Patents Examined by Anthony Dinkins
  • Patent number: 6886995
    Abstract: An electro-optical interface with a package base having an electrical connection configuration suitable for connecting to a source of electrical signals. A semiconductor optical signal source is provided mounted to the base and having a second or higher order grating in the cavity. The signal source is operatively connected to the package base whereby the electronic signals may be converted into optical signals. A waveguide is positioned adjacent to the signal source to couple the optical signal to the waveguide. The cavity is sized, shaped and positioned so that a radiation field for the cavity is not a mode discrimination mechanism wherein any back reflections into the cavity will affect a coupling coefficient to the radiation field without significantly adversely affecting the output signal quality.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: May 3, 2005
    Assignee: Photonami, Inc.
    Inventors: Tom Haslett, Wei Li, Seyed Mostafa Sadeghi, Ali M. Shams-Zadeh-Amiri
  • Patent number: 6885546
    Abstract: A metal foil having a surface roughened by etching, which is made of an alloy having an earth-acid metal, preferably niobium, as a main component. A capacitor having a pair of electrodes and a dielectric material interposed between said pair of electrodes, wherein at least one of the electrodes is made of the above-mentioned metal foil, exhibits good high-frequency characteristics, and can be a small-size capacitor having a large capacitance.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: April 26, 2005
    Assignee: Showa Denko K.K.
    Inventor: Kazumi Naito
  • Patent number: 6885542
    Abstract: A capacitor is formed with a substantially concave shape and having optional folded or convoluted surfaces. The concave shape optimizes surface area within a small volume and thereby enables the capacitor to hold a significant charge so as to assist in increased miniaturization efforts in the microelectronic field. The capacitor is fabricated in microelectronic fashion consistent with a dense DRAM array. Methods of fabrication include stack building with storage nodes that extend above a semiconductor substrate surface.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: April 26, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Zhiqiang Wu, Kunal Parekh, Li Li
  • Patent number: 6885547
    Abstract: A dielectric oxide film-having anode foil and a cathode foil put opposite to each other via a separator therebetween are coiled up to construct a capacitor device. In this, the separator is coated with an electroconductive polymer formed through chemical oxidation polymerization of a polymerizing monomer in a solution that contains at least a non-transition metal-based oxidizing agent and an organic acid compound. Even when the electrolytic capacitor with the capacitor device is driven in a high-humidity atmosphere and a large amount of water penetrates into it, the capacitor is free from a trouble of dedoping, and therefore keeps its high voltage-proofness and leak current stability. The electrolytic capacitor is resistant to heat and its ESR is low in a high-frequency region.
    Type: Grant
    Filed: March 30, 2004
    Date of Patent: April 26, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yukihiro Nitta, Hiroki Kusayanagi, Hiroyuki Matsuura
  • Patent number: 6885541
    Abstract: A capacitor comprising: a thin film laminate including a plurality of dielectric thin films and a plurality of electrode conductor thin films laminated alternately; and first kind terminals and second kind terminals formed over a first main surface of said thin film laminate and isolated from each other in a DC current, wherein a first kind electrode conductor thin films electrically connecting with said first kind terminals and a second kind electrode conductor thin films electrically connecting with said second kind terminals are so alternately laminated in a laminate direction as are separated by said dielectric thin films, and a first dielectric thin film, an other kind electrode conductor thin film and a second dielectric thin film are laminated in this order between one same kind electrode conductor thin film and other same kind electrode conductor thin film adjoining in said laminate direction, and first through holes, second through holes and the like are defined herein.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: April 26, 2005
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Jun Otsuka, Manabu Sato
  • Patent number: 6885548
    Abstract: Implantable medical devices (IMDS) and their various components, including flat electrolytic capacitors for same, and methods of making and using same, particularly an improved electrolytic capacitor. Methods and apparatus for securely mechanically and electrically attaching anode sheets of multi-sheet anode layers of electrolytic capacitors together in a simple manner that does not without unduly damage adjacent or exposed oxide layers are disclosed. The side-by-side stacked multiple anode sheets of a multi-sheet anode layer are joined together by precision cold welding the anode sheets together wherein deformation of the anode sheets is effected by simultaneously driving one or more set of first and second axially aligned cold weld pins into respective first and second stack sides of the stacked anode sheets to substantially equal cold weld depths.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: April 26, 2005
    Assignee: Medtronic, Inc.
    Inventor: Charles J. Nyberg
  • Patent number: 6882518
    Abstract: To provide a capacitor device that can be made lighter in weight, thin shaped, and miniaturized, which has a plurality of conductive pattern electrodes 18 and 22 electrically separated by a separation groove 19; a capacitor element 15 including an anode lead 16 fixed to the one conductive pattern electrode 18 and a cathode lead 17 fixed to the other conductive pattern electrode 22; an insulating resin 24 for covering the capacitor element 15 and a part working as the conductive pattern electrodes 18 and 22 except for a lower face of the conductive pattern electrodes 18 and 22, and for integrally supporting the conductive pattern electrode and the capacitor element.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: April 19, 2005
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Hiroyuki Tamura
  • Patent number: 6882522
    Abstract: The present invention relates to a method for producing a niobium-oxide solid electrolytic capacitor having an anode being at least one member selected from niobium monoxide, niobium and an alloy mainly comprising niobium, or a mixture of niobium monoxide with niobium or an alloy mainly comprising niobium, which capacitor formed by the electrolytic oxidation (electrochemical formation) of the anode; and the method including sequentially repeating twice or more a step of exposing a dielectric layer to a temperature to 1,000° C. before formation of a cathode and a step of re-electrochemically forming the dielectric layer. The niobium solid electrolytic capacitor obtained by the present invention improved in the leakage current value after mounting and excellent in reliability.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: April 19, 2005
    Assignee: Showa Denko K.K.
    Inventors: Kazumi Naito, Isao Kabe
  • Patent number: 6882521
    Abstract: A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: April 19, 2005
    Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Makoto Tsutsui, Toshihisa Nagasawa
  • Patent number: 6876540
    Abstract: An electrolyte includes (a) 70-99 wt. % of ethylene glycol, and (b) 1-2 wt. % of a substance which is selected from a group that includes the following carboxylic acids and carboxylic acid salts: substituted cinnamic acids, ammonium cinnamate, ammonium ?-methyl cinnamate, and ammonium trans-4-phenyl-3-butenoate. The electrolyte may be used in an aluminum electrolytic capacitor.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: April 5, 2005
    Assignee: EPCOS AG
    Inventor: Thomas Ebel
  • Patent number: 6876537
    Abstract: A ceramic electronic component includes two or more electrodes 5 and 6 spaced at a predetermined distance from each other, between which a potential difference is produced in operation and a void 9 that penetrates to the outside is provided. In the void 9, a water repellent film 10 is formed. This prevents water vapor from being absorbed in the void 9 connecting the electrodes 5 and 6, and thereby preventing the formation of a conductive path and the occurrence of ion migration.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: April 5, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Norihisa Takahara, Emiko Igaki, Masakazu Tanahashi, Takafumi Moriyasu, Rui Nakao, Tomoyuki Washizaki, Yoshiaki Fukui
  • Patent number: 6875925
    Abstract: An insulating sheet is used in an electronic apparatus including a power supply board, a housing in which the power supply board is disposed, and a conductive bottom plate attached to the housing. The insulating sheet is disposed between the power supply board and the bottom plate. The insulating sheet includes an opening portion which allows air flowing from an air inlet to pass therethrough; and a guide portion erected in order to guide a harness disposed in the housing.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: April 5, 2005
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Hideki Yamamoto
  • Patent number: 6876542
    Abstract: A nitrogen containing metal powder wicth a large specific surface area, and containing a suitable quantity of nitrogen dispersed uniformly within the metal is produced with good productivity, and provides a solid electrolytic capacitor with a high capacitance, minimal leakage current, and excellent long term reliability. This nitrogen containing metal powder has a ratio W/S between the nitrogen content W [ppm] of the powder, and the specific surface area S [m2/g], as measured by a BET method, that falls within a range from 500 to 3000. This type of powder can be produced by a process in which a metal salt containing the metal is reacted with a reducing agent and undergoes reduction within a diluent salt, thereby generating the metal, wherein a nitrogen containing gas is introduced into the space contacting the reaction melt comprising the metal salt, the reducing agent and the diluent salt, thereby generating the metal and incorporating the nitrogen within the metal.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: April 5, 2005
    Assignee: Cabot Supermetals K.K.
    Inventors: Yukio Oda, Isayuki Horio
  • Patent number: 6873514
    Abstract: An integrated solenoid system including a single housing containing a solenoid, a controller and one or more electrical connections. The controller includes temperature compensating means and/or voltage compensating means thereby providing predetermined, substantially constant currents to said solenoid. The housing includes an integral two-part end cover.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: March 29, 2005
    Assignee: Trombetta, LLC
    Inventors: Dennis A. Maller, Todd McMahon
  • Patent number: 6873518
    Abstract: A dielectric oxide film is formed on the surface of a valve metal plate formed of aluminum and a conductive polymer layer is provided so as to cover the valve metal plate and the dielectric oxide film. The conductive polymer layer is formed of polyaniline having para-toluenesulfonic acid as a dopant. A conductive carbon paste layer and a silver paste layer are provided at the outer side of the conductive polymer layer and a metal plate, comprising a copper foil, is overlapped onto the silver paste layer. Anode lead terminals are connected to the ends of the valve metal plate and the respective end parts of the metal plate are arranged as cathode lead terminals. A shield strip line device, which is low in impedance, especially in high-frequency ranges of 100 MHz or more, and is favorably adapted to high speed and high frequencies, mainly for use as a bypass device for a noise filter or as a decoupling device, is thus obtained.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: March 29, 2005
    Assignee: NEC Corporation
    Inventors: Koichiro Masuda, Hirokazu Tohya, Masaharu Satoh
  • Patent number: 6872892
    Abstract: A molded plastic fence insulator including a pair of spaced apart sidewalls connected by a connecting wall, aligned grooves defined across the connecting wall, and retention members associated with the aligned grooves and configured for receiving the wires underneath a portion thereof.
    Type: Grant
    Filed: October 17, 2003
    Date of Patent: March 29, 2005
    Assignee: Fi-Shock, Inc.
    Inventor: Brett R. Burdick
  • Patent number: 6870725
    Abstract: An electric double layer capacitor, including at least one basic cell, an electrode plate, and an outer package which covers the basic cell and the electrode plate in a decompression state. The basic cell may be laminated in its thickness direction to form a layered cell and includes a separator, a pair of polarized electrodes disposed so as to sandwich the separator, a pair of collectors disposed so as to sandwich the polarized electrodes, and a gasket disposed between the pair of collectors so as to surround the pair of polarized electrodes. The electrode plate body is attached to each of the collectors located at the outermost side in a laminated direction of the layered cell. A sealing material having a higher gas barrier property than the collectors is disposed so as to seal an interface between the collectors and the electrode plate in the outer package.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: March 22, 2005
    Assignee: NEC Tokin Corporation
    Inventors: Koji Sakata, Kazuya Mimura, Yutaka Nakazawa, Satoshi Abe
  • Patent number: 6867365
    Abstract: A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: March 15, 2005
    Inventor: Torsten Neuhaeuser
  • Patent number: 6865067
    Abstract: In a structure of a radio frequency (RF) variable capacitor having a variable range of capacitance between a first minimum value and a first maximum value, and a method of manufacturing the structure, the structure includes a first capacitor, which has a variable range of capacitance between a second minimum value greater than the first minimum value and a second maximum value greater than the first maximum value, and a second capacitor, which is connected in series to the first capacitor and has a capacitance of a fixed value. By the structure and method, a quality factor of a radio frequency (RF) variable capacitor may be increased without adding complex processing steps.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: March 8, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-yoon Jeon, Chun-deok Suh
  • Patent number: 6865069
    Abstract: The invention relates to a niobium powder capable of providing a capacitor having small amounts of leakage current, wherein the average nitrogen concentration in the layer of 50 to 200 nm from the surface to 0.29 to 4% by mass and preferably controlling that in the depth within 50 nm from the surface to 0.19 to 1% by mass, the sintered body, the formed body and the capacitor using the same.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: March 8, 2005
    Assignee: Showa Denko K.K.
    Inventors: Isao Kabe, Kazumi Naito