Abstract: An arc-resistant enclosure for electrical switchgear which includes solid front and back walls, a pair of solid side walls joined to the front and back walls, a ventilated roof joined to the side walls and the front and back walls, and a ventilated base joined to the side walls and the front and back walls. Internal partitions divide the space enclosed by the front, back, side, top and bottom walls into multiple compartments for housing different types of components. The ventilated base forms air-intake ports for admitting ambient air into a plurality of the compartments, and the ventilated roof forms air-exhaust ports for allowing air to be exhausted from the compartments. As air inside the enclosure is heated by the switchgear, the hot air rises through the switchgear compartments and is exhausted through the top air-exhaust ports, and replacement ambient air is drawn into the bottoms of the compartments through the air-intake ports.

Abstract: A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.

Abstract: A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink (1), reducing the number of parts, and reducing the man-hours of assembling is provided. In a motor controller including an extrusion heat sink (1), and a power semiconductor module (4) including a plurality of external electrode terminals which closely contact the extrusion heat sink (1), and a printed circuit board having the plurality of external electrode terminals connected thereto, die-casting frames (2) in which a pedestal (2a) for attaching a motor controller and bosses (2b) for attaching a printed circuit board are molded are provided at both ends of the extrusion heat sink (1).

Abstract: A metal-encapsulated, gas-insulated high-voltage switchgear assembly includes a three-phase encapsulated busbar housing, at least one busbar disposed in the housing, and at least three single-phase-encapsulated circuit breakers disposed horizontally. The assembly further includes a busbar splitting module having at least one three-phase connecting flange configured to connect to the busbar housing and at least three single-phase connecting flanges pointing downward configured to connect to the at least three single-phase-encapsulated circuit breakers and an outgoer splitting module having at least one three-phase flange and at least three single-phase flanges pointing downward and configured to connect the at least three single-phase-encapsulated circuit breakers to a three-phase-encapsulated outgoer housing.

Abstract: An air-cooled electronic device includes a device housing having a bottom surface, and a motorized fan having a fan housing having a mounting hole, and having a hook projection secured to the bottom surface, the hook projection shaped and dimensioned to engage the mounting hole, and having an abutment, with the abutment, the hook and the mounting hole being arranged to secure the fan housing in a position without screws, rivets, or other hardware.

Abstract: Mobile display apparatus and methods of operating mobile display apparatus are disclosed. Mobile display apparatus include a structure for attaching the display apparatus to a mobile structure and at least one display module coupled to the structure. The mobile display apparatus may include a ventilation feature. Methods of operating mobile display apparatus include disposing a plurality of removable display modules within a frame structure. A channel may be formed between the plurality of removable display modules and the frame structure and fluid may be forced through the channel and at least partially across the plurality of removable display modules.

Abstract: An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components.

Abstract: An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature.

Abstract: A system includes a plurality of motor controllers. A coolant system for the plurality of motor controller has a common inlet line, a common outlet line, and a plurality of parallel branch lines leading to the plurality of motor controllers. A control selectively increases a flow of coolant to certain of the plurality of motor controllers or limits the flow of coolant to others of the plurality of motor controllers. In addition, a method of operating a system of motor controllers is disclosed and claimed.

Abstract: According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the plurality of radiating elements receive or transmit electromagnetic energy. The cooling channels are formed by an internal surface of the radiating elements. The fluid inlet and the fluid outlet are in communication with each of the cooling channels. Each of the cooling channels provides a heat exchanging function by receiving at least a portion of a fluid coolant from the fluid inlet, transferring a least a portion of the thermal energy from the respective radiating element to the received portion of the fluid coolant, and dispensing of at least a portion of the received fluid coolant out of the cooling channel to the fluid outlet.

Abstract: The invention relates to an electronic board that comprises: a planar projection plate (42) provided between an intake opening (70) and a discharge opening (72); and a plurality of rectilinear nozzles (86-90) extending through said plate along a projection direction, the projection direction of each nozzle defining an angle relative to a direction perpendicular to a sole (78) of the electronic component (6) to be cooled, the angle ? being comprised in a range of ?30 and +30°.

Abstract: A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.

Abstract: A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.

Abstract: According to one embodiment, a loop heat pipe including a fluid circulating channel containing fluid, includes: an evaporating portion configured to vaporize the fluid by heat from a heat generating component; a condensing portion configured to liquefy the vaporized fluid; a first fluid channel connecting the evaporating portion and the condensing portion, the vaporized fluid flowing through the first fluid channel; a second fluid channel connecting the evaporating portion and the condensing portion, the fluid liquefied by the condensing portion flowing through the second fluid channel; a liquid accumulating portion formed on an inner wall of the second fluid channel, and provided between the evaporating portion and the condensing portion, the liquid accumulating portion being configured to accumulate the liquid liquefied by the condensing portion; and a wick provided between the evaporating portion and a position where the liquid accumulating portion is formed.

Abstract: An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.

Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.

Abstract: An electronic assembly includes a casing structure defining an interior space for receiving at least one electronic component, an exterior space isolated from the interior space and a heat dissipating path along which heat generated by the electronic component is expelled from the interior space to the exterior space. The casing structure includes a first casing part and a would-be coupling unit. The first casing part includes an engagement unit having a bottom seat extending into the interior space and defining at least one flow passage along the heat dissipating path and a first coupling member projecting from the bottom seat. The would-be coupling unit includes a second coupling member coupled to the first coupling member within the interior space.

Abstract: With the storage control device of the present invention, it is possible to mount a larger number of storage devices and to cool them effectively. A plurality of sub-storage units are provided within one storage unit. Each sub-storage unit includes a plurality of hard disk drives, a plurality of enclosures, and a plurality of power supply devices. A cover is divided into a front cover which covers over the front side of a case, and a rear cover which covers over the rear side of the case. Shield portions are provided on the upper sides of the hard disk drives and the enclosures. By these shield portions contacting the adjacent modules (other disk drives and other enclosures), it is possible to reduce the negative influence upon cooling air draft passages within the case, even when a cover has been removed.

Abstract: In the disk array system, in the basic chassis, HDD modules are installed from a front surface in a front part of a backboard, and duplex CTL modules are installed up and down from a rear surface in a rear part, and duplex power source modules containing fans are installed in the left and right sides thereof. By the operation of the fans, in the rear part, the cooling air flows separately into each CTL module and into each power source module, and the cooling air having passed through the area of the duct by a block in the CTL module is drawn by the fans in the power source module through a ventilation hole and is then exhausted outside. The cooling air flow path to the plurality of ICs is divided by the block. The rotation speed of the fans is controlled by using a temperature sensor.

Abstract: A power transmission/reception line circuit breaker includes a vertical-type first circuit breaker tank and a plurality of branch lead-out ports arranged at an interval H. A busbar-side device is connected to each branch lead-out port other than an uppermost branch lead-out port to which a line-side device is connected and a busbar. A busbar link line circuit breaker includes a vertical-type second circuit breaker tank having a length shorter than that of the first circuit breaker tank by the interval H and a plurality of branch lead-out ports arranged at the interval H. A busbar-side device is connected to each of the branch lead-out ports.