Patents Examined by Barbara Summons
  • Patent number: 10547285
    Abstract: A bulk acoustic wave resonator includes a substrate including a cavity groove, a membrane layer disposed above the substrate and including a convex portion. And a lower electrode including a portion thereof disposed on the convex portion. The bulk acoustic wave resonator also includes a piezoelectric layer configured so that a portion of the piezoelectric layer is disposed above the convex portion, and an upper electrode disposed on the piezoelectric layer. A first space formed by the cavity groove and a second space formed by the convex portion form a cavity, the cavity groove is disposed below an active region, and the convex portion comprises an inclined surface disposed outside of the cavity groove.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: January 28, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun Lim, Yoon Sok Park, Jong Woon Kim, Tae Yoon Kim, Moon Chul Lee
  • Patent number: 10547284
    Abstract: In a resonator, two interdigital transducers (W1,W2) are electrically series-connected and arranged next to each other in the longitudinal direction within an acoustic track delimited by reflectors. Between the two interdigital transducers, a transition area (UEB) is formed in that the finger period p, which is defined as the distance between the finger centers of adjacent transducer fingers, is higher in comparison to the remaining interdigital transducer.
    Type: Grant
    Filed: April 13, 2016
    Date of Patent: January 28, 2020
    Assignee: QUALCOMM Incorporated
    Inventor: Andreas Bergmann
  • Patent number: 10541667
    Abstract: A surface acoustic wave (SAW) resonator device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate comprises a bulk region, and a surface region. The surface region has a high trap density, and a reduced carrier mobility, compared to the bulk region. A piezoelectric layer, having a first surface and a second surface, is disposed over the semiconductor substrate. A plurality of electrodes are disposed over the first surface of the piezoelectric layer, and the plurality of electrodes are configured to generate surface acoustic waves in the piezoelectric layer. The SAW resonator device also comprises a layer disposed between the first surface of the semiconductor substrate and the second surface of the piezoelectric layer.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: January 21, 2020
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Stephen Roy Gilbert, Richard C. Ruby
  • Patent number: 10541665
    Abstract: A bulk acoustic wave (BAW) resonator includes: a substrate; a first BAW resonator including a first air cavity disposed in the substrate, and further including a first electrode, a first piezoelectric layer, and a second electrode stacked on the first air cavity; a second BAW resonator including a second air cavity disposed in the substrate, and further including a first electrode, a second piezoelectric layer, and a second electrode stacked on the second air cavity, wherein the second BAW resonator is connected in parallel to the first BAW resonator and has polarities that are opposite of polarities of the first BAW resonator; and a compensation capacitor circuit connected between the first BAW resonator and the second BAW resonator.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Moon Chul Lee, Tah Joon Park, Jae Chang Lee, Tae Yoon Kim, Chang Hyun Lim, Hwa Sun Lee, Tae Hun Lee, Hyun Min Hwang, Tae Kyung Lee
  • Patent number: 10541713
    Abstract: Multiplexers having hybrid circuits with resonators. In some embodiments, a multiplexer for processing radio-frequency signals can include a plurality of nodes, a common node, and a signal path implemented between each of the plurality of nodes and the common node. Each signal path can include a filter, and each of at least some of the signal paths can further include a resonator coupled with the corresponding filter. A signal path with the resonator provides a sharper notch profile for a radio-frequency signal than a signal path without the resonator.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: January 21, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jianxing Ni, Joshua James Caron, Srivatsan Jayaraman, Reza Kasnavi, John G. Freed
  • Patent number: 10536134
    Abstract: An acoustic wave device includes a plurality of serial resonators and a plurality of parallel resonators configured by acoustic wave elements, which plurality of serial resonators and plurality of parallel resonators configure a filter in which they are connected in a ladder configuration; a first capacitance part which is connected in parallel to at least one of the plurality of serial resonators; and a second capacitance part which is connected in series to at least one of the plurality of parallel resonators.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: January 14, 2020
    Assignee: KYOCERA Corporation
    Inventor: Motoki Ito
  • Patent number: 10530330
    Abstract: A longitudinally coupled resonator elastic wave filter is disposed on a piezoelectric substrate. IDT electrodes include first and second busbars. An inorganic insulating layer is provided on at least one side in a direction perpendicular or substantially perpendicular to an elastic wave propagation direction to cover the first or second busbars, and a first wiring line is disposed on the inorganic insulating layer to extend in the elastic wave propagation direction. A second wiring line three-dimensionally crosses the first wiring line with the inorganic insulating layer interposed therebetween. The first wiring line is connected to busbars, which are connected to the same potential, by extending through the inorganic insulating layer.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: January 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takayuki Okude
  • Patent number: 10530327
    Abstract: A surface acoustic wave (SAW) resonator device is disclosed. The SAW resonator has a piezoelectric layer disposed over a semiconductor substrate. The piezoelectric layer has a first surface and a second surface. The polarization axis (C-axis) of the piezoelectric layer is oriented at an angle relative to the second surface of the piezoelectric layer in a range of approximately 0° to approximately 45°. A layer is disposed between the first surface of the semiconductor substrate and the second surface of the piezoelectric layer.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: January 7, 2020
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Richard C. Ruby, Stephen Roy Gilbert
  • Patent number: 10530328
    Abstract: A surface acoustic wave (SAW) device including a piezoelectric layer, a high acoustic velocity layer coupled to the piezoelectric layer, and at least one transducer. The SAW device may include a multi-layer graphene layer in the electrodes of the transducer and/or in a conductive layer that is coupled to the piezoelectric layer.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: January 7, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Zhuohui Chen
  • Patent number: 10523178
    Abstract: A surface acoustic wave (SAW) resonator includes a piezoelectric layer disposed over a substrate, and a plurality of electrodes disposed over the first surface of the piezoelectric layer. A layer is disposed between the substrate and the piezoelectric layer. A surface of the layer has a smoothness sufficient to foster atomic bonding between layer and the substrate. A plurality of features provided on a surface of the piezoelectric layer reflects acoustic waves and reduces the incidence of spurious modes in the piezoelectric layer.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: December 31, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Stephen Roy Gilbert, Richard C. Ruby
  • Patent number: 10511280
    Abstract: The present disclosure provides a resonator which resonates in a bulk acoustic wave mode. The resonator includes a resonator body, at least one transducer arm and a substrate. The resonator body is deformed at least along a first direction. The transducer arm is connected to the resonator body along the first direction and includes a base, a piezoelectric layer and an electrode layer. The base includes a first end connected to the resonator body. The piezoelectric layer is disposed above the base but not extended to the resonator body, and the electrode layer is disposed above the piezoelectric layer but not extended to the resonator body. The substrate is for securing the transducer arm such that the resonator body is suspended.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 17, 2019
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Sheng-Shian Li, Gayathri Pillai
  • Patent number: 10505515
    Abstract: A ladder filter includes a piezoelectric substrate, an antenna terminal, a transmission terminal, and ground terminals on the piezoelectric substrate, and IDT electrodes. Each of the IDT electrodes is disposed on the piezoelectric substrate and includes a plurality of electrode fingers and a pair of busbars to which first ends of the plurality of electrode fingers are connected commonly. The IDT electrodes define elastic wave resonators. The ladder filter further includes an interlayer insulating film disposed on at least one of the busbars and a thermally conductive member made of a material with thermal conductivity higher than that of the interlayer insulating film and disposed on the interlayer insulating film. The thermally conductive member is in contact with at least one of the antenna terminal, the transmission terminal, and the ground terminals.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: December 10, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Daisuke Ajima
  • Patent number: 10505514
    Abstract: A piezoelectric thin film comprises aluminum nitride containing a monad and at least one type among a tetrad and a pentad. The piezoelectric thin film having a large electromechanical coupling factor and a small stiffness.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: December 10, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Yukari Inoue, Tomohiro Terada, Junichi Kimura
  • Patent number: 10491192
    Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having parallel front and back surfaces, the back surface attached to the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on a portion of the piezoelectric plate suspended over a cavity formed in the substrate.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: November 26, 2019
    Assignee: Resonant Inc.
    Inventors: Viktor Plesski, Soumya Yandrapalli, Robert B. Hammond, Bryant Garcia, Patrick Turner, Jesson John, Ventsislav Yantchev
  • Patent number: 10476469
    Abstract: A micro-resonator includes a first electrode positioned on a piezoelectric plate at a first end of the piezoelectric plate, the first electrode including a first set of fingers and a second electrode positioned on the piezoelectric plate at a second end of the piezoelectric plate. The second electrode including a second set of fingers interdigitated with the first set of fingers with an overlapping distance without touching the first set of fingers, the overlapping distance being less than seven-tenths the length of one of the first set of fingers or the second set of fingers. At least one of the first end or the second end of the piezoelectric plate may define a curved shape.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 12, 2019
    Assignee: Board of Trustees of the Univsity of Illinois
    Inventors: Songbin Gong, Yong-Ha Song
  • Patent number: 10476479
    Abstract: A filter includes: series resonators connected to each other in series; shunt resonators connected to first nodes between some of the series resonators; and a variable capacitor connected to a second node between some of the series resonators, and forming a pole configured to suppress harmonics.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: November 12, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yoon Sok Park, June Kyoo Lee, Won Kyu Jeung
  • Patent number: 10476474
    Abstract: An acoustic wave resonator includes: comb-shaped electrodes located on a piezoelectric substrate, each including electrode fingers exciting an acoustic wave and a bus bar electrode connecting to the electrode fingers, the comb-shaped electrodes forming an overlap region where the electrode fingers of one of the comb-shaped electrodes overlap the electrode fingers of the other, wherein each of the electrode fingers overlapping in the comb-shaped electrodes includes: a first region that is located in the overlap region, where a velocity of the acoustic wave is a first velocity, and of which a position in a first direction in which the electrode fingers extend changes with respect to a second direction intersecting the first direction; and second regions that are located in the overlap region, where a velocity of the acoustic wave is a second velocity different from the first velocity, and that sandwich the first region in the first direction.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: November 12, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Tabito Tanaka
  • Patent number: 10476481
    Abstract: Acoustic filtering circuitry includes a piezoelectric layer, a dielectric layer, a plurality of acoustic resonators, and a capacitor. The dielectric layer is over a surface of the piezoelectric layer. The plurality of acoustic resonators each includes a transducer on the surface of the piezoelectric layer such that the transducer is between the piezoelectric layer and the dielectric layer. The capacitor includes a first plate on the surface of the piezoelectric layer such that the first plate is between the piezoelectric layer and the dielectric layer and a second plate over the first plate such that the second plate and the first plate are separated by at least a portion of the dielectric layer.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: November 12, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Alan S. Chen, Kurt G. Steiner, Benjamin P. Abbott, Taeho Kook, Scott Shive, Jean Briot
  • Patent number: 10469050
    Abstract: An acoustic wave device includes a piezoelectric layer, an interdigital transducer, and a slow wave propagation overlay over a portion of the interdigital transducer. By providing electrode fingers of the interdigital transducer such that a portion of the width thereof is dependent on an electrode period, a desirable wave mode may be maintained in the acoustic wave device. Further, by varying a width of the slow wave propagation overlay based on the electrode period, the desirable wave mode may be further maintained.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: November 5, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Kevin J. Gamble, Benjamin P Abbott, Alan S. Chen, Kurt G. Steiner
  • Patent number: 10469056
    Abstract: A multiplexer device includes a single die, at least three acoustic filters and at least one antenna port arranged on the single die, and a shunt inductance connected between each of the at least one antenna port and ground. Each acoustic filter includes one of a transmit or receive filter corresponding to a predetermined radio frequency band. The at least one antenna port is connected to at least one antenna, respectively, where each of the at least one antenna port is further connected to at least one acoustic filter arranged on the single die, and is configured to pass RF signals corresponding to the predetermined RF band of the connected at least one acoustic filter. The shunt inductance provides impedance matching between each of the at least one antenna port and each of the at least one acoustic filter connect to the at least one antenna port.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: November 5, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Richard C. Ruby, Seungku Lee, Stephen Roy Gilbert, David Archbold