Abstract: The Mobile Phone/PDA Security Masking Box is a sound insulated box for use as a temporary storage location for cellular and other mobile devices in locations at which confidential and sensitive conversations and discussions are being conducted. A pink/white noise generating device within the box generates a masking noise such that the cellular or other mobile devices inside the box are unable to pick up or record conversations outside the box.

Abstract: A printed circuit board, comprises an insulative substrate, a grounding layer located on a surface of the insulative substrate and defining a through slot, a plurality of conductive pins located on an outer surface of the printed circuit board; and a fence layer located between the conductive path and the grounding layer. Each conductive pin defines at least a soldering portion. The soldering portion is alignment to the through slot along a vertical direction.

Abstract: A cross arm is provided, for use in a support structure for conductors within an electrical grid. The cross arm is made of weather resistant glass fiber reinforced two component polyurethane based polymers and has a “C” cross sectional shape typically arranged in a double configuration. Pairs of the cross arms are attached to utility poles in a parallel position on opposite sides of the utility pole to meet predefined design conditions. Alternatively, a single cross arm may be attached to a utility pole.

Abstract: An electrical box including an outer shell having at least four sides extending from a rear wall to an open top at a front surface and a box mounting tab protruding from two of the at least four sides, an inner shell having at least four sides, a front surface, and at least two device securing protrusions each having an aperture adjacent to each of the at least two sides, each device securing aperture including an opening extending toward the open top of the electrical box, the inner shell movable within the outer shell in a direction away from the rear wall, and wherein the inner shell front surface and the outer shell front surface are coplanar when the inner shell is in a rearmost position.

Abstract: A magnetic field shielding raised floor panel having a plurality of grain-oriented electrical steel (GOES) sections. The orientation of each GOES section is parallel to a top surface of the section. The plurality of GOES sections can include sidewall and lip portions. The plurality of GOES sections can be perforated to permit air flow through the GOES section. Openings in adjacent perforated GOES sections do not substantially overlap.

Abstract: The present invention is oriented to solving existing problems in the ground systems of aerial networks of electric energy distribution, providing a pole with an incorporated ground system. Said pole has a ground lead embedded in its structure, and two connection terminal boards fitted in the upper and lower sections. This ground system completely avoids the subtraction of the lead, is effective in the grounding and ensures the efficient performance of the electrical distribution system by guaranteeing an effective connection to the ground system with operation, protection and control elements that are installed in the distribution network.

Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.

Abstract: The present invention provides a circuit board with a reduced circuit area, and a display device comprising the circuit board and a narrower picture frame. The circuit board of the present invention comprises: a bottom gate thin film transistor comprising a first semiconductor layer, a first gate electrode, a first source electrode, and a first drain electrode; and a top gate thin film transistor comprising a second semiconductor layer, a second gate electrode, a second source electrode, and a second drain electrode, wherein the first semiconductor layer and the second semiconductor layer are formed from the same material, and the first drain electrode or the first source electrode and the second gate electrode are connected without interposing any other thin film transistor therebetween, and have the same electric potential.

Abstract: A concealable connector disposed in a housing of an electronic device includes two upright sidewalls, a guiding groove, a guiding rod, and a sliding module. The upright sidewalls are spaced apart from each other and are disposed in the housing. The guiding groove is formed in the housing and is interposed between the upright sidewalls. The guiding rod has a first end extending slidably into the guiding groove, and a second end connected to the sliding module. The sliding module has input/output connectors disposed therein. The sliding module is slidable relative to the upright sidewalls between a slid-out state, in which the sliding module projects outwardly of the housing and the input/output connectors are exposed from the housing, and a concealed state, in which the input/output connectors are concealed by the housing.

Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

Abstract: A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.

Abstract: A memory retention and support system includes a memory chassis. A board is mounted to the memory chassis. A memory connector is mounted to the board and includes a pair of guide members at opposite distal ends of the memory connector and a pair of opposing outer walls extending between the guide members. A connector reinforcing member engages the memory connector to urge the guide members toward each other and to urge the opposing outer walls toward each other. A damping member is operable to be positioned adjacent to and spaced apart from the memory connector in order to engage a memory module when the memory module is coupled to the memory connector. The connector reinforcing member and the damping member act to resist a discontinuities between a plurality of memory contacts on the memory module and a plurality of connector contacts on the memory connector.

Abstract: An assembly includes at least one electronic component, a bus bar electrically connected to the electronic component and having a connection portion, a case receiving both the electronic component and the bus bar and having first and second openings, and a drop prevention member having a drop prevention wall. The connection portion of the bus bar is to be connected with a terminal of an external connector by engaging a first engaging member to be placed inside the case through the first opening and a second engaging member provided in the external connector. In the assembly, there is defined, by the drop prevention wall, the connection portion of the bus bar, and part of the external connector, a confinement space for confining the first engaging member and thereby preventing it from dropping outside the confinement space during establishment of the engagement between the first and second engaging members.

Abstract: This document describes apparatus and methods for supplying electrical operating power to a thin form-factor display device, such as a flat panel video display device. In an illustrative example, components of a power supply for a flat panel video display are arranged to be substantially coplanar and adjacent to a display screen. The display screen and the power supply components may share a common housing. The power supply may provide appropriate electrical operating voltages to operate the display device. In some embodiments, an external thermally conductive panel of the display device is thermally coupled to components of the power supply through a low thermal impedance interface.

Abstract: An electronic apparatus comprises a housing that contains a heat-generating component, a heat radiating component and a fan that is adapted to apply air to the heat radiating component and including an inlet port and an outlet port. The electronic apparatus further comprises a support member situated within the housing and arranged so that that the outlet port of the fan faces the heat radiating component. Being coupled to the fan and the heat radiating component, the support member comprises an opening portion to direct air to the fan, where the opening portion is aligned with the inlet port of the fan.

Abstract: An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: A display device is disclosed. In one embodiment, the display device includes i) a display panel configured to display an image, ii) a chassis base configured to support the display panel, iii) an auxiliary chassis disposed between the display panel and the chassis base, wherein one end of the auxiliary chassis covers and contacts an edge of the chassis base. The display device further includes i) a driving board disposed at the back of the chassis base and configured to drive the display panel and ii) at least one signal transmission member comprising at least one circuit device and configured to electrically connect the display panel and the driving board, wherein one side of the at least one signal transmission member is supported by the auxiliary chassis, and wherein the one side faces the edge of the chassis base.

Abstract: A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.

Abstract: A facility is disclosed for cooling a detection device. In at least one embodiment, the facility includes at least one first cooling unit, through which a thermal contact to the detection device is able to be established and through which heat arising during operation of the detection device is able to be removed; and at least one second cooling unit, which is arranged so that heat from the environment of the detection device can be discharged through it. In at least one embodiment, this has the advantage of largely shielding the first cooling unit from incident heat which allows the detection device to be efficiently cooled.