Abstract: A facility is disclosed for cooling a detection device. In at least one embodiment, the facility includes at least one first cooling unit, through which a thermal contact to the detection device is able to be established and through which heat arising during operation of the detection device is able to be removed; and at least one second cooling unit, which is arranged so that heat from the environment of the detection device can be discharged through it. In at least one embodiment, this has the advantage of largely shielding the first cooling unit from incident heat which allows the detection device to be efficiently cooled.

Abstract: An electronic device including a circuit board and a heat dissipating module is provided. The circuit board has a thermal source. The heat dissipating module is disposed on the thermal source and has a heat conducting unit, a first heat dissipating unit and a second heat dissipating unit. The heat conducting unit has a heat conducting plate and a heat pipe. A first surface of the heat conducting plate contacts the thermal source. A first end of the heat pipe is connected to the heat conducting plate. The first heat dissipating unit is connected to a second end of the heat pipe. The second heat dissipating unit is movably disposed on a second surface of the heat conducting plate. The heat dissipating module in the invention can achieve the dual thermal dissipation efficiency via the different cooling modes so as to satisfy the heat dissipating requirement of high speed processors.

Abstract: Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM.

Abstract: An electrical device, particularly for driving a motively and/or regeneratively operable electric machine, having at least one switching-element module, which may be for inverting and/or rectifying electric currents, the switching-element module being able to be cooled by a cooling device and resting at least indirectly thereon, a fixation element, at least one conductor, as well as the switching-element module and cooling device being disposed one above the other.

Abstract: One embodiment of the present invention relates to a modular computer system for use in residential, recreational, and commercial regions. The system is a computer system disposed within an existing outlet receptacle housing. The receptacle includes a conventional NEMA standard OS1 and OS2 type electrical housing and electrical line designed to accommodate a residential or commercial light switch, electrical outlet, etc. The computer system is electrically coupled to the electrical line disposed within the housing of the receptacle and includes a mechanically extendable expansion bus configured to mechanically support and data inter-couple a set of modules for providing computer functionality. The expansion bus can be extended to access the modules or collapsed within the receptacle so as to be externally visually obscured by an interface module or cover. The computer system is configured to dynamically detect and data couple with other modular computer systems in a particular region.

Abstract: Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.

Abstract: An arrangement is disclosed for a motor controller, the arrangement including a number of power semiconductors and cooling elements, the cooling elements being connected to the power semiconductors for cooling them. The power semiconductors and the cooling elements are disposed around a center axis of the arrangement in such a manner that they demark a channel around the center axis from at least three sides, to which channel cooling surfaces of the cooling elements extend and in which the cooling medium is able to flow in the direction of the center axis, and the power semiconductors extend from the connections between the power semiconductors and the cooling elements substantially away from the center axis. The arrangement can further include at least one choke disposed in the channel demarked around the center axis.

Abstract: An electronic device includes a base and a sidewall attached to the base. The sidewall includes a heat dissipating area defining a plurality of vents, a sliding plate slidably coupled to an inner side of the sidewall, and a controlling arm made of metal material having high coefficient of thermal expansion. The controlling arm is connected between the sliding plate and the sidewall, for driving the sliding plate to slide to cover or uncover the vents of the heat dissipating area according to different interior temperature of the electronic device.

Abstract: A display device according to the present invention comprises a display panel, a housing sealing around the display panel and making a display screen of the display panel viewable from outside, and a heat exchanger collecting heat, which is arranged on a rear surface side of the display panel. Another display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a display panel arranged in the accommodation room and including a display screen viewable from a front surface side of the housing, a heat exchanger collecting heat generated from the display panel and arranged on a rear surface side of the display panel, and a second heat exchanger releasing heat collected by the heat exchanger to outside of the housing and arranged outside the accommodation room.

Abstract: A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed.

Abstract: A blower for an electronic device includes a fan frame having an opening through which air passes for cooling the electronic device; a blade arranged in the opening of the fan frame; a motor configured to rotationally drive the blade; an attachment portion provided outside the opening of the fan frame, the attachment portion causing the fan frame to be attached to the electronic device; and a holder fixed to the electronic device and holding the attachment portion in a direction perpendicular to a rotational axis of the blade.

Abstract: An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

Abstract: A computer system includes a chassis, a motherboard, an isolation component, and a block. The chassis includes a bottom wall, and a sidewall connected to the bottom wall. The motherboard is secured to the chassis. A heat sink is secured to the motherboard for cooling a chip mounted on the motherboard. An isolation component is secured to the chassis between the bottom wall and the motherboard. The isolation component includes a bent piece attached to the side wall and positioned between the heat sink and the sidewall. A distance is defined between the bent piece and the heat sink. The block is attached to the bent piece and positioned between the heat sink and the sidewall to span the distance.

Abstract: An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader spaced from the first heat spreader, and a plurality of fins between the first and second heat spreaders. Each fin includes a pair of contacting portions, a pair of bending portions and a connecting portion each of which being flat. The contacting portions are respectively connected to the two heat spreaders. The bending portions respectively extend from the contacting portions towards each other. Each bending portion forms a rear end adjacent to the other bending portion. The connecting portion interconnects the rear ends of the bending portions at opposite ends thereof.

Abstract: A tray-type structure device includes a side plate, a front plate attached to a forward end of the side plate, having the functions of opening and closing, and positioned on the front side of a housing, a top plate attached to an upper end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, a bottom plate attached to a lower end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, and a back plate attached to a rearward end of the side plate, having the functions of opening and closing, and positioned on a side of the housing toward a backboard. The device has a tray structure having a tray-like shape formed by the front plate, top plate, bottom plate, side plate and back plate.

Abstract: Earthing equipment for a switchgear is comprised of a movable carrying cart, a switch portion, a manipulating portion, and a voltage detecting device. The earthing equipment is provided with: an upper conductor connected to any one of the movable electrode and the stationary electrode; a lower conductor connected to the other of the movable electrode and the stationary electrode, an earthing wire connecting the lower conductor to a terminal used for earthing of the switchgear; and an adaptor conductor being selectively connected to either a disconnection portion at a bus bar side or a disconnection portion at a cable side of the switchgear and is permitted to be selectively replaced on either upper or lower face of the upper conductor.

Abstract: The electric module includes a sealed enclosure (104), at least one item of electrical equipment (106) arranged in the sealed enclosure (104) and which, in operation, heats the atmosphere, and a secondary cooling circuit. The secondary circuit includes a guiding channel (108) arranged in the sealed enclosure (104) so as to guide the atmosphere which has been heated by the item or items of electrical equipment (106) towards its top opening (108B), and a passage (109) for the atmosphere delimited, at least partly, by the sealed enclosure (104) in order to enable a cooling of the atmosphere upon contact with the sealed enclosure (104). The guiding channel (108) is thermally isolated from the sealed enclosure (104).

Abstract: A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

Abstract: A strain reduction fixing structure includes a counterbore formed around a through-hole on a printed circuit board through which a fixing shaft for fixing the printed circuit board to a protection plate member penetrates.

Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material.