Abstract: An auxiliary heat dissipation device for a liquid crystal display includes a housing having an internal space for receiving a liquid crystal display module, and a cover plate assembled to cover a front of the housing. The housing has a plurality of air inlets at a bottom thereof and a plurality of air outlets at a top thereof. A plurality of discharge fans each is mounted at the corresponding air outlet in the housing. A plurality of intake fans each is mounted at the corresponding air inlet in the housing, wherein a central axis of each of the intake fans keeps an appropriate included angle with respect to a central axis of the corresponding air inlet, so as to be able to efficiently dissipate the heat generated from the liquid crystal display module to the outside of the housing.

Abstract: A heat dissipation apparatus (10) includes a heat spreader (30), and first and second resilient plates (40, 50) provided at two opposite sides of the heat spreader. The first resilient plate includes a mounting arm (41) and two fixing arms (42) extending from two opposite ends of the mounting arm, respectively. The mounting arm defines a first mounting hole (43) therein, and each of the fixing arms defines a first fixing hole (44) therein. The second resilient plate defines a second mounting hole (53) and two second fixing holes (54) therein. The first resilient plate is fixed on the heat spreader via the first fixing holes. The second resilient plate is fixed on the heat spreader via the second fixing holes. The heat spreader is fixed on a circuit board via the first and the second mounting holes.

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract: According to one embodiment, an electronic apparatus is provided with a casing, a circuit board contained in the casing, an exothermic body mounted on the circuit board, a cooling fan which is fixed to the inside of the casing and includes a fan case, a heat receiving member which is opposed to the exothermic body and is thermally connected to the exothermic body, and a pressing member opposed to the heat receiving member from the opposite side of the exothermic body. The pressing member is provided to be integral with the fan case. Fixation of the cooling fan to the inside of the casing causes the pressing member to press the heat receiving member against the exothermic body.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink and a plurality of heat pipes thermally connecting the first heat sink and the second heat sink. The first heat sink includes a plate-like spreader used for contacting with a first electric component and a honeycomb-like first fin unit thermally attached on the spreader. The spreader is a flat heat pipe. The heat pipes each include a flat plate-shaped evaporating section sandwiched between the spreader and the first fin unit of the first heat sink and a condensing section extending in the second heat sink. Due to a provision of the honeycomb-like first fin unit, the heat dissipation area of the first heat sink greatly increases.

Abstract: A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin surface. This airflow disturbs the boundary layer near the fin and dramatically increases the heat transfer from the fin to air compared to a non-oscillating fin, even for the same bulk flow rate.

Abstract: Discloses herein is a shielding and heat dissipation device comprising a conductive bracket (1) provided on a PCB around a shielded heat-generating electronic component, and electrically connected to a conductive layer of the PCB; a heat sink (2), which is arranged above the heat-generating electronic component (3) and is provided with a conductive surface electrically connected to the conductive bracket (1). With the conductive surface, which may be used to replace a top cover of a prior art shielding case, developed on the bottom or sidefaces of the heat sink, an effective shielding cavity is formed by conductively connecting the conductive surface of the heat sink to the other parts of the shielding case. That is to say, the conductive surface of the heat sink serves as a part of the shielding case, so that the heat sink may play a role in electromagnetic shielding as well as in dissipating heat sufficiently.

Abstract: A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path.

Abstract: The present invention provides a rack suitable for housing a liquid-cooled electric unit. A rack 2 comprises an electric connector 12 for supplying electricity to the housed electric unit 50, and a fluid connector 14 for supplying cooling liquid to the housed electric unit 50. The fluid connector 14 and the electric connector 12 are arranged at different positions in a horizontal cross section (plane) of the rack 2. More preferably, the electric connector 12 is mounted on a back panel 6 of the rack 2, while the fluid connector 14 is mounted on the foreside of the rack 2. Such a configuration makes it less likely that the cooling liquid leaking from the fluid connector 14 drips onto the electric connector 12.

Abstract: A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.

Abstract: Provided is an apparatus and a system. The apparatus, in one embodiment, includes a chassis having one or more slots configured to hold circuit boards and a plenum coupled to the chassis. The apparatus, in this embodiment, further includes a fan assembly coupled to the plenum and configured to provide an airflow therethrough, and servo dampers associated with the one or more slots and configured to allocate a portion of the airflow to associated air paths.

Abstract: A synthetic jet includes an inner wall configured to surround a heat-generating component, a plurality of walls coupled to the inner wall, the inner wall and the plurality of walls configured to enclose a volume surrounding the inner wall, an actuator coupled to one of the plurality of walls and the inner wall. The inner wall has a plurality of orifices formed therein configured to direct a fluid toward the heat-generating component upon activation of the actuator.

Abstract: A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Abstract: A cooling device comprises a heat radiating portion, heat-transferring component, such as a heat pipe, a fan and a support member. The heat radiating portion radiates the heat generated by the heat-generating component. The heat-transferring component transfers the heat generated by the heat-generating component, from the heat receiving portion to the heat radiating portion. The fan applies cooling air to the heat radiating portion. The fan is coupled to the heat radiating portion. The support member includes a first part to hold the heat radiating portion, and a second part to hold the fan.

Abstract: A memory module assembly includes a printed circuit board having a plurality of heat-generating electronic components thereon, first and second heat sinks formed by stamping a metal sheet and attached on opposite sides of the printed circuit board and a clamp clamping the first, second heat sinks and the printed circuit board together. The first and second heat sinks each comprise a plurality of fins extending therefrom and define a plurality of openings between the fins. The fins and openings are alternately arranged on each of the first and second heat sinks along a height direction thereof. The second heat sink includes a pair of positioning tongues extending from opposite side edges thereof. The first heat sink engages with the second heat sink via the positioning tongues of the second heat sink extending in and engaging with the first heat sink.

Abstract: A heat sink includes a generally rectangular flat base, a plurality of fins provided on the surface of the base in parallel to each other, a protrusion provided on the surface of the base along substantially the overall width of the base in the transverse direction to the fins. The fins become gradually shorter on one end side of the base. The ends of the fins are arranged on an oblique line with respect to a line perpendicular to the fins.

Abstract: A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation.

Abstract: A cooling system through which liquid flows for carrying away waste heat for electronics housings is particularly suited for the automotive industry. The cooling system is adapted to the dimensions of the housing. The novel device is the first to create an effective cooling system for electronics housings with and for a number of circuit board levels, yet with a space-saving compact design.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat-generating element mounted in the housing, a cooling fan mounted in the housing, a fin unit which is mounted in the housing and opposed to the cooling fan, and a heat transfer member which thermally connects the fin unit to the heat-generating element. The cooling fan includes a fan case which is provided with an opening portion. The fin unit includes an insertion portion which is inserted into the fan case through the opening portion. The insertion portion is provided to extend from one longitudinal end area to the other longitudinal end area of the opening portion.