Abstract: According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.

Abstract: A sealed electrical enclosure used in hazardous locations for enclosing circuit breakers having a bottom housing and a top housing with a labyrinth seal or joint formed therebetween, the bottom housing adapted to receive one or more circuit breakers, a first metal bus extending from a point internal to the bottom housing through a first end wall to a point external thereto, and a second metal bus extending from a point internal to the bottom housing through a second end wall to a point external to thereto, where the first and second metal buses are adapted to contact first and second electrical terminals of a circuit breaker when placed within the bottom housing, and a first vent positioned on the top housing for dissipating pressure buildup, wherein the top housing is removably secured to the bottom housing to allow for removal and replacement of a circuit breakers within the housing.

Abstract: System and method are provided for cooling an electronics rack. A modular cooling unit (MCU) is associated with the rack to provide system coolant to an electronics subsystem and a bulk power assembly. The MCU includes a liquid-to-liquid heat exchanger, and defines portions of facility and system coolant loops. Chilled coolant from a facility source is passed through the liquid-to-liquid heat exchanger to cool system coolant flowing through the system coolant loop. The system also includes an air-to-liquid heat exchanger in fluid communication with the system coolant loop, a pump in fluid communication with the system coolant loop, and a controller. The controller controls operation of the pump to adjust flow of system coolant through the system coolant loop dependent upon a mode of operation. In a standby mode, system coolant flows through the air-to-liquid heat exchanger at a lower flow rate, and expels heat to ambient air.

Abstract: A cooling unit includes: a heat absorbing section which absorbs heat from a heat-producing element; a heat radiating section which defines a ventilation area and radiates the heat, which is transferred from the heat absorbing section, into air passing through the ventilation area; and a fan having a blowing opening, and blowing air toward the ventilation area from the blowing opening while allowing the air to pass by a predetermined element. The cooling unit further includes: a filter which is detachably installed between the blowing opening and the ventilation area to remove foreign substances present in the air blown to the ventilation area from the blowing opening; and a filter fixing section which is integral with the filter and extended astride the element, while allowing the filter to be removably fixed.

Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module.

Abstract: A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.

Abstract: Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.

Abstract: Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

Abstract: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Abstract: A cooling system may include a fan which may be placed near the center of the system board. The fan may include bottom inlet and may draw air through an opening in the bottom skin of the computer system and may generate a positive pressure within the computer system. Exhaust vents may be positioned at the periphery.

Abstract: The present invention aims to appropriately cool an operation unit and to suppress power consumption and noise according to the configuration and the operation state in a computer system of an enclosure. A plurality of system cooling fans for cooling the operation unit of the computer system installed in the enclosure and an enclosure management module for controlling the rotation of each system cooling fan are arranged, where the enclosure management module stores in advance the supply cooling amount which is to be supplied to the operation unit by each system cooling fan, acquires information related to a temperature of the operation unit and calculates a necessary cooling amount which is to be required in the operation unit based on the information, and determines the rotation number of each system cooling fan based on the supply cooling amount and the necessary cooling amount.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: A portable electronic device includes a screen module, a main body module and an input/output module. The screen module is pivotally connected with the body module. The input/output module is electrically connected with the main body module. An actuating element is disposed at a bottom of the screen module. When the screen module is opened respectively to the body module to be opened, the actuating element is driven to swing to push a front end of the input/output module to be lifted to drive the input/output module to be out of a state that the keyboard abuts against the main body module. Therefore, the portable electronic device is easy to be operated. Moreover, the heat dissipation is improved to keep the internal temperature low and reduce energy consumption.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: A switching power supply includes: a coil; and a pedestal fixed to the coil, the pedestal includes a supporting member configured to support the coil in such a manner as to form a space through which air flows on a surface of the coil attached to the pedestal.

Abstract: There is disclosed a self-contained electronic apparatus containing at least some power-dissipating components which may require cooling. The self-contained electronic apparatus may also include a removable and replaceable energy storage module. The removable and replaceable energy storage module may include a power element to provide electrical energy for the self-contained electronic apparatus and a cooling element to cool at least a portion of the power dissipating components.

Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.

Abstract: In one example, an electronic module includes a printed circuit board and a housing at least partially enclosing the printed circuit board. The printed circuit board includes a heat-generating component. The housing includes a first case and a second case attached to the first case. The first and second cases cooperatively define a sealed cavity containing a fluid. The second case includes a thermal contact structure positioned proximate to the heat-generating component.

Abstract: A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.

Abstract: An electronic device is directly disposed on a lamp base and is powered by the lamp base. The electronic device includes a connection base matching with a specification of the lamp base, and an air-flow generator. The connection base may be directly screwed into the lamp base to power the air-flow generator, so that the air-flow generator operates to generate an air flow.