Patents Examined by Azm A Parvez
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Patent number: 10830966Abstract: An optical connector manufacturing method includes inserting a protrusion of a fixing jig into a positioning hole in an end face of a cladding of an optical fiber and restraining rotation of the optical fiber, the positioning hole extending in an optical axis direction, the optical fiber being inserted in a through hole in a connector ferrule and protruding from an end face of the connector ferrule; and securing the optical fiber to the connector ferrule, with the protrusion of the fixing jig inserted in the positioning hole.Type: GrantFiled: March 14, 2018Date of Patent: November 10, 2020Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Naoki Matsushita, Takuji Nagashima, Tetsu Morishima
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Patent number: 10834859Abstract: Provided is a component mounting device including: an XY robot, a Z-axis slider attached to an X-axis slider of the XY robot so as to be movable in the Z-axis direction, a head loaded on the Z-axis slider, and a nozzle attached to head 30 so as to be movable in the Z-axis direction. With the component mounting device, a component supplied from a component supply unit is picked up by the nozzle, transported to a specified position on a board, and mounted. A flexible section with an external appearance with a U shape that is expandable and contractible in the X-axis direction and the Z-axis direction is arranged to the rear of a Y-axis slider. A portion of an X-axis wiring tube and a portion of a Z-axis wiring tube are bundled together in the flexible section.Type: GrantFiled: August 7, 2015Date of Patent: November 10, 2020Assignee: FUJI CORPORATIONInventors: Hidetoshi Ito, Mizuho Yamamoto
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Patent number: 10827661Abstract: The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.Type: GrantFiled: August 10, 2015Date of Patent: November 3, 2020Assignee: KOH YOUNG TECHNOLOGY INC.Inventor: Woo Young Lim
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Patent number: 10804776Abstract: An injection molding device includes: a lower die that supports a rotor core; an intermediate die including a magnetizing mechanism; and an upper die including an injection die having a gate formed therein through which a molten bonded-magnet material supplied from a supply source is injected into a magnet insertion hole in the rotor core. The injection die has a cylindrical protruding portion at an end surface of which the gate is open. In the protruding portion, a magnetic-flux applying member containing ferromagnetic material is embedded with its side surface exposed at an outer peripheral surface of the protruding portion. The magnetizing mechanism is formed in an annular shape that can accommodate, inside its inner periphery, the rotor core and a distal end portion of the protruding portion by disposing yokes and permanent magnets alternately in the circumferential direction. Magnetic-path surfaces of the yokes radially face the side surface.Type: GrantFiled: April 12, 2018Date of Patent: October 13, 2020Assignee: JTEKT CORPORATIONInventors: Koji Tachi, Hiroshi Yoshikawa, Naotake Kanda, Taiki Takeuchi, Shohei Ogi
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Patent number: 10797571Abstract: A coil manufacturing device for manufacturing a coil by rotating a winding core and winding a wire around the rotating winding core, the coil manufacturing device includes a recess formed in the winding core, the recess being configured to suspend the wire wound around the winding core in the recess; and a wire bundling device configured to bundle the wire suspended in the recess.Type: GrantFiled: August 5, 2015Date of Patent: October 6, 2020Assignee: NITTOKU CO., LTD.Inventors: Takayuki Sato, Takayuki Kurosawa
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Patent number: 10784129Abstract: A mounting device in which a loading distance separating adjacent characteristic components are lined up side by side is shorter than separation distance between suction nozzle and mark camera, processing to image characteristic component by mark camera and recognize the position of characteristic component is performed consecutively or in one batch. With the mounting device, because mounting head is moved a loading distance that is shorter than the separation distance between suction nozzle and mark camera and image processing is performed consecutively or in one batch, the movement distance of mounting head is shorter.Type: GrantFiled: March 23, 2015Date of Patent: September 22, 2020Assignee: FUJI CORPORATIONInventors: Kohei Sugihara, Hidenori Goto
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Patent number: 10779413Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatioType: GrantFiled: December 12, 2014Date of Patent: September 15, 2020Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
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Patent number: 10776553Abstract: The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.Type: GrantFiled: June 11, 2018Date of Patent: September 15, 2020Assignee: CISCO TECHNOLOGY, INC.Inventors: Lin Shen, Yongming Xiong, Shahbaz Mahmood, Maurilio De Nicolo
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Patent number: 10775855Abstract: A circuit card assembly release tool is disclosed. The tool includes a body and two flanges extending outward from the body at an end of the body. The tool is structured and arranged such that the two flanges are adapted to simultaneously apply a force to two ejectors that are pivotally connected to a seated circuit card assembly when the tool is urged in a direction relative to the seated circuit card assembly.Type: GrantFiled: August 11, 2015Date of Patent: September 15, 2020Assignee: Lockheed Martin CorporationInventor: Steve J. V. Pacquing
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Patent number: 10764992Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.Type: GrantFiled: July 26, 2019Date of Patent: September 1, 2020Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Yong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
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Patent number: 10757816Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.Type: GrantFiled: June 17, 2016Date of Patent: August 25, 2020Assignee: VLT, Inc.Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
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Patent number: 10756410Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.Type: GrantFiled: November 13, 2017Date of Patent: August 25, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen
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Patent number: 10750643Abstract: A method of manufacturing a chassis that cools thermal energy generating components of an information handling system (IHS) includes: forming an enclosure with a chassis that has a base wall for provisioning a thermal energy generating component; forming one or more stiffeners each having one or more air channels formed transversely through for directing air proximate to the base wall; attaching the one or more stiffeners laterally across the base wall; and attaching a planar member that is horizontally on top of the one or more stiffeners for engaging one or more forward compute components on top of the planar member that substantially block air flow above the planar member to the thermal energy generating component. The one or more air channels eliminate thermal shadowing caused by thermal energy generating components provisioned in a rear area of the chassis.Type: GrantFiled: July 3, 2017Date of Patent: August 18, 2020Assignee: Dell Products, L.P.Inventors: Haesung Kwon, Austin Michael Shelnutt, Walter Carver
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Patent number: 10743422Abstract: A method of embedding a component in a component carrier, wherein the method comprises providing a cured core with a recess on an electrically conductive foil, and mounting the component in the recess on the foil.Type: GrantFiled: September 27, 2017Date of Patent: August 11, 2020Assignee: AT&S Austria Technologie & Systemtechnik AktiengesellschaftInventor: Armin Wiedenhofer
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Patent number: 10723112Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.Type: GrantFiled: May 23, 2012Date of Patent: July 28, 2020Assignee: National University of SingaporeInventors: Lay-Lay Chua, Peter Ho, Rui-Qi Png, Fong Yu Kam, Jie Song, Loke-Yuen Wong, Jing-Mei Zhuo, Kian Ping Loh, Geok Kieng Lim
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Patent number: 10729012Abstract: Methods, systems, and devices for buried lines and related fabrication techniques are described. An electronic device (e.g., an integrated circuit) may include multiple buried lines at multiple layers of a stack. For example, a first layer of the stack may include multiple buried lines formed based on a pattern of vias formed at an upper layer of the stack. The pattern of vias may be formed in a wide variety of spatial configurations, and may allow for conductive material to be deposited at a buried target layer. In some cases, buried lines may be formed at multiple layers of the stack concurrently.Type: GrantFiled: April 24, 2018Date of Patent: July 28, 2020Assignee: Micron Technology, Inc.Inventors: Hernan A. Castro, Stephen W. Russell, Stephen H. Tang
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Patent number: 10720879Abstract: A junction box is affixed to, and electrically coupled with, a solar panel. The junction box is configured to releasably engage and disengage accessory modules, thereby allowing accessory modules to be replaced or exchanged easily. Accessory modules are electrically coupled with other accessory modules in the solar panel string. The furthest downstream accessory module is connected to a wire harness, which is connected to a central combiner box.Type: GrantFiled: November 17, 2014Date of Patent: July 21, 2020Assignee: Shoals Technologies Group, LLCInventor: Dean Solon
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Patent number: 10714363Abstract: Embodiments relate to placing of semiconductor devices on a target substrate using a pick and place head (PPH) having a cross-section of a polygon shape and pick-up surfaces. The pick-up surfaces of the PPH are aligned with a carrier substrate mounted with the semiconductor devices, which may be light emitting diodes (LEDs). The PPH is moved toward one or more first semiconductor devices on the carrier substrate to pick up the one or more first semiconductor devices with a first pick-up surface of the PPH. The PPH is rotated to pick up one or more semiconductor devices dies with a second pick-up surface of the PPH. The one or more first semiconductor devices attached to the first pick-up surface and the one or more second semiconductor devices attached to the second pick-up surface are placed on a target substrate.Type: GrantFiled: December 6, 2016Date of Patent: July 14, 2020Assignee: Facebook Technologies, LLCInventors: Pooya Saketi, Patrick Joseph Hughes
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Patent number: 10685949Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.Type: GrantFiled: March 6, 2017Date of Patent: June 16, 2020Assignee: Intel CorporationInventors: Aleksandar Aleksov, Mauro Kobrinsky, Johanna Swan, Rajendra C. Dias
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Patent number: 10679966Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.Type: GrantFiled: November 20, 2017Date of Patent: June 9, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: David Danovitch, Yolande Elodie Nguena Dongmo, Richard Langlois