Abstract: Apparatus, method, and system for rigidly supporting a switchgear bus assembly through the use of one or more support plates, thereby providing the primary support for the other active modules and bushings.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.

Abstract: Embodiments of this invention relate generally to systems used to cool computer hardware and more particularly to an adaptor for a graphics module. In one embodiment a graphics card assembly is provided. The graphics card assembly includes a printed circuit board (PCB); a graphics processing unit (GPU) attached to the PCB; and an adaptor having first and second surfaces and made from a thermally conductive material. The adaptor is disposed on the PCB so that the first surface is in thermal communication with the GPU and the second surface providing a standard interface for thermal communication with a cooling system.

Abstract: A heat sink assembly includes a first heat sink, a second heat sink, and a wire clip connecting the first and second heat sinks together. Each of the first and second heat sinks includes a base and a plurality of connecting members extending upwardly from the base. The wire clip includes a pivot portion and a pair of pressing portions extending from opposite ends of the pivot portion towards each other. The connecting members of the first and second heat sinks cooperatively clasp the pivot portion of the wire clip. The pressing members of the wire clip resiliently abut against the connecting members of the first and second heat sinks and push the connecting members of the first and second heat sink outwardly away from each other. The bases of the first and second heat sinks clamp an add-on card therebetween.

Abstract: In a switching device with two controlled phases, in which each phase is associated with a respective printed circuit board assembly with at least one component to be cooled on a heat sink, the heat sink has a T-shaped cross section transversely with respect to its extent direction. In at least one embodiment, the printed circuit board assemblies are arranged on both sides of the center limb of the heat sink, with the components of the two printed circuit board assemblies facing one another and resting on in each case one side of the center limb.

Abstract: The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is arranged in fixed manner an air-to-fluid heat exchanger, whilst covering a residual area of the rear of the cabinet and to which is articulated the fan door. The heat loss given off to a cooling liquid, particularly cold water, in the heat exchanger is removed via a pipe system outside the cabinet installation area and rigid connecting pipes of a gas-tight material can be used for the connection of the heat exchangers of the individual cabinets to the building-side pipe system.

Abstract: A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.

Abstract: One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.

Abstract: An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided wherein an air directing structure with a finite air-flow resistance is deployed in a cooling channel adjacent to a heatsink in a first cooling zone, such that some portion of the cooling air is forced through the heatsink while the rest of the cooling air bypasses the heatsink to provide additional cooling air to a second cooling zone. Additionally, the air-flow resistance of the air directing structure can be chosen so that the fan operates at its optimal point (maximum power input to the air).

Abstract: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.

Abstract: A tank and a lid are configured to mate to provide a substantially airtight container for containing a processing board for a computer and a liquid. A cooling system is configured to cool the interior of the container, and a serial data connection is provided between the processing board and the exterior of the container.

Abstract: A first surface of a double-sided printed circuit board has a soldering land for heat radiation, which serves as a mounting surface for an electronic part. A land for solder absorption is formed on the second surface facing the mounting surface. Viaholes are provided and open in both the soldering land for heat radiation and the land for solder absorption at the opposite ends. Molten solder flows out from the openings of the viaholes and spreads on the land for solder absorption to suppress formation of solder balls. Cream solder is applied to the outer surface of the land for solder absorption to embed the solder and to form a solder layer.

Abstract: A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.

Abstract: An apparatus with some embodiments is described having a protrusion to provide air flow distribution to a computing device. In some embodiments, the apparatus may include a housing with one or more openings on each of the external surfaces of the housing, an air mover, and a protrusion to channel airflow to an inlet while restricting airflow from an outlet from being circulated back into the inlet. Furthermore, in some embodiments, the apparatus may be implemented on a computer system that includes one or more electronic components can generate thermal energy. Other embodiments are described.

Abstract: Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Abstract: An apparatus comprising a chassis providing a plurality of module bays, one or more modules received in the module bays, wherein each module has at least one damper actuator extending from a distal end of the module. A fan assembly and a plurality of air flow dampers are secured in a distal end of the chassis, wherein each damper is aligned with one module bay to control air flow through the aligned module bay. Each damper is biased to close in the absence of contact with a damper actuator and opens in response to contact with a damper actuator. Each damper opens to a variable extent determined by the profile of the contacting damper actuator. The damper actuator of a particular module has a profile corresponding to the thermal load of that module, such that installing a module into the chassis automatically opens the aligned damper to the desired extent.

Abstract: A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.

Abstract: An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the CPU, a fan attached to the heat sink, and an air guide member attached to the second electronic element. The air guide member includes a guiding portion to guide air from the fan to the second electronic element.

Abstract: A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.

Abstract: A scanning apparatus with heat dissipating ability includes a housing having an opening formed thereon. A cover having a slit, a heating dissipating portion, and supporting portion connected to the heat dissipating portion covers the opening, wherein the supporting portion extends from an edge of the slit into the housing. A light emitting elements is fixed on the supporting portion, for emitting a scanning light through the slit, and the scanning light is reflected as an image light by a document. The image light is converted to image data by an image scanning module. The heat dissipating portion is made of a thermal conductive material to exchange heat with the air, so that heat generated by the light emitting elements is transferred to the heat dissipating portion and the heat is dissipated to the air, the work temperature of the light emitting elements is controlled at an optimal temperature.