Abstract: A storage device includes: a memory unit and a first pillar. The first pillar includes: a first region having a third portion between a first and a second portion respectively having a first and a second maximum diameter, and having a first minimum diameter, the first and second portions defining a first distance; a second region having a sixth portion between a fourth and a fifth portion respectively having a third and a fourth maximum diameter, and having a second minimum diameter, the fourth and fifth portions defining a second distance; and a third region between the first and second regions, having a ninth portion between a seventh and an eighth portion respectively having a fifth and a sixth maximum diameter, and having a third minimum diameter, the seventh and eighth portions defining a third distance shorter than each of the first and second distances.

Abstract: A display panel having a pixel region includes a base substrate, a plurality of pixel circuits located in the pixel region, and a plurality of light-emitting structures located in the pixel region. Each pixel circuit includes a storage capacitor and a plurality of transistors. The light-emitting structures are configured to emit light of at least three primary colors. Each light-emitting structure includes a light-emitting device. Each pixel circuit is coupled to the light-emitting device in a corresponding light-emitting structure, and a surface of the light-emitting device proximate to the base substrate is a light exit surface. Among the light-emitting structures, an orthogonal projection of an effective light-emitting region, on the base substrate, of the light-emitting device in a first light-emitting structure with a shortest light-emitting wavelength, is spaced apart from orthogonal projections of all storage capacitors of the plurality of pixel circuits on the base substrate.

Abstract: A display apparatus including a display area for displaying an image and a peripheral area that is a non-display area includes a base substrate, a first data line disposed in the display area on the base substrate, a first connecting line at least partially disposed in the display area on the base substrate and electrically connected to the first data line through a connection contact hole, a data pad disposed in the peripheral area, and a first data spider line disposed in the peripheral area between the data pad and the display area and electrically connected to the first connecting line and the data pad.

Abstract: A method for selectively depositing a metallic film on a substrate comprising a first dielectric surface and a second metallic surface is disclosed. The method may include, exposing the substrate to a passivating agent, performing a surface treatment on the second metallic surface, and selectively depositing the metallic film on the first dielectric surface relative to the second metallic surface. Semiconductor device structures including a metallic film selectively deposited by the methods of the disclosure are also disclosed.

Abstract: A TFT layer; a light-emitting element layer including a first electrode, a light-emitting layer, and a second electrode; a wavelength conversion layer formed above the light-emitting element layer and being configured to convert a color of light from the light-emitting layer; a dielectric layer formed above the wavelength conversion layer; and a particle layer formed above the dielectric layer and including metal nanoparticles including a core and a shell around the core.

Abstract: An image sensor includes a substrate having first and second surfaces, pixel regions arranged in a direction parallel to the first surface, first and second photodiodes isolated from each other in each of the pixel regions, a first device isolation film between the pixel regions, a pair of second device isolation films between the first and second photodiodes and extending from the first device isolation film, a doped layer adjacent to the pair of second device isolation films and extending from the second surface to a predetermined depth and spaced apart from the first surface, the doped layer being isolated from the first device isolation film, and a barrier area between the pair of second device isolation films and having a potential greater than a potential of a portion of the substrate adjacent to the barrier area.

Abstract: Power supply apparatus (10) comprising a circuit board (11) and one or more power devices (12) attached to a first surface (11a) of the circuit board (11). A plate (14a) composed of a thermally conductive plastic faces the first surface of the circuit board (11). A thermally conductive encapsulant (15) is provided between the first surfaces (11a) of the circuit board (11) and the plate (14a). The circuit board (11) comprises one or more heat-spreading layers (212*,213*) configured to enhance heat transfer in directions parallel to the first surface (11a) of the circuit board (11). The first surface (14aa?) of the plate (14a) may also be irregular and comprises one or more first regions (32) and one or more second regions (31) that are further from the first surface (11a) of the circuit board (11) than the one or more first regions (32), with the one or more power devices (12) being aligned with the one or more second regions (31).

Abstract: A display device may comprise: a substrate including a driving area and a pixel area; a first transistor on the driving area; a second transistor on the pixel area; a first hydrogen diffusion barrier film between a first active layer and a first gate insulating film of the first transistor; and a second hydrogen diffusion barrier film between a second active layer and a second gate insulating film of the second transistor.

Abstract: A light source assembly is provided, including a substrate; a light-emitting element disposed on the substrate; and an optical film at least partially overlapped with the substrate. A diffuser film is at least partially overlapped with the optical film, wherein a haze of the diffuser film is greater than 85%, and a thickness of the diffuser film ranges from 0.04 mm to 0.35 mm. The optical film and the diffuser film are capable of transmitting at least a part of light emitted from the light-emitting element.

Abstract: In embodiments, an optoelectronic device comprises a substrate formed of magnesium oxide, and a multi-region stack epitaxially deposited upon the substrate. The multi-region stack may comprise a non-polar crystalline material structure along a growth direction, or may comprise a crystal polarity having an oxygen-polar crystal structure or a metal-polar crystal structure along the growth direction. In some cases, at least one region of the multi-region stack is a bulk semiconductor material comprising Mg(x)Zn(1-x)O. In some cases, at least one region of the multi-region stack is a superlattice comprising MgO and Mg(x)Zn(1-x)O.

Abstract: An organic light-emitting device may include: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer may include an emission layer, the emission layer may include a first compound, a second compound, and a fluorescent dopant, the first compound, the second compound, and the fluorescent dopant may be different from one another, the total weight of the first compound and the second compound may be greater than a weight of the fluorescent dopant, and the first compound may be a compound represented by Formula 1: Formula 1 may be understood by referring to the description of Formula 1 provided herein.

Abstract: This disclosure describes a method for fabricating a plurality of semiconductor devices in a semiconductor wafer includes: bowing a semiconductor wafer including a substrate by covering the substrate with a strained layer; forming trenches at locations in scribe lines of the semiconductor wafer, the scribe lines identifying areas between adjacent dies on the semiconductor wafer; and reducing the bowing of the semiconductor wafer by filling the trenches with a stress-compensation material.

Abstract: An embodiment of the present application discloses an array substrate and a manufacturing method thereof. The array substrate includes an underlay, an active layer, a gate electrode insulation layer, and a metal layer. A first through hole, second through holes, third through holes, and a fourth through hole are defined in the gate electrode insulation layer. The second through holes and third through holes are arranged at intervals such that partial regions of the active layer are shielded by the gate electrode insulation layer to prevent them from corrosion of an etching solution to guarantee a normal electrical connection of the active layer and a source electrode and a drain electrode and improve a yield rate of the array substrate.

Abstract: A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

Abstract: A storage element includes a first ferromagnetic layer; a second ferromagnetic layer; a nonmagnetic layer interposed between the first ferromagnetic layer and the second ferromagnetic layer in a first direction; a first wiring that extends in a second direction different from the first direction and together with the nonmagnetic layer sandwiches the first ferromagnetic layer in the first direction; and an electrode that together with the nonmagnetic layer sandwiches the second ferromagnetic layer in at least a part in the first direction, wherein the electrode is in contact with at least a part of a lateral side surface of the second ferromagnetic layer.

Abstract: A display device includes pixels disposed in a display area and including first and second pixels that are adjacent to each other in a first direction, and a first integrated bank pattern disposed between the first and second pixels. Each of the pixels includes a first electrode and a second electrode that are spaced apart from each other along the first direction in a light emitting area and extend in a second direction, a first bank pattern portion overlapping the first electrode, and a second bank pattern portion overlapping the second electrode. The first integrated bank pattern includes a second bank pattern portion disposed at the first pixel, a first bank pattern portion disposed at the second pixel, and a protrusion extending in the second direction in a boundary area between the first pixel and the second pixel.

Abstract: Provided is an organic light-emitting device including: an anode; a cathode facing the anode; two or more light-emitting layers provided between the anode and the cathode and each having a maximum light emission peak of ?500 nm (?500 nm emission layer); and a light-emitting layer provided between the two or more ?500 nm emission layers, and having a maximum light emission peak at >500 nm (>500 nm emission layer), where a distance from the anode to the ?500 nm emission layer most adjacent to the anode is 100 nm to 200 nm, the distance from the anode to the ?500 nm emission most adjacent to the cathode is three to four times the distance from the anode to the ?500 nm emission layer most adjacent to the anode, and an N-type charge generation layer including an alkali metal and a P-type charge generation layer including a material with an electron affinity of ?4.8 eV are provided between each of the ?500 nm emission layers and the emission >500 nm emission layer.

Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: A semiconductor device with favorable electric characteristics is provided. The semiconductor device includes a first insulating layer, a second insulating layer, an oxide semiconductor layer, and first to third conductive layers. The oxide semiconductor layer includes a region in contact with the first insulating layer, the first conductive layer is connected to the oxide semiconductor layer, and the second conductive layer is connected to the oxide semiconductor layer. The second insulating layer includes a region in contact with the oxide semiconductor layer, and the third conductive layer includes a region in contact with the second insulating layer. The oxide semiconductor layer includes first to third regions. The first region and the second region are separated from each other, and the third region is located between the first region and the second region. The third region and the third conductive layer overlap with each other with the second insulating layer located therebetween.

Abstract: An imaging device that includes a wiring substrate, an image sensor package mounted on the wiring substrate, a package frame attached to a light receiving surface side of the image sensor package, and a lens holder arranged to cover the package frame and holding a lens unit so that the lens unit faces the light receiving surface of the image sensor package. The package frame includes a material having a larger coefficient of linear expansion than a material of the lens holder, and includes a wall portion that extends in a direction perpendicular to the wiring substrate toward the wiring substrate. A gap is provided between the wall portion of the package frame and the image sensor package, and between an end of the wall portion of the package frame and the wiring substrate. The lens holder includes a wall portion facing the wall portion of the package frame.