Abstract: An assembly system for assembling an optical die to an optical substrate includes test equipment configured to test optical couplers formed between the optical die and the optical substrate. The assembly system is configured to adjust an alignment of the optical die relative to the optical substrate until the optical couplers meet a performance metric. After the performance metric is met the optical die is permanently attached to the optical substrate.

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.

Abstract: A method for manufacturing a shaping structure having a generally helical profile and configured to support electrodes for delivering electric energy into a cylindrical lumen of a patient. The method comprises providing a mandrel with a circular cylindrical shape and forming a first hole in the mandrel along the elongate axis, such that opposing ends of a bore of the first hole emerge at the proximal end and at the distal end; forming a second hole in the mandrel to extend from the curved surface to connect with the first hole; wrapping a metal wire around the mandrel; and inserting opposing ends of the metal wire into the second and the third hole respectively, and threading the opposing ends of the metal wire until they emerge from the opposing ends of the bore of the first hole; finally, heating the mandrel and the wire.

Abstract: A micro device transfer head includes a base arm, a first side arm, a second side arm, and an isolation layer. The first side arm, including one or multiple first electrodes, is disposed on a first surface of the base arm and located on a first end of the base arm. The second side arm, including one or multiple second electrodes, is disposed on the first surface of the base arm and located on a second end of the base arm. The isolation later is disposed on the first surface of the base arm and covers the surface of the first side arm and the second side arm.

Abstract: Methods for producing a transparent conductive film and transparent conductive pattern having superior in-plane uniformity of resistance, by a printing method of slit coating or roll coating of metal nanowire ink. The methods include applying a metal nanowire ink containing metal nanowires, a binder resin containing more than 50 mol % monomer units derived from N-vinylacetamide, and a solvent, to at least one surface of a transparent resin film and drying to form a transparent conductive layer, the application of the metal nanowire ink to the transparent resin film being application by slit coating or roll coating performed using a transparent resin film and metal nanowire ink with which the advancing angle (?a) of the dynamic contact angle of the metal nanowire ink relative to the transparent resin film satisfies 10.0°<?a?25.0°, and the difference (?a??r) between the advancing angle (?a) and the receding angle (?r) is 10.0° or higher.

Abstract: Contact system for producing an electrically conductive contact between an aluminum conductor (3) and a contact component (2). A housing (1) is provided, as well as a contact component (2) having a shearing-off section (13) and a tapered compression segment (14), where the housing (1) has an insertion volume (4) for the aluminum conductor (3) and an insertion volume (5) for the contact component (2) and the two insertion volumes (4, 5) overlap within the housing (1) and form a common overlapping volume (8) so as to enable, when the aluminum conductor (3) has been pushed into the insertion volume (4), for the aluminum conductor (3), the severing/shearing-off and cold welding of the aluminum conductor (3) with the contact component (2) by means of the contact component (2).

Abstract: A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

Abstract: An electrical connector for a composite core conductor and a method of controlling crimping thereof includes a coupling portion and a tubular portion extending from the coupling portion. A conductor has a non-metallic core surrounded by electrically conductive strands and has a connecting portion of the core extending axially beyond the strands. The connecting portion is received in the tubular portion. A crimped portion on the tubular portion radially engages the connecting portion and secures the conductor to the tubular portion. The crimped portion is formed by concave surfaces on internal surfaces of crimping dies. The concave surfaces have different radii of curvature than remaining portions of the internal surfaces.

Abstract: An assembly tool for use with an ultrasonic surgical instrument includes a body portion, a neck, and a head portion. The body portion includes a base and first and second legs extending from the base to define a receiving area therebetween. The neck is attached to the body portion and the head portion is attached to the neck. The head portion defines a central opening. The first and second legs of the body portion are configured to engage a portion of a housing of an ultrasonic surgical instrument received within the receiving area, and the head portion is configured to engage a rotation knob of the ultrasonic surgical instrument received within the central opening to rotationally fix the rotation knob relative to the housing. Kits including the assembly tool and methods of assembling an ultrasonic surgical instrument using the assembly tool are also provided.

Abstract: A manufacturing method of a crimping terminal includes a terminal supply step of supplying the crimping terminal to a crimping position with a wire by a terminal supply device, the crimping terminal including a terminal connection portion, a wire connection portion to be crimped onto the wire, and a joint portion linking side walls of the terminal connection portion and the wire connection portion, a support step of supporting a bottom portion of the crimping terminal supplied to the crimping position by a first mold, a crimp step of deforming the wire connection portion while relatively moving toward the first mold, and crimping the wire connection portion onto the wire by a second mold, and a regulation step of regulating a width of the joint portion so as not to be wider than a width of the terminal connection portion, by sandwiching the joint portion from both sides in a width direction when the second mold crimps the wire connection portion by a regulation portion.

Abstract: A transfer head for transferring micro elements includes a cavity with a plurality of vacuum paths; a suite having a plurality of suction nozzles and vacuum path components. The suction nozzles are connected to the vacuum path components respectively, and the vacuum path components are formed to connect to vacuum paths in the cavity respectively. The suction nozzles absorb or release the micro elements through vacuum pressure, which is transmitted by vacuum path components and vacuum paths of each path. When the suite is mounted in the cavity, the upper surface of the suite is arranged with optical switching components for controlling the switch of the vacuum path components and vacuum paths of each path so that the suction nozzles can absorb or release required micro element through vacuum pressure.

Abstract: A spine of an electrode assembly is constructed by simultaneously deploying a plurality of individual bobbins of lead wire radially around the longitudinal axis of a polymeric tube. A free end of lead wire from each bobbin is electrically connected to a respective electrode and the electrodes are sequentially installed from a distal first location on the polymeric tube to a proximal location. Each lead wire may be helically wound around the polymeric tube between the electrode to which the lead wire is electrically connected and a proximally adjacent electrode, such that each lead wire between adjacent pairs of electrodes has an alternating direction of winding.

Abstract: A method for bonding electrical conductors is provided that is capable of suppressing a power source capacity when assembling a stator having a specific structure. First, coil pieces 9 are arranged in contact with bonding portions of a slot coil 5 inserted in a slot of a stator iron core 2 via a metal paste. Subsequently, an electrical current is applied using a pair of electrodes 11A and 11B in the axial direction (upward and downward in the figures) of the slot coil 5 while contact portions 15 between the slot coil 5 and the coil pieces 9 are pressed in an axial direction of the slot coil 5. As a result, electricity flows in the axial direction the coil piece 9 (a direction of an arrow X in the figures).

Abstract: Disclosed is a manufacturing method of a gas sensor. The gas sensor has a plate-shaped sensor element with at least one pair of electrode pads, a separator disposed around the sensor element, and at least one pair of opposed metal terminals held in an insertion hole of the separator and electrically connected at contact regions thereof to the respective electrode pads. The manufacturing method includes mounting the metal terminals in the insertion hole of the separator with the use of a mounting jig. The mounting jig has a flat portion interposed between the contact regions of the metal terminals during the mounting of the metal terminals in the separator so as to prevent contact and entanglement of the opposed metal terminals.

Abstract: A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

Abstract: A method for manufacturing a semiconductor device, for example formed utilizing component stacking. As non-limiting examples, various aspects of this disclosure provide a method for reducing warpage and/or stress in stacked semiconductor devices.

Abstract: Provided is a shaping device for a roller electrode for seam welding that prepares shapes for a first roller electrode and a second roller electrode attached to an arm of a robot. This shaping device is provided independently from the robot and disposed within rotational range of the arm, and is provided with a first roller and a second roller that are disposed on a line orthogonal to a line joining the rotational centers of the first and second roller electrodes and are in contact with the outer circumferences of the first and second roller electrodes.

Abstract: A method and method of using a cable that includes a cable core. The cable core has an inner armor wire layer disposed thereabout. The inner armor wire layer has an outer armor wire layer disposed thereabout. The inner armor wire layer and outer armor wire layer have torque removed therefrom during manufacturing.

Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.

Abstract: An apparatus includes an alignment module configured to align a first wafer and a second wafer based on alignment markers on the first wafer and corresponding alignment markers on the second wafer. The apparatus further includes a flag placement module configured to insert a plurality of flags between the first wafer and the second wafer, a flag-out mechanism configured to simultaneously move the plurality of flags to a flag-out position, and a controller configured to determine whether the wafers remain aligned within an alignment tolerance based on an amount of time for each flag of the plurality of flags to reach the flag-out position.