Abstract: A power source apparatus includes a power source module which is formed of a plurality of power source elements, a case which houses the power source module and a cooling liquid, a fan which is placed in the case in a state in which the fan is immersed in the cooling liquid together with the power source module, the fan forming a laminar flow of the cooling liquid, the laminar flow having a width at least substantially the same as a length of the power source element in a length direction of the power source element.

Abstract: DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.

Abstract: A heat dissipation apparatus includes a heat absorbing base, a heat conductive core, two fin assemblies and two heat pipes. The heat conductive core is attached to the heat absorbing base, and includes an elliptical, cylindrical body having an elliptical, cylindrical side surface. The two fin assemblies are located at two opposite sides of a major axis of the heat conductive core, respectively, and attached to the side surface of the heat conductive core. The two heat pipes connect the two fin assemblies with the heat absorbing base, respectively, transferring heat from the heat absorbing base to the fin assemblies.

Abstract: A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

Abstract: In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the metal plate, the radiator having a plurality of thin radiating fins formed upright in a tabular shape due to having been dug out by an excavating tool. The radiating fins give the radiator a large area over which heat can be released. The thickness of a first metal plate portion formed between adjacent radiating fins is less than the original thickness of the metal plate.

Abstract: The present invention provides a circuit board having electronic components integrated therein, including a carrier board having an metallic oxide layer formed on each two surfaces of a metal layer, and having at least one through cavity; at least a semiconductor chip hold in the opening; at least a capacitor disposed on one surface of the carrier board, wherein the surface with the capacitor disposed thereon is at the same side with the active surface of the semiconductor chip. The capacitor is constituted of a first electrode plate disposed on partial surface of one side of the carrier board, a high dielectric material layer disposed on the surface of the first electrode plate, and a second electrode plate, paralleling and corresponding to the first electrode plate, disposed on the surface of the high dielectric material. The metal layer and the oxidation layer of the carrier board can enhance rigidity as well as tenacity and also integrate semiconductor chips and capacitors in the circuit board structure.

Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.

Abstract: A heat radiating structure for an electronic module and an electronic device having the same structure thereon. The heat radiating structure is formed at the bottom of the electronic module to release the generated heat from the electronic module, and includes an impact absorber, which absorbs impact transferred from the outside. A heat radiating sheet is formed with a plurality of the multi-layered heat conductive sheets and is in contact with the bottom of the electronic module by covering the outside of the impact absorber.

Abstract: A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housing facing the heat sink and holds the substrate; and to a method for production of such power semiconductor modules. The power semiconductor module has at least one holding element, which engages in a recess, which is associated with the at least one holding element, on the lower face of the housing and is designed such that it limits any movement of the substrate in the direction of the lower face of the housing.

Abstract: A high voltage bushing including an elongated electric conductor, a tubular insulator surrounding the conductor, and cooling mechanism for cooling the conductor. The cooling mechanism includes at least one cooling element extending along a fraction of the length of the conductor and in thermal connection with the conductor.

Abstract: An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.

Abstract: An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.

Abstract: A low profile computer processor retention device, the computer processor including a processor substrate and a heat spreader mounted on the processor substrate. The retention device includes a retention housing. The retention housing is shaped to fit around a socket. The retention device also includes a load frame. The load frame is operatively coupled to the retention housing and is configured to retain the computer processor in the socket of a motherboard with direct contact between the load frame and the processor substrate. The load frame has a cutout. The retention device also includes a heat sink fastening member coupled to the retention housing and configured to fasten a heat sink to the retention housing and configured to couple the heat sink to the heat spreader through the cutout of the load frame.

Abstract: A circuit breaker box comprising a main circuit breaker for operatively connecting to hot service wires; first and second hot bus bars configured to receive power from the main circuit breaker; a plurality of receiver terminals configured to transfer power from a circuit breaker component to a first wire of an electrical circuit; and a safety shield for enclosing the hot bus bars and receiver terminals, wherein a plurality of slots is disposed in the safety shield, the slots are aligned with the first or second hot bus bars and receiver terminals, wherein the circuit breaker component comprises a first and a second prong contact for contacting the first or second hot bus bar and a receiver terminal, respectively.

Abstract: An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.

Abstract: A computer enclosure includes a casing defining a ventilation hole at one side thereof, a power supply and a cooling fan received in the casing. Heat generated by the power supply is taken out by an airflow generated by the cooling fan to an outside of the casing via the ventilation hole. At least one cover sheet covers the ventilation hole of the casing. One side of the cover sheet is pivotally connected to the casing so that the cover sheet is rotatable with respect to the casing. When the cooling fan works, an airflow produced by the cooling fan flows to the ventilation hole and pushes the cover sheet to rotate with respect to the casing, and thus the ventilation hole is exposed; when the cooling fan ceases to work, the cover sheet falls off due to a weight thereof and the cover sheet fully covers the ventilation hole.