signal is generated if the result of comparing the defocus value and the threshold value reveals that the focus of a lens of the exposure apparatus is outside an acceptable range.

Abstract: A load lock for a lithographic apparatus is arranged to transfer an object, like a substrate, into and from the lithographic apparatus. The load lock outer wall defining at least part of a load lock volume accommodating a support unit for supporting the object when in the load lock. The load lock also has a temperature conditioned structure to control the temperature of the object to a desired temperature at least before the object is transferred from the load lock towards the lithographic projection apparatus.

Abstract: Apparatus and methods for compensating for the movement of a substrate in a lithographic apparatus during a pulse of radiation include providing an optical structure configured to move a patterned projection beam incident on the substrate in synchronism with the substrate.

Abstract: An exposure apparatus which exposes a substrate to a pattern. The apparatus includes a channel which causes pure water to flow as a coolant, a temperature adjustment unit which adjusts a temperature of the coolant flowing in the channel, and a UV sterilization unit which performs UV sterilization processing for the coolant flowing in the channel.

Abstract: A lithographic apparatus includes a patterning device that patterns a projected beam. The patterning device includes an array of cells that contain a polar fluid, a non-polar fluid, and an electrode. A potential difference across the electrode and the polar fluid causes displacement of the non-polar fluid. Based on a difference in refractive index between the polar fluid and the non-polar fluid, a beam of light which passes through the cell will have its phase changed in dependence on the relative thickness on the polar and non-polar fluids and on their refractive indices.

Abstract: A lithographic apparatus in which alignment marks on the substrate are inspected during the exposure of the substrate to optimize the exposure conditions.