Patents Examined by Barbara Summons
  • Patent number: 10469052
    Abstract: An elastic wave device includes a support substrate made of silicon, a piezoelectric film disposed directly or indirectly on the support substrate, and an interdigital transducer electrode disposed on one surface of the piezoelectric film. A higher-order mode acoustic velocity of propagation through the piezoelectric film is equal or substantially equal to an acoustic velocity Vsi=(V1)1/2 of propagation through silicon or higher than the acoustic velocity Vsi, where Vsi is specified by V1 among solutions V1, V2, and V3 with respect to x derived from Ax3+Bx2+Cx+D=0.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: November 5, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideki Iwamoto
  • Patent number: 10461719
    Abstract: An acoustic resonator comprises a first electrode and second electrode comprising a plurality of sides. At least one of the sides of the second electrode comprises a cantilevered portion. A piezoelectric layer is disposed between the first and second electrodes. A bridge disposed adjacent to one of the sides of the second electrode.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: October 29, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: John Choy, Chris Feng, Phil Nikkel
  • Patent number: 10447241
    Abstract: A wave separator includes an n number (n being a natural number of 3 or larger) of band pass filters having an n number or larger of mutually different pass bands, and a common terminal. For a first of the band pass filters that is one of a band pass filter having a center frequency of a pass band at a lowest side and a band pass filter having a center frequency of a pass band at a highest side and that has a larger or equal difference in a center frequency of a pass band from an adjacent band pass filter as compared with the other band pass filter satisfies a predetermined configuration for a second band pass filter having a pass band adjacent to the first band pass filter.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: October 15, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Soichi Nakamura
  • Patent number: 10432172
    Abstract: A bulk acoustic filter device includes: a substrate including a through hole formed by a first recess and a second recess adjacent to the first recess; a membrane layer forming a cavity with the substrate; a filter including a lower electrode disposed on the membrane layer, a piezoelectric layer disposed to cover a portion of the lower electrode, and an upper electrode formed to cover a portion of the piezoelectric layer; and an electrode connecting member disposed in the substrate, and connected to either one of the lower electrode and the upper electrode, wherein the electrode connecting member includes an insertion electrode disposed in the first recess, and a via electrode connected to the insertion electrode, and disposed on an inner peripheral surface of the second recess and a surface of the substrate.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: October 1, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Woo Yi, Chan Hee Park, Kwang Su Kim, Sang Jin Kim
  • Patent number: 10432171
    Abstract: A radio-frequency module includes a filter connected at one end to an input terminal and at the other end to an output terminal, and an amplifier connected at one end to the output terminal and at the other end to the other end of the filter. The filter includes first and second filter portions. The first filter portion is disposed on a signal line electrically connecting the input terminal and the output terminal. The second filter portion is connected between the signal line and a ground. Each of the first and second filter portions includes a surface acoustic wave resonator including an IDT electrode on a piezoelectric substrate. The IDT electrode includes first and second electrode fingers. In the surface acoustic wave resonator of the second filter portion, at least some of the first and second electrode fingers are electrically connected to each other.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 1, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Terumichi Kita
  • Patent number: 10432169
    Abstract: A bonded body includes a supporting body composed of a ceramic, a bonding layer provided over a surface of the supporting body and composed of one or more material selected from the group consisting of mullite, alumina, tantalum pentoxide, titanium oxide and niobium pentoxide, and a piezoelectric single crystal substrate bonded with the bonding layer. The surface of the supporting body has an arithmetic average roughness Ra of 0.5 nm or larger and 5.0 nm or smaller.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: October 1, 2019
    Assignee: NGK INSULATORS, LTD.
    Inventors: Tomoyoshi Tai, Masashi Goto, Yudai Uno, Shinya Kaneko
  • Patent number: 10432170
    Abstract: An acoustic wave filter device includes a filter disposed on a substrate, a wall member disposed on the substrate and surrounding the filter, a cap member disposed on the wall member and bounding an internal space with the wall member; and a support member disposed on the cap member. The support member is disposed above the internal space and includes a bump disposed on the cap member.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: October 1, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyun Jung, Seung Wook Park, Seong Hun Na
  • Patent number: 10418971
    Abstract: A communication module includes a serial resonator of a transmission filter and an auxiliary resonator of a reception filter. Each of the serial resonator and the auxiliary resonator includes a piezoelectric substrate and a positive-side comb-shaped electrode and negative-side comb-shaped electrode meshing with each other. The positive-side comb-shaped electrode in the transmission filter and the negative-side comb-shaped electrode in the reception filter are connected to each other. The orientation from the positive-side comb-shaped electrode to the negative-side comb-shaped electrode relative to the crystal orientation of the piezoelectric substrate in the transmission filter and the orientation from the negative-side comb-shaped electrode to the positive-side comb-shaped electrode relative to the crystal orientation of the piezoelectric substrate in the reception filter are inverse to each other.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: September 17, 2019
    Assignee: KYOCERA Corporation
    Inventor: Masahisa Shimozono
  • Patent number: 10418970
    Abstract: An elastic wave device includes an IDT electrode including first electrode fingers and second electrode fingers. In an intersecting portion, in which the first electrode fingers and the second electrode fingers interdigitate with each other, low-acoustic-velocity regions are disposed on both sides of a central region, high-acoustic-velocity regions are disposed outside of the low-acoustic-velocity regions, and the dimension of each of the low-acoustic-velocity regions in the electrode finger direction is not uniform in the elastic-wave propagation direction.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: September 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuya Daimon
  • Patent number: 10418966
    Abstract: An elastic wave device includes a piezoelectric substrate, and elastic wave elements on the piezoelectric substrate and including IDT electrodes, respectively. The IDT electrode of a first of the elastic wave elements includes first and second busbars, and the IDT electrode of a second of the elastic wave elements includes third and fourth busbars. The second busbar and the third busbar extend parallel or substantially parallel to each other, and are spaced by a gap in a direction perpendicular or substantially perpendicular to an elastic-wave propagating direction. Each of the second and third busbars includes first and second electrode layers at least a portion of which is laminated on the first electrode layer. The second electrode layer of the second busbar is cut in at least one location in a direction crossing the elastic-wave propagating direction.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: September 17, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshinori Kameoka
  • Patent number: 10411674
    Abstract: An elastic wave device includes first and second longitudinally coupled resonator elastic wave elements aligned on a piezoelectric substrate. A second reflector of the first longitudinally coupled resonator elastic wave element and a third reflector of the second longitudinally coupled resonator elastic wave element are adjacent to each other in an elastic wave propagation direction. A ground interconnection extends in a direction intersecting with the elastic wave propagation direction and in a region between the second reflector and the third reflector. A gap in one portion of the ground interconnection includes a different acoustic velocity portion where an acoustic velocity is different from an acoustic velocity in another portion of the ground interconnection.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: September 10, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yohei Konaka
  • Patent number: 10396751
    Abstract: An acoustic wave filter device includes a lower electrode disposed between a substrate and a piezoelectric layer, an upper electrode disposed on the piezoelectric layer, and an insulating layer disposed on the upper electrode. The insulating layer exposes portions of the upper electrode.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: August 27, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Han, Tae Hun Lee, Dae Hun Jeong, Moon Chul Lee, Sang Uk Son
  • Patent number: 10367473
    Abstract: An input port, an output port, and a plurality of serial resonators and a plurality of parallel resonators connected in a ladder type between the input port and the output port and including IDT electrodes are provided. The plurality of parallel resonators include at least one first parallel resonator having a resonance frequency lower than resonance frequencies of the plurality of serial resonators, and at least one second parallel resonator having a resonance frequency higher than antiresonance frequencies of the plurality of serial resonators.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: July 30, 2019
    Assignee: KYOCERA Corporation
    Inventors: Motoki Ito, Tomonori Urata
  • Patent number: 10358341
    Abstract: Embodiments of multi-frequency excitation are described. In various embodiments, a natural frequency of a device may be determined. In turn, a first voltage amplitude and first fixed frequency of a first source of excitation can be selected for the device based on the natural frequency. Additionally, a second voltage amplitude of a second source of excitation can be selected for the device, and the first and second sources of excitation can be applied to the device. After applying the first and second sources of excitation, a frequency of the second source of excitation can be swept. Using the methods of multi-frequency excitation described herein, new operating frequencies, operating frequency ranges, resonance frequencies, resonance frequency ranges, and/or resonance responses can be achieved for devices and systems.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: July 23, 2019
    Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventor: Mohammad Younis
  • Patent number: 10361677
    Abstract: A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: July 23, 2019
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok, Robert R. Rotzoll
  • Patent number: 10355668
    Abstract: An acoustic wave device includes: a Y-cut X-propagation lithium tantalate substrate having a cut angle of 20° or more and 48° or less; and a grating electrode that is composed of one or more metal films laminated on the substrate, and excites an acoustic wave, wherein when a density of each metal film in the one or more metal films is represented by ?i, a Poisson's ratio of each metal film is represented by Pi, a film thickness of each metal film is represented by hi, a density of Cu is represented by ?0, a Poisson's ratio of Cu is represented by P0 and a pitch is represented by ?, a total value of “(hi/?)×(?i/?0)×(Pi/P0)” for each metal film with respect to the one or more metal films is more than 0.08.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: July 16, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Masafumi Iwaki, Yoshio Sato, Tabito Tanaka, Hidetaro Nakazawa, Takashi Matsuda, Jun Tsutsumi
  • Patent number: 10340888
    Abstract: An elastic wave filter includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, a first shield electrode provided on the piezoelectric substrate, a first insulating film laminated on the piezoelectric substrate and extending onto the first shield electrode, a first signal terminal provided on the first insulating film, a second signal terminal provided on the piezoelectric substrate, and a first ground terminal provided on the piezoelectric substrate and connected to a ground potential. The first shield electrode is not electrically connected to the IDT electrode and the first and second signal terminals. The first signal terminal is included in the first shield electrode when seen from above. One of the first signal terminal and the second signal terminal is an output terminal and the other thereof is an input terminal.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: July 2, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hiroshi Muranaka
  • Patent number: 10340883
    Abstract: A high-frequency module includes a SAW filter including a piezoelectric substrate and an electrode pattern provided on the piezoelectric substrate, a module substrate, a resin member covering the SAW filter, and a wiring pattern connected to the electrode pattern and provided on the resin member. The electrode pattern and the wiring pattern are inductively coupled, capacitively coupled, or inductively coupled and capacitively coupled with each other.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: July 2, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yukiteru Sugaya
  • Patent number: 10333494
    Abstract: RF circuitry, which includes a first acoustic RF resonator (ARFR) and a first compensating ARFR, is disclosed. A first inductive element is coupled between the first compensating ARFR and a first end of the first ARFR. A second inductive element is coupled between the first compensating ARFR and a second end of the first ARFR. The first compensating ARFR, the first inductive element, and the second inductive element at least partially compensate for a parallel capacitance of the first ARFR.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: June 25, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Nadim Khlat, Jean-Frederic Chiron, Marcus Granger-Jones, Andrew F. Folkmann, Robert Aigner
  • Patent number: 10326428
    Abstract: The invention specifies a tunable RF filter which may operate using electroacoustic components and provides good electrical properties despite having a wide tuning range. For this purpose, the RF filter comprises a tunable filter core (AFK) having electroacoustic (EAK) and detunable (AKE) filter elements, and impedance restoration circuits (IWS1, IWS2) for compensating for an impedance change by tuning the filter core.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: June 18, 2019
    Assignee: SnapTrack, Inc.
    Inventors: Juha Ellä, Edgar Schmidhammer