Abstract: An audio-integrated apparatus has a body casing attached in an instrument panel of a vehicle. The body casing contains a media reader, a circuit board having a CPU, a CPU fan for cooling the CPU, and an exhaust fan. A media loading slot is in a front face of the body casing for inserting a media. A movable display section is in front of the body casing to be movable in a back-and-forth direction. A display movement mechanism can move the movable display section in the back-and-forth direction to thereby change an inclination against the front face of the body casing. A gear motor can detect a position of the movable display section. According to the detected position of the movable display section, rotational frequencies of the CPU fan and the exhaust fan are controlled.

Abstract: A power supply assembly includes a housing having side walls, end walls, and a bottom wall defining a rectangular box with an interior space and an open top. A first dividing wall and a second dividing wall are positioned in the interior space of the housing which divides the interior space into first, second, and third compartments. A method of manufacturing a power supply with the above power supply assembly includes installing a printed circuit board in the second compartment and positioning the first wire set to terminate in the first compartment and the second wire set to terminate in the third compartment.

Abstract: A heat sink unit includes: a cooling member including a metal plate having a plurality of attachment holes on edges thereof, a first surface of the metal plate adjoining a heat-producing electronic component, and a second surface of the metal plate having a plurality of cooling fins erected on an area other than the attachment holes. The heat sink unit further includes: an attachment member including an opening in which the cooling fins are disposed when the cooling member is installed and a plurality of threaded bosses protruding from the first surface to be inserted into each of the attachment holes; and coil springs into which the bosses are respectively inserted. The coil springs are interposed between the attachment member and the metal plate, and the bosses are inserted into the attachment holes to fix the cooling member by screws.

Abstract: Aspects of the inventive technology may relate to a physical enclosure designed to house electrical componentry inside. More specifically, the inventive technology may relate to a physical enclosure that is designed to allow for the enclosure, perhaps within the same, unitary structure, of conductors (wires) as they enter the ground and wire splice devices that connect those wires with wires of smaller diameter. Aspects of the inventive technology may relate to provision of a wire splice mount(s) that hold splices in fixed position relative to the physical enclosure.

Abstract: In some embodiments, a stacked package assembly may include a first socket defining an interior cavity, a first semiconductor device coupled to the first socket, a second socket positioned within the interior cavity of the first socket, and a second semiconductor device removably coupled to the second socket within the cavity of the first socket. The second socket may be positioned between the first semiconductor device and the second semiconductor device and provide an electrical connection between the first semiconductor device and the second semiconductor device. Other embodiments are disclosed and claimed.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: A heat sink device for a display card includes a heat sink, the heat sink having a base and a plurality of heat-dissipating fins on the base, the base having two hooks respectively beside two lateral sides of the groove; a heat-dissipating fan, having a blade wheel and a power wire for the blade wheel, the blade wheel being on the base and the power wire being inside the groove of the base; and a fastener, having two engagement parts respectively corresponding to the hooks, wherein the fastener covers the groove so as to position the power wire by means of engagement of the hooks with the engagement parts. Therefore, the power wire of the heat-dissipating fan can be properly arranged on the heat sink.

Abstract: A clip includes a body, a moveable fastener and an actuating member. The body includes a pressing part, a flat portion and a latching leg. The movable fastener includes a connecting portion, a pivot axis connected at a top end of the connecting portion and an engaging portion. The connecting portion extends through the flat portion. The actuating member defines a guiding groove therein. The guiding groove angles outward to form a height difference along a longitudinal axis of the actuating member between a topmost end and a bottommost end thereof. The actuating member is above the flat portion and connected to the pivot axis of the moveable fastener. The actuating member is levelly moveable relative to the movable fastener so that the pivot axis can slide along the guiding groove to render the moveable fastener vertically moveable between a locked position and a released position.

Abstract: The power inverter includes: a case made of a metal; a first power module provided in the case and including a DC terminal and an AC terminal; a second power module provided in the case and including a DC terminal and an AC terminal; and a cooling formation body for decreasing heat generated from the first and second power modules. The first and second power modules are disposed in a manner such that the DC terminals face each other.

Abstract: A method and apparatus adapted to cool a circuit board in a rack-mountable housing includes transferring heat from a heat source on the board to a primary heat storage medium positioned at an edge of the board or within a rack-mountable housing using at least one heat pipe, transferring heat from the primary heat storage medium to a secondary heat storage medium positioned in the rack-mountable housing through contacting surfaces of the primary and secondary heat storage mediums, transferring heat from the secondary heat storage medium to a heat exchanger, which may be positioned within the rack-mountable housing, using at least one heat pipe, and cooling the heat exchanger. A method and apparatus adapted to cool a printed circuit board includes transferring heat from a heat source on the board to a heat exchanger positioned in the rack-mountable housing using at least one heat pipe, and cooling the heat exchanger.

Abstract: An upper lid forming an upper portion of a casing is formed by a metal (an aluminum alloy or the like) having a high heat radiation performance. The upper lid serves as a heat sink (a heat radiation member) radiating heat generated from electronic components within the casing to an external portion. A plurality of flat plate-shaped heat radiation fins are provided in an upper surface of the heat sink. A groove forming each of the heat radiation fins is open in a side surface of the heat sink without forming a step.

Abstract: A heatsink structure and method for the cooling of closely spaced packaged heat-producing devices, such as dual-in-line memory modules (DIMMs). A folded sheet metal heatsink structure is provided which is constituted of a coined metallic material and which has a large plurality of waffle-shaped ridges extending therefrom constituting additional surface areas which are adapted to enable heat generated by hub chips to pass upwardly and then outwardly through waffle-like ridges and, thus, dissipated to the exterior, thereby imparting an improved degree of cooling to heat-producing components or devices.

Abstract: An inverter assembly for a vehicle includes a housing, a first inverter, and a second inverter. The housing comprises a plurality of walls. The plurality of walls form an inlet for cooling fluid to enter the housing, an outlet for the cooling fluid to exit the housing, and a channel, and a channel for the cooling fluid to flow therebetween. The first inverter is disposed within the housing proximate the channel, and is configured to be cooled by the cooling fluid flowing through the channel. The second inverter is also disposed within the housing proximate the channel, and is also configured to be cooled by the cooling fluid flowing through the channel.

Abstract: Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the power module. Further, the base plate of the power module includes a metal in addition to copper to increase a hardness of the base plate, so that a deterioration of the flatness during fixing the fins with brazing is restrained.

Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

Abstract: An electronic built-in system for installation in a support structure mounted in a passenger compartment of a vehicle. The system includes at least one electronic module and a housing for receiving the electronic modules. The housing is mounted to the support structure of the vehicle and includes a front control panel with operating elements for operating the electronic system. The front control panel faces the passenger compartment. A cooling unit is provided in the housing for guiding cooling air through the housing for cooling the electronic module. At least one first opening in an outer wall portion of the housing supplies cooling air to the housing. At least one second opening in an outer wall portion of the housing removes the cooling air from the housing. The first and second openings are arranged at different wall portions of the housing, which are separated from the passenger compartment by the support structure when the built in system is installed in the support structure.

Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

Abstract: A thermal module includes a heat sink (20), a heat pipe (10) and a fastening device (100). The heat pipe has a condenser section (14) connected with the heat sink. The fastening device includes a base member (50) for fixing an evaporator section of the heat pipe, a positioning pole (58) disposed on and connected to the base member, and an elastic member (30). The positioning pole includes a neck (580) and a head (582). The elastic member includes an abutting portion (32) defining therein a positioning hole (320), and two locking portions (34) extending from the abutting portion. The neck of the positioning pole is freely and loosely received in the positioning hole of the abutting portion. A maximal outer diameter of the head of the positioning pole exceeds a diameter of the fixing hole.

Abstract: A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

Abstract: The invention discloses an electronic apparatus and a fan module thereof. The fan module includes a base, an impeller, a liquid container, an atomizing device and a cover. The impeller is provided in the base. The liquid container is placed at the center of the impeller, and the liquid container contains a liquid. The atomizing device is disposed on the liquid container, and the atomizing device can atomize the liquid to form a mist to spray in order to absorb the heat in the electronic apparatus. The cover covers the base and forms an air outlet with the base. Furthermore, the cover has an air inlet. When the impeller rotates, the blade of the impeller drives airflow mixed the heated mist to enter into the base through the air inlet of the cover, and to exit from the base through the air outlet.