Abstract: An IC measuring and testing device and measuring and testing method comprising a measurement handler socket provided with mold-receiving base having guiding members corresponding to the shape of a mold body of an IC to be tested around its periphery and probes for contacting outer leads of the IC, and a suction arm for suction-supporting the IC and transferring it to the mold-receiving base, the IC measuring and testing device performing measuring and testing on the IC mounted in the mold-receiving base by means of the suction arm, the guide members corresponding to and separated from the outer leads of the IC, and terminal portions of the probes being arranged inserted into these separation portions. As a result, when the IC is set, the guide members and the like of the socket can be prevented from striking against the outer leads of the IC and deforming them.

Abstract: A method for detecting a departure from normal operation of an electric motor comprises obtaining a set of normal current measurements for a motor being monitored; forming clusters of the normal current measurements; training a neural network auto-associator using the set of normal current measurements; making current measurements for the motor in operation; comparing the input and output of the auto-associator; and indicating abnormal operation whenever the current measurements deviate more than a predetermined amount from the normal current measurements. The method models a set of normal current measurements for the motor being monitored, and indicates a potential failure whenever measurements from the motor deviate significantly from a model. The model takes the form of an neural network auto-associator which is "trained"--using clusters of current measurements collected while the motor is known to be in a normal operating condition--to reproduce the inputs on the output.

Abstract: A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.

Abstract: A dual-type pyroelectric elements. The first pyroelectric element is constituted by a larger electrode on a first surface and a smaller electrode on a second surface, respectively of a pyroelectric sheet. The second pyroelectric element is on the other hand constituted by a smaller electrode on the first surface and a larger electrode on the second surface respectively of the pyroelectric sheet. Further, takeout electrodes are taken out respectively integrally from the smaller electrodes on both surfaces of the pyroelectric sheet in mutually opposite directions.

Abstract: A switch module for connection between a power source and a controlled load, and a method for its operation, the switch module being testable without regard to the nature of the load, the nature of the power source, or whether the switch is actually connected to the power supply and its controlled load. The switch module has two pairs of MOS FET solid state switches, each pair connected back-to-back to allow switching of alternating current (ac) as well as direct current (dc) in either direction. Each pair of switches in the module has an associated independent power source, which is used in the preferred embodiment of the invention to supply a control signal to each switch and to supply a test current through the switch when it is closed. Test pulses invert the state of each switch momentarily and corresponding test current pulses are observed if a switch is operating properly.

Abstract: A memory metal hot plug connector apparatus and method which provide a physical lock that prevents removal of a circuit card from a system board until power and system functional signals have been electrically disconnected. The memory metal in the connector releases the physical lock when heated. A power supply interface controller issues commands to connect and disconnect power to the circuit card and to heaters associated with the memory metal connectors. A test signal circuit provides JTAG standard signals for connecting and disconnecting system functional signals. Methods for connecting and disconnecting the circuit card are also disclosed.

Abstract: The present invention relates to a spring probe contactor for testing BGA devices. The spring probe contactor is comprised of a plurality of spring probes for providing a connection between a BGA device to be tested and a DUT board. The plurality of spring probes are held within a contactor block having a plurality of apertures therethrough. The apertures are wide enough to hold a single spring probe within the contactor block without the spring probe coming into contact with the contactor block. A retaining plate is coupled to the contactor block for holding the plurality of spring probes within the contactor block. The retaining plate has a raised portion thereon which limits the compression of the plurality of spring probes when a BGA device is placed in the spring probe contactor.

Abstract: Apparatus for providing a direct indication of the failure of an electronic ircuit including a built-in self test circuit which performs an initial test on the electronic circuit and having a visual indicator coupled thereto which becomes activated when the self test circuit senses a failure of the electronic circuit upon power being supplied thereto or during operation. The electronic circuit with the built-in test feature consists of an integrated circuit chip or a multi-chip module encapsulated in a package with the indicator means visible therethrough. The indicator consists either of a light emitting diode or fusible material which changes its appearance and becomes visible through the package upon being activated by the built-in self test circuit.

Abstract: A semiconductor circuit element device with an arrangement for testing the device including a plurality of first logic circuits provided in correspondence with internal line groups which are formed by grouping the internal lines into a plurality of groups, a plurality of internal lines belonging to a group in question constituting the input lines of the plurality of first logic circuits, for outputting an active output signal when all of the inputs represent active signals and outputting an inactive output signal when at least one of the inputs represents an inactive signal; and a second logic circuit constituted by one or more stages of circuit structures, for receiving the outputs of the first logic circuits and sending out an output signal such that the output signal in the case where all of the inputs are inactive output signals is different from the output signal in the case where at least one of the inputs is an active output signal.

Abstract: A testing contactor is provided for testing small-size semiconductor devices with large currents at high frequencies. Each semiconductor device to be tested has a plurality of leads. The testing contactor includes a plurality of first electric contact elements. A first Kelvin contact for a lead is formed of a first electric contact element in contact with the lead. The testing contactor further includes a plurality of second electric contact elements and a plurality of electric connection elements. An electric connection element in contact with the lead effectively extends the lead. A second Kelvin contact is formed of a second electric contact element and an electric connection element, the second electric contact element in contact with the electric connection element and the electric connection element in contact with the lead.

Abstract: A circuit configuration for preparing analog signals for a boundary scan test process includes a boundary cell input structure. A Schmitt trigger receives an analog signal and has an output connected to the boundary cell input structure.

Abstract: A microwave band probing apparatus includes a wafer stage for mounting a wafer on which a plurality of microwave integrated circuits are present, an RF probe head for transmitting a microwave signal to a prescribed one of the microwave integrated circuits, and a shielding member covering the prescribed microwave integrated circuit when the RF probe head is in contact with an electrode pad of the microwave integrated circuit. Because the shielding member is electrically connected to the probe stage during probing and thereby a ground plane is produced above the microwave integrated circuit as in a packaged state, the conditions upon the measurement of microwave characteristics in the on-wafer state and in the packaged state are approximately the same.

Abstract: The object of the present invention is to provide a small precise insulating type current sensor system.Sensing portion is composed of a magnetoresistance element, a bias conductor, and a current conductor, all of which are arranged on an insulating substrate. Resistance change of the magnetoresistance element is taken into an amplifier, and an output of the amplifier flows as a bias current to the bias conductor. When a current flows in the current conductor, the current causes a magnetic field and the resistance of the magnetoresistance element must be changed. However a feedback of the resistance change by the amplifier changes the bias current and controls the bias current for keeping the magnetic field of the magnetoresistance element at a constant. Accordingly, the insulation type current sensing with a wide range and preferable preciseness without being affected with a hysteresis of the magnetoresistance element and Barkhausen noise became possible.

Abstract: A digital, DC voltage meter device utilized for metering electric power on a locomotive system. This invention will eliminate the need to use a hand held meter to perform these functions. The meter is permanently built into the Voltage test panel, replacing test receptacles with a large 7/10' LED display that can be read day or night. It is designed to operate in temperatures from -32 degrees Fahrenheit to 158 degrees Fahrenheit. A three position spring loaded switch returning to the off position is used to operate the meter. The present invention is a custom DC voltage meter that is capable of measuring two voltage ranges on a locomotive system; 0-1500 Volts ("V") for main generator voltage can be measured when the switch is in the top position; and 0-75 millivolts ("mV") for load test shunt millivoltage can be measured when the switch is in the bottom position. The meter is also capable of displaying the Dynamic Braking Voltage when the locomotive's dynamic brake is engaged.

Abstract: A device for measuring an electrical quantity of a system under measurement including a Hall element equipped with a pair of current input terminals and a pair of voltage output terminals. In the Hall element, four equivalent resistances are formed. The device also includes a device for applying a magnetic field proportional to a value of a first current on the Hall element, and a current supply circuit for flowing a second current between the current input terminals. The device further includes an output circuit for detecting a first voltage appearing between the output voltage terminals and outputting the first voltage as a measured value corresponding to the electrical quantity, and an offset compensation circuit for detecting an offset appearing between the voltage output terminals for varying one of the four equivalent resistances based on the offset thus detected so as to compensate the offset.

Abstract: The portable live line tool tester of the present invention allows high voltage to be applied to discrete segments of a live-line tool. If the tool has become conductive due to damage or contamination, a leakage meter will detect the flow of current. The tool can then be tested in increments to locate the damaged section. The invention further includes electrical safely interlock circuitry so that the tester is rendered inoperable unless it is correctly rigged and safety shielding is in place. The tester can be folded into an easily portable unit, making it unnecessary to ship tools to a laboratory for testing.

Abstract: An electronic circuit test system for measuring the response to electrical signals applied to an electronic circuit under test is provided with a docking system for facilitating mechanical and electrical connections. A docking cone is mounted to a fixture board of the electronic circuit test system. The docking cone enters a tunnel in a test head of the electronic circuit test system as the fixture board is moved toward the test head. The docking cone guides connectors mounted to the fixture board into connection with mating connectors mounted to a load board and a connector support disk comprising the test head. The docking system increases the repeatability and reliability of mechanical and electrical connections and reduces the risk of damage to electrical connectors of the electronic circuit test system.

Abstract: An method of positioning an E-O probe applied to an apparatus for the measurement of voltage. In the first step, the relative position of the E-O probe against the magnifying optical system in the first condition of being focused the magnifying optical system on the base of the E-O probe, and the focal point difference between the focal plane of the magnifying optical system in the second condition that the E-O probe is substantially out of the optical path for observation of the surface of the device and the focal plane in the first condition are stored. The relative position and the focal point difference are fixed in the apparatus for the measurement of voltage regardless of the device to be measured.

Abstract: A test fixture (10) for mounting electrical circuit boards (CB, CB') and placing a plurality of test locations of the circuit board in electrical engagement with respective probe test pins (16) of an array of such pins has a cam mechanism (22) mounted in an integrally formed modular frame (20) of an upper assembly (12). The upper assembly (12) is pivotably mounted on a lower base assembly (14) and latched thereto by a latch assembly (28). A circuit board to be tested is placed over an array of longitudinally depressable pins (16), the upper assembly (28) pivoted to a closed position and latched by latch mechanism (28). Handle (22k) attached to the cam assembly (22) is then rotated causing blocks (22f) to slide in rectilinear track (22e) of slide plate (22c) while translating rotary motion of the cams members (22g) to a vertical motion of a pusher plate (30) attached to the slide plates (22c).

Abstract: For potential-free d.c. and a.c. measurement, a terminal for connecting live conductors with at least two clamping components for the electrical conductors and a connecting member securing the clamping components together has one or more magnet field sensors arranged at a predetermined distance from the connecting member securing the clamping components of the electrical conductors together.