Abstract: A bar code scanner diagnostic method which may be performed at a retail site or during the burn-in phase of manufacturing. The method includes the steps of applying power to the scanner, reading a bar code label by the scanner, determining whether the bar code label is a diagnostic bar code label, reading the diagnostic bar code label by the scanner a first predetermined number of times within a predetermined period of time if the bar code label is the diagnostic bar code label, determining scanner failures which occurred during the reading of the diagnostic bar code label, logging the failures which occurred during reading of the diagnostic bar code label, cycling power to the scanner after the predetermined time period, and performing the reading through cycling steps a second predetermined number of times. Logged failures may be downloaded to a terminal coupled to the scanner and printed by a printer coupled to the terminal.

Abstract: An electricity metering device including at least one sigma-delta converter (20) adapted to output a series of digital pulses, a digital counter means (21) for summing the output of the sigma-delta converter and a signalling means (32) to deliver an output signal (38) when the sum reaches a predetermined value, characterized in that the metering device further comprises a means (32, 33) for digitally adjusting the gain of the sigma-delta converter comprising programmable digital memory means (33) adapted to store a parameter representing the gain of the metering device, the value of the parameter being externally programmable, and a digital logic means (32) for logically combining the gain parameter with the digital sum stored in the counter means to determine the number of pulses required before the predetermined value is reached and an output pulse delivered.

Abstract: A buckling beam test probe assembly for the electrical test of integrated circuit devices is provided having contact probes made of a composite material and a stripper plate constructed so as to allow scrubbing and controllable wiping of the contact probe on the surface of the device to be tested. The assembly is designed for the maximum number of expected contact probes. Only the contact probe compartments which are needed for testing the devices are populated.

Abstract: A DC current sensor with an exciting core of soft magnetic material and formed with a pair of tubular bodies, each tubular body being positioned in parallel with the other to provide therebetween a space, through which passes a wire conducting a current to be detected; a detecting core formed with the side faces of a pair of tubular bodies and two plate-like members of soft magnetic material, each of which connecting integrally with each of the inside edges thereof near an opening of the tubular bodies to form a rectangular frame-shaped member as a whole; exciting coils, each of which magnetically energizing the exciting core in the direction perpendicular to the plane of the detecting core; detecting coils, each of which being wound around the detecting core; and applying an alternating current to the exciting coils to periodically and magnetically saturate the rectangular-shaped portions of the detecting core and exciting core, energizing the exciting coils to modulate a magnetic flux produced in the detect

Abstract: This invention is directed to a mechanical, robotically operated burn-in socket testing apparatus for integrated circuit "chips", where such chips, as known in the art, are typically planar electronic devices. The apparatus, operationally mounted to a planar electronic board, such as a mother board, comprises a first frame member for mounting to the mother board, where the first frame member includes electrical means for engaging chip leads and applying electrical current thereto during the burn-in testing. A second frame member is disposed in sliding engagement with the first frame member, where the second frame member is movable from a first position to a second position.

Abstract: An electronic meter for measuring electricity includes a magnetic shield positioned adjacent each outermost toroidal coil of electrical current sensors to thereby resist tampering by a magnetic field applied from outside the meter housing. The magnetic shield has an arcuate cross-sectional shape corresponding to the outermost coil portion and has a predetermined arc length covering only a predetermined portion of the outermost coil portion. The shield preferably has a semicylindrical cross-section shape thereby covering only half the toroidal coil.

Abstract: A test system is provided for the dynamic testing at the same time of a plurality of packaged charge coupled device (CCD) image sensors in which the plurality of image sensors of the same sensor type can be tested under conditions including selectable signal levels of bias control signals and selected signal levels and pulse durations of clocked control signals appropriate to the type of CCD image sensor of the plurality of sensors under test. The test system provides selectably level-adjusted control signals, selector switch means for generating selectable clock signals having the level-adjusted signal levels, and a clock driver for amplifying the clocked control signals. The amplified control signals are directed to a common input terminal of an isolation network assembly, each of separate output terminals thereof connected to a corresponding input terminal of each one of the CCD image sensors to be tested.

Abstract: A constant current loop measuring system measures a property including the temperature of a sensor responsive to an external condition being measured. The measuring system includes thermocouple conductors connected to the sensor, sensing first and second induced voltages responsive to the external condition. In addition, the measuring system includes a current generator and reversor generating a constant current, and supplying the constant current to the thermocouple conductors in forward and reverse directions generating first and second measured voltages, and a determining unit receiving the first and second measured voltages from the current generator and reversor, and determining the temperature of the sensor responsive to the first and second measured voltages.

Abstract: A movement actuator includes an elongate filament made of a flexible material, and a strip of shape memory alloy disposed on the surface of one side of the filament. The shape memory alloy is responsive to actuation signals, heat or electrical signals, for changing its shape and when its shape changes, it causes the filament to move, i.e., bend, to accommodate the change in shape of the alloy. Also included is a signal supply device for selectively applying heat signals or electrical current to the strip of shape memory alloy to cause the alloy to change its shape and cause the filament to bend. Other patterns for the shape memory alloy could be disposed on the filament to cause other kinds of movements. For example, a helical pattern of the shape memory alloy about the filament would cause the filament to twist when the helical pattern were caused to shorten or lengthen.

Abstract: A method and apparatus for handling wafers. A wafer pick moves along a horizontal x-axis to unload a wafer from a cassette and position the wafer over a chuck. The chuck moves upwardly along a z-axis perpendicular to the surface of the wafer and lifts the wafer off the pick. The pick retracts through a slot in the chuck and a test probe moves along the x-axis to position itself over the wafer and chuck with reference to a calculated wafer center. The chuck then moves upwardly to engage the surface of the wafer with the probe. Wafer characteristics are tested at several test points located on a circle on the surface of the wafer by repeatedly lowering the chuck, rotating the chuck by a small amount, and raising the chuck to engage the wafer with the probe. The probe is then positioned to test another circle of points.

Abstract: Flexible contact terminals configured from printed strip circuits and usable with integrated circuit test fixtures. The termination circuits include printed conductive pathways formed on a flexible, multi-layered substrate. The conductive paths are three dimensionally tailored for impedance and resilience. Circuit processing includes steps to profile etch the conductive paths at the X, Y and Z-axis, especially end terminations. A support fixture contains the termination circuits to provide resilient electrical test terminations to circuit components supported to a resilient component support.

Abstract: An apparatus (10) is provided for measuring the excess carrier lifetime in a semiconductor material, such as an HgCdTe wafer (MCT). The apparatus includes a computer controller (56) which automates the functions of the apparatus, including the operation of the shutter (28) to control the time the testing samples are exposed to the excitation energy from a laser (14), the laser energy intensity on the sample, the position of the wafer controlled by the computer controller operating a motorized sample positioner (39) and maintaining the temperature of the sample. Multiple samples are taken by the apparatus which are averaged and analyzed to result in a characterization of the carrier lifetime.

Abstract: A method for detecting turn faults in an induction motor comprises measuring at least two motor phase currents, at least two motor phase voltages, and the negative sequence impedance. Motor torque is estimated by employing the at least two motor phase currents and the at least two motor phase voltages. Motor pu slip is estimated by employing the motor torque. The motor pu slip is used to estimate the load variation effect on the negative sequence impedance. The negative sequence impedance is adjusted in accordance with the load variation effect, and it is determined whether the adjusted negative sequence impedance value indicates the presence of a turn fault.

Abstract: Manufacturing of semiconductor devices is facilitated when the device chip carriers of the devices are tested, prior to population of chips thereon, by a module test card. The module test card is formed by a test substrate and a plurality of test chips mounted on the test substrate. Connections are provided on the test substrate for connecting to a tester. Through the module test card, the device chip carriers are tested under simulation of their operating conditions.

Abstract: A first Hall element is supplied with a current proportional to a load voltage and applied with a magnetic field proportional to a load current and produces a voltage proportional to a load power given by the load voltage and the load current. A second Hall element has the same characteristic as that of the first Hall element and supplied with the current proportional to the load voltage and no magnetic field. The output voltages of the first and the second Hall elements are combined by combining means to compensate and remove an offset voltage component contained in the output voltage of the first Hall element.

Abstract: A DC current sensor using a continuous annularly-shaped detecting core of soft magnetic material; a continuous annularly-shaped exciting core of soft magnetic material intersecting with the detecting core perpendicular to the plane thereof; respective detecting and exciting coils wound respectively around the detecting and the exciting cores; an AC excitation of a given frequency applied to the exciting coil to saturate the detecting core; a wire conducting DC current to be detected extending through the detecting core to establish a magnetic flux therein; and a detector connected to the detecting coil for detecting the magnetic flux modulated by the AC excitation to detect the DC current flowing in the wire.

Abstract: According to the invention, there is provided a power source residual capacity measuring apparatus comprising: a circuit for measuring a residual capacity of a power source in accordance with a terminal voltage of the power source; a circuit for detecting a current flowing in a load connected to the power source; and a circuit for correcting the residual capacity of the power source which was measured by the measuring circuit in accordance with the current detection value and characteristics of the power source.

Abstract: A probe apparatus comprises a housing, a probing mechanism arranged in the housing and including a supporting table for supporting an object having electrodes and movably arranged to locate the object at a measurement position, and probes which is brought into contact with the respective electrodes of the object supported by the supporting table, a load/unload mechanism arranged in the housing, for loading/unloading the object in/from the supporting table, and a downflow forming unit for forming a downflow of clean air flowing from an upper position to a lower position of the housing in every region inside the housing.

Abstract: The invention relates to measuring apparatus for measuring the real load factor on an electricity source delivering an AC current to a consumer appliance, said apparatus comprising:a current sensor supplying a signal that is continuously proportional to the current delivered by the source;a rectifier circuit receiving said signal and supplying a rectified signal;a peak detector circuit receiving the rectified signal and extracting therefrom the peak value, which peak value can be read on an indicator; andcalibration means enabling the measuring apparatus to be set so that the peak value indicator displays 100% when the measured peak value of the AC current reaches the specified maximum level.

Abstract: A storage element for testing delay paths in integrated circuits is described. The storage element may be used in integrated circuits having matrices of probe and sense lines. The storage element generates a logic transition on an input to a delay path, the logic transition being closely synchronized with a clock signal. The storage element comprises a data input and a data output coupled to the input to the delay path. A master latch receives data from the data input through a first switch, the first switch being controlled by the complement of the clock signal. A slave latch receives data from the master latch through a second switch, the second switch being controlled by the true of the clock signal. A first sense input loads a first logic state into the master latch through a third switch, the first sense input being coupled to one of the IC's sense lines. The third switch is controlled by one of the IC's probe lines.