Abstract: A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

Abstract: A laminate curtain can suppress electromagnetic radiation leakage from an electronic appliance, as well as assist in managing cables interconnected to the electronic appliance. More specifically, a laminate curtain can include a conductive elastomer panel that absorbs spurious electromagnetic radiation generated by the electronic appliance, a conductive adhesive film disposed along one side of the conductive elastomer panel, and a conductive support frame affixed to the conductive adhesive film. The laminate curtain can be installed within a mounting frame, which secures the laminate curtain to the electronic appliance. Electromagnetic radiation that is absorbed by the conductive elastomer panel can travel to the electronic appliance via the conductive adhesive film, the conductive support frame, and the mounting frame. Thus, the conductive elastomer panel can be used to form a ground plane that catches and shunts the spurious electromagnetic radiation to the electronic appliance, which is grounded.

Abstract: A method of providing a single structure multiple mode antenna having a unitary body construction is described. The antenna is preferably constructed having a first inductor coil portion that is electrically connected in series with a second inductor coil portion. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals facilitates connection of the electrical connections having numerous electrical connection configurations and enables the antenna to be selectively tuned to various frequencies and frequency bands.

Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

Abstract: A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers.

Abstract: One aspect relates to a method of producing a sleeve for a ring electrode for electrophysiological and neuro-medical applications from a biocompatible metallic tape. Repetitive structures are punched into the tape and each includes at least one surface that is connected by at least one fin to at least one external strip. The at least one external strip connects the repetitive structures to each other on the margin. A sleeve mold is formed from a multiple of the repetitive structures through multiple reforming steps by a reforming technique. The sleeve mold is punched off the such that the sleeve is formed with a first tube-shaped region with a larger diameter and a second tube-shaped region with a smaller diameter. The first region with the larger diameter has a larger external diameter and internal diameter than the second region with the smaller diameter, and the two regions are connected.

Abstract: Methods of testing and installing fire-resistant coaxial cables are described. The dielectric between the coax cable's central conductor and outer coaxial conductor ceramify under high heat, such as those specified by common fire test standards (e.g., 1850° F./1010° C. for two hours). The dielectric can be composed of ceramifiable silicone rubber, such as that having a polysiloxane matrix with inorganic flux and refractory particles. Because thick layers of uncured ceramifiable silicone rubber deform under their own weight when curing, multiple thinner layers are coated and serially cured in order to build up the required thickness. A sacrificial sheath mold is used to hold each layer of uncured ceramifiable silicone rubber in place around the central conductor while curing. The outer conductor can be a metal foil, metal braid, and/or corrugated metal.

Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

Abstract: A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.

Abstract: During mounting of an upper component on a lower component, after mounting the lower component on a board, the Z-axis position of a suction nozzle tip is detected during mounting of the lower component on the board and memorized as a lower component height, and when mounting the upper component PU, the suction nozzle is lowered at relatively high speed until reaching a specified position that is a distance above the lower component height, and the suction nozzle is lowered at a speed that is slower than the speed after arriving at the specified position until contact with the lower component.

Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.

Abstract: A method of manufacturing a curved display panel, includes: polishing a portion of the flat display panel that is to form a protrusion, which protrudes in order to protect a portion, to which a drive circuit board is attached, through mechanical polishing so as to have a preset thickness; installing a sealing member, which protects the flat display panel, polished in the polishing, from an etchant by surrounding both the portion that is to form the protrusion and the drive circuit board; and etching an entirety of both surfaces of the flat display panel using the etchant, excluding a portion on which the sealing member is provided, so that the flat display panel, having the sealing member installed in the installing, has a thickness smaller than a thickness of the protrusion.

Abstract: A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.

Abstract: This disclosure provides a package substrate, a flip-chip package circuit, and their fabrication methods. The package substrate includes: a first wiring layer having a first dielectric material layer and a first metal wire protruding from the first dielectric material layer; a conductive pillar layer formed on the first wiring layer and including a molding compound layer, a second dielectric material layer formed on the molding compound layer, and a metal pillar connected to the first metal wire; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer.

Abstract: A method of restoring a suspension of a hard disk drive includes detaching a slider, which is mounted on a tongue portion of the suspension via an adhesive, from the suspension, measuring a thickness of the adhesive in a cleaning area of the tongue portion, specifying a first residual area in which the thickness of the adhesive exceeds a threshold value, irradiating a first irradiation area including the first residual area locally with a first laser beam, and irradiating the cleaning area entirely with a second laser beam.

Abstract: The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Abstract: A float connector for interconnecting printed circuit boards that has a contact assembly including a contacts and a holder and each of the contacts has opposite first and second contact ends for electrically connecting to the boards. A first guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the first contact ends. A second guide member is slidably and flexibly coupled to the contact assembly and has openings corresponding to the second contact ends. A biasing member biases the guide members away from one another to an open position. Axial float of the contact assembly is provided between the first and second guide members to compensate for axial misalignment between the first and second printed circuit boards. Radial float of the contact assembly is provided between the first and second guide members to compensate for radial misalignment between the boards.

Abstract: A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.

Abstract: A vehicle interior component includes: a body including a through hole, a first surface opposed to a vehicle body panel, and a second surface opposite from the first surface; and a wire holder holding an end section of an electric wire connected with a wire-side connector. The wire holder includes: a base section extending from a first section of a hole edge of the through hole toward an inner side of the through hole and having resilience; a free end section including an end surface opposed to a second section of the hole edge; and a meddle section. The base section, the free end section, the middle section, and the first section define a space with a dimension greater than a diameter of the end section and less than the wire-side connector to hold the end section in the space and the wire-side connector closer to the second surface.

Abstract: A mineral-insulated cable has a non-circular cross-sectional shape that does not allow the internal wires to twist or change alignment during manufacturing of the cable.