Patents Examined by Boris L. Chervinsky
  • Patent number: 8699235
    Abstract: The Mobile Phone/PDA Security Masking Box is a sound insulated box for use as a temporary storage location for cellular and other mobile devices in locations at which confidential and sensitive conversations and discussions are being conducted. A pink/white noise generating device within the box generates a masking noise such that the cellular or other mobile devices inside the box are unable to pick up or record conversations outside the box.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: April 15, 2014
    Assignee: CDD Ventures LLC
    Inventor: Ali H Soufan
  • Patent number: 8692128
    Abstract: A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: April 8, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ping-Sheng Su, Jun Chen, Feng-Jun Qi, Qing Wang
  • Patent number: 8652629
    Abstract: A cross arm is provided, for use in a support structure for conductors within an electrical grid. The cross arm is made of weather resistant glass fiber reinforced two component polyurethane based polymers and has a “C” cross sectional shape typically arranged in a double configuration. Pairs of the cross arms are attached to utility poles in a parallel position on opposite sides of the utility pole to meet predefined design conditions. Alternatively, a single cross arm may be attached to a utility pole.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: February 18, 2014
    Assignees: FRP Transmission Innovations Inc., British Columbia Hydro and Power Authority
    Inventors: Grant Robert Lockhart, Janos Csaba Toth, Ralph Walter Ulm, Adelana Gilpin-Jackson
  • Patent number: 8633384
    Abstract: An electrical box including an outer shell having at least four sides extending from a rear wall to an open top at a front surface and a box mounting tab protruding from two of the at least four sides, an inner shell having at least four sides, a front surface, and at least two device securing protrusions each having an aperture adjacent to each of the at least two sides, each device securing aperture including an opening extending toward the open top of the electrical box, the inner shell movable within the outer shell in a direction away from the rear wall, and wherein the inner shell front surface and the outer shell front surface are coplanar when the inner shell is in a rearmost position.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: January 21, 2014
    Assignee: Hubbell Incorporated
    Inventors: Marcus J. Shotey, Jeffrey P. Baldwin
  • Patent number: 8629356
    Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: January 14, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chwen Yu, Yung-Ti Hung, Kuo-An Yeh, Tzu-Sou Chuang, Chien-Teh Huang
  • Patent number: 8598452
    Abstract: The present invention is oriented to solving existing problems in the ground systems of aerial networks of electric energy distribution, providing a pole with an incorporated ground system. Said pole has a ground lead embedded in its structure, and two connection terminal boards fitted in the upper and lower sections. This ground system completely avoids the subtraction of the lead, is effective in the grounding and ensures the efficient performance of the electrical distribution system by guaranteeing an effective connection to the ground system with operation, protection and control elements that are installed in the distribution network.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: December 3, 2013
    Assignee: Codensa S.A. ESP
    Inventors: Gustavo Alfonso Gómez Vanegas, Luis Eduardo Vargas Rodríguez, Milton Fredy Salgado Ramírez
  • Patent number: 8599575
    Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: December 3, 2013
    Assignee: DJM Electronics, Inc
    Inventor: Stephen D. McNally
  • Patent number: 8575620
    Abstract: The present invention provides a circuit board with a reduced circuit area, and a display device comprising the circuit board and a narrower picture frame. The circuit board of the present invention comprises: a bottom gate thin film transistor comprising a first semiconductor layer, a first gate electrode, a first source electrode, and a first drain electrode; and a top gate thin film transistor comprising a second semiconductor layer, a second gate electrode, a second source electrode, and a second drain electrode, wherein the first semiconductor layer and the second semiconductor layer are formed from the same material, and the first drain electrode or the first source electrode and the second gate electrode are connected without interposing any other thin film transistor therebetween, and have the same electric potential.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: November 5, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Chikao Yamasaki, Shinya Tanaka, Tetsuo Kikuchi, Junya Shimada
  • Patent number: 8568151
    Abstract: A concealable connector disposed in a housing of an electronic device includes two upright sidewalls, a guiding groove, a guiding rod, and a sliding module. The upright sidewalls are spaced apart from each other and are disposed in the housing. The guiding groove is formed in the housing and is interposed between the upright sidewalls. The guiding rod has a first end extending slidably into the guiding groove, and a second end connected to the sliding module. The sliding module has input/output connectors disposed therein. The sliding module is slidable relative to the upright sidewalls between a slid-out state, in which the sliding module projects outwardly of the housing and the input/output connectors are exposed from the housing, and a concealed state, in which the input/output connectors are concealed by the housing.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: October 29, 2013
    Assignee: Wistron Corporation
    Inventor: Yen-Chang Cheng
  • Patent number: 8510935
    Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: August 20, 2013
    Inventor: Joseph C. Fjelstad
  • Patent number: 8472178
    Abstract: A memory retention and support system includes a memory chassis. A board is mounted to the memory chassis. A memory connector is mounted to the board and includes a pair of guide members at opposite distal ends of the memory connector and a pair of opposing outer walls extending between the guide members. A connector reinforcing member engages the memory connector to urge the guide members toward each other and to urge the opposing outer walls toward each other. A damping member is operable to be positioned adjacent to and spaced apart from the memory connector in order to engage a memory module when the memory module is coupled to the memory connector. The connector reinforcing member and the damping member act to resist a discontinuities between a plurality of memory contacts on the memory module and a plurality of connector contacts on the memory connector.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: June 25, 2013
    Assignee: Dell Products L.P.
    Inventors: Corey D. Hartman, Brian T. Whitman, Peter Heinrich, Russell Smith, Scott Munroe Deane, Timothy Spencer
  • Patent number: 8471152
    Abstract: A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: June 25, 2013
    Assignee: Fujitsu Limited
    Inventors: Yoshihiro Mizuno, Norinao Kouma, Hisao Okuda, Hiromitsu Soneda, Tsuyoshi Matsumoto, Osamu Tsuboi
  • Patent number: 8440918
    Abstract: An assembly includes at least one electronic component, a bus bar electrically connected to the electronic component and having a connection portion, a case receiving both the electronic component and the bus bar and having first and second openings, and a drop prevention member having a drop prevention wall. The connection portion of the bus bar is to be connected with a terminal of an external connector by engaging a first engaging member to be placed inside the case through the first opening and a second engaging member provided in the external connector. In the assembly, there is defined, by the drop prevention wall, the connection portion of the bus bar, and part of the external connector, a confinement space for confining the first engaging member and thereby preventing it from dropping outside the confinement space during establishment of the engagement between the first and second engaging members.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: May 14, 2013
    Assignee: Denso Corporation
    Inventors: Kazurou Matsumoto, Akira Nakasaka
  • Patent number: 8085541
    Abstract: This document describes apparatus and methods for supplying electrical operating power to a thin form-factor display device, such as a flat panel video display device. In an illustrative example, components of a power supply for a flat panel video display are arranged to be substantially coplanar and adjacent to a display screen. The display screen and the power supply components may share a common housing. The power supply may provide appropriate electrical operating voltages to operate the display device. In some embodiments, an external thermally conductive panel of the display device is thermally coupled to components of the power supply through a low thermal impedance interface.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: December 27, 2011
    Assignee: VLT, Inc.
    Inventors: Patrizio Vinciarelli, Michael B. Lafleur
  • Patent number: 8050033
    Abstract: An electronic apparatus comprises a housing that contains a heat-generating component, a heat radiating component and a fan that is adapted to apply air to the heat radiating component and including an inlet port and an outlet port. The electronic apparatus further comprises a support member situated within the housing and arranged so that that the outlet port of the fan faces the heat radiating component. Being coupled to the fan and the heat radiating component, the support member comprises an opening portion to direct air to the fan, where the opening portion is aligned with the inlet port of the fan.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: November 1, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kenichi Ishikawa
  • Patent number: 8050047
    Abstract: An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: November 1, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Seng Guan Chow, Il Kwon Shim, Byung Joon Han, Kambhampati Ramakrishna
  • Patent number: 8035974
    Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: October 11, 2011
    Assignee: Round Rock Research, LLC
    Inventors: David J. Corisis, Walter L. Moden, Terry R. Lee
  • Patent number: 8027163
    Abstract: A display device is disclosed. In one embodiment, the display device includes i) a display panel configured to display an image, ii) a chassis base configured to support the display panel, iii) an auxiliary chassis disposed between the display panel and the chassis base, wherein one end of the auxiliary chassis covers and contacts an edge of the chassis base. The display device further includes i) a driving board disposed at the back of the chassis base and configured to drive the display panel and ii) at least one signal transmission member comprising at least one circuit device and configured to electrically connect the display panel and the driving board, wherein one side of the at least one signal transmission member is supported by the auxiliary chassis, and wherein the one side faces the edge of the chassis base.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: September 27, 2011
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Won-Kyu Bang
  • Patent number: 8023278
    Abstract: A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: September 20, 2011
    Assignee: Asustek Computer Inc.
    Inventor: Ching-Jen Wang
  • Patent number: 8018737
    Abstract: The invention provides a connecting structure of a circuit board, a connecting part of the circuit board, and an electronic device capable of alleviating a temperature difference between the connecting parts under hot pressure welding. A connecting structure 10 of a circuit board comprises a first circuit board 11 and a second circuit board 12, with a first connecting part 15 and a second connecting part 16 opposedly disposed via an adhesive 13. The first connecting part 15 and the second connecting part 16 are pinched by a pair of pressurizing jigs 20 and subjected to hot pressure welding so that first circuit patterns 17 and second circuit patterns 18 are in contact with each other.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: September 13, 2011
    Assignee: Panasonic Corporation
    Inventors: Yoshihito Fujiwara, Masahito Kawabata