Abstract: A connector position assurance (CPA) member for assuring the engagement of a female housing with a male housing. The CPA member includes arms designed to stably and securely fit with apertures formed by the female housing. Also, the female housing includes a connector latch which engages with the CPA member and which used to securely hold together the female housing and the male housing.

Abstract: Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.

Abstract: A manufacturing method of transformer circuit board includes following steps: plate stamping, forming a plurality of metal plates with a stamping mold; primary layering, layering the metal plates that are in alignment with each other between two outer insulation layers, with an inner insulation layer disposed between the two metal plates; primary pressing, hot pressing the metal plates to fix the metal plates between the two outer insulation layers; secondary layering, layering another metal plate on the outer side of the two outer insulation layers, respectively, corresponding to the positions of the previously layered metal plates; secondary pressing, hot pressing the metal plates on the outer side of the outer insulation layers, and printing to form a solder mask layer on the outer insulation layers. Finally, cutting to form a transformer circuit board with low leakage inductance and high EMI shield.

Abstract: Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.

Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.

Abstract: A method for producing an electronic sensor module includes applying first soldering material onto electrical soldering pads of a printed circuit board element and/or electrical soldering pads of a printed circuit board element contact side of a sensor carrier, arranging the sensor carrier with the electrical soldering pads of the printed circuit board element contact side on the electrical soldering pads of the printed circuit board element to produce electrical connections between connecting lines and the printed circuit board element, applying second soldering material onto electrical connecting elements of a sensor element and/or soldering pads of the sensor receptacle, arranging the sensor element in the sensor receptacle such that the second soldering material produces electrical connections between the electrical connecting elements of the sensor element and the soldering pads of the sensor receptacle, and reflow-soldering the first soldering material and the second soldering material in a joint reflow

Abstract: An apparatus (100) for installing at least one electrical contact (152) into a connector housing (150) comprises a base (110) configured to fixedly support the connector housing (150), an alignment guide (122), extending from the base (110) and having a central axis (164), and a carrier (124), translatably and pivotally coupled with the alignment guide (122). With the connector housing (150) fixedly supported by the base (110), the alignment guide (122) is configured to be parallel to an insertion axis (160) of a socket (154) of the connector housing (150), and the carrier (124) is movable parallel to the insertion axis (160). The apparatus (100) additionally comprises a tool holder (132), coupled to the carrier (124). The tool holder (132) has a working axis (162), only one degree of freedom relative to the carrier (124), and only three degrees of freedom relative to the base (110).

Abstract: A device casing includes a wall having a metallic substrate and electrical connection of a feedthrough that includes a metal through-element made at least in a zone of isolation of the area of the feedthrough from the substrate material, in the form of an islet of closed contour, physically and electrically isolated from the substrate. An interface for coupling the through-element to the substrate provides the mechanical securing of the through-element to the substrate and the electrical isolation thereof and includes a peripheral lateral layer made of an electrically isolating material that surrounds the through-element over the whole periphery thereof and extends transversally through the thickness of the thinned area of the substrate. The substrate, the through-element and the lateral layer form a monolithically integrated unit, and the lateral layer provides essentially and directly both the mechanical securing and the electrical isolation between through-element and substrate.

Abstract: A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

Abstract: A substrate working device includes a working unit that performs work on a substrate on which a component is mounted, an imager capable of imaging a correction mark for position correction, and a mark projector that projects the correction mark. The correction mark includes a first correction mark and a second correction mark. The mark projector projects the first correction mark to a first height and projects the second correction mark to a second height.

Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Abstract: An electronic component is disclosed. In an embodiment, an electronic component includes at least one NTC element and at least two electrically conductive contact elements, wherein the NTC element is electrically conductively connected to a respective contact element via a connection material, and wherein a coefficient of thermal expansion of the contact elements is adapted to a coefficient thermal expansion of the NTC element.

Abstract: An electrical connector comprises a housing and a terminal module. The housing has a top portion, a bottom portion and two side portions connecting the top portion and the bottom portion. The top portion, the bottom portion and the two side portions form an accommodating chamber and the terminal module is accommodated in the accommodating chamber. The two side portions have positioning posts preventing horizontal displacement of the housing relative to the terminal module, and the top portion and the bottom portion prevent vertical displacement of the housing relative to the terminal module. Methods of assembling the electrical connector are also provided.

Abstract: An object of the present invention is to provide a method for accurately forming an antenna substrate as well as an antenna substrate with wiring line and electrode by a coating method. One aspect of the present invention provides a method for producing an antenna substrate with wiring line and electrode including the steps of: (1) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate; (2-A) processing the coating film into a pattern corresponding to an antenna by photolithography; (2-B) processing the coating film into a pattern corresponding to a wiring line; (2-C) processing the coating film into a pattern corresponding to an electrode; (3-A) curing the pattern corresponding to an antenna into an antenna; (3-B) curing the pattern corresponding to a wiring line into a wiring line; and (3-C) curing the pattern corresponding to an electrode into an electrode.

Abstract: The invention relates to adjusting at least one of installed building service sensors (10) of a building service system. A sensor coverage area of at least one sensor (10) is adjusted based on information on a position of the installed sensor (10) relative to at least one other sensor (10). For example, to determine the position of the sensor (10) relative to said at least one other sensor (10), each sensor (10) establishes a wireless communication between said sensor (10) and at least one other sensor (10) via a wireless communication means (34) of the sensor (10). For example, information on the positions of the installed sensors (10) is used to assign to each sensor (10) at least one of installed building service supply devices (12) of the system.

Abstract: A method of determining disposition of a component supply unit including a component reel obtained by winding a component accommodating tape accommodating a component and a tape feeder that supplies the component accommodating tape drawn out from the component reel, for determining component supply unit disposition in which the component supply unit is disposed in a holding unit that holds the component supply unit, includes acquiring component supply unit information including information on the number of the component reel and constraint condition information including information related to a layout that is capable of being selected when the component supply unit is disposed in the holding unit, and determining the component supply unit disposition, based on the constraint condition information and the information on the number of the component reel.

Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Abstract: An equipment element maintenance management method for managing a maintenance operation for an equipment element that is attached to manufacturing equipment for manufacturing a product includes: acquiring operation history information of the manufacturing equipment at a predetermined timing; analyzing a tendency of a state of the equipment element based on the acquired operation history information; performing the maintenance operation for the equipment element of which the state is worse than a predetermined state; creating maintenance result information which is a result of the maintenance operation; and creating a repair operation instruction for performing an instruction of a repair operation for the equipment element of which the state after the maintenance operation is not more improved than the predetermined state based on the maintenance result information.

Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.

Abstract: A method includes a placing step in which an end portion of a covered electric wire is placed on an inner surface of a barrel portion along an axial direction such that a tip of the aluminum core wire overlaps a second portion of a seal member attached close to a terminal portion, and a crimping step in which the barrel portion is wound around and crimped to the end portion, thereby fixing the crimp terminal to the end portion and sealing, with the seal member, a space between the inner barrel piece and the outer barrel piece, an opening of the barrel portion formed cylindrical located on a side of the terminal portion, and a space between the covered portion and the barrel portion.