Patents Examined by Boris L. Chervinsky
  • Electrical configuration as heat dissipation design
    Patent number: 7773380
    Abstract: An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanically and electrically to the current bar. It is provided that the unit made up of the component and the electronic circuit is mounted on a support layer that effects the heat dissipation in such a way that, because of the fastening of the component onto the support layer, the heat dissipation surface is pushed against the support layer, based on the spring property of the current bar.
    Type: Grant
    Filed: April 2, 2009
    Date of Patent: August 10, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Ulrich Trescher, Eckhard Schaefer
  • Module assembly having heat transfer plate
    Patent number: 7773379
    Abstract: A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: August 10, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Lyle Stanley Bryan, Roger Lee Thrush, Robert Daniel Irlbeck, Donald Robert Worthington
  • Synthetic jet ejector with viewing window and temporal aliasing
    Patent number: 7768779
    Abstract: A device (103) is provided which comprises (a) a housing (115) equipped with a viewing window (253); (b) a diaphragm (301), visible through said viewing window; (c) an actuator (126) adapted to vibrate said diaphragm at an operating frequency; and (d) a strobe light (121).
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: August 3, 2010
    Assignee: Nuventix, Inc.
    Inventors: Samuel N. Heffington, Michael D Wilcox, Randall P. Williams, Robert T. Reichenbach
  • Flow-through cooling for computer systems
    Patent number: 7768780
    Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: August 3, 2010
    Assignee: Silicon Graphics International Corp.
    Inventors: Giovanni Coglitore, Matthew P. Casebolt, Robert L. Weisikle
  • Electronic module cooling
    Patent number: 7768783
    Abstract: Embodiments for cooling electronic modules are disclosed. In accordance with at least one embodiment, an electronic module is inserted into a cooling sled that is equipped with a bay. The bay of the cooling sled is equipped with a pair of sides to retain the electronic module. The electronic module contains a working fluid that is sealed inside the module with one or more electronic components. During the operation of the electronic module, the working fluid is vaporized by the heat generated by the one or more electronic components. The electronic module is then cooled via the cooling sled. The cooling of the electronic module condenses the working fluid that is vaporized by the heat generated by the one or more electronic components. The condensed cooling fluid is then returned to the one or more electronic components via a wick structure that is also sealed in the electronic module.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: August 3, 2010
    Assignee: Microsoft Corporation
    Inventors: James T. Kajiya, J. Turner Whitted, David W. Williams
  • Computer with improved cooling features
    Patent number: 7768781
    Abstract: A personal computer has a central air plenum straddled by opposed drive bays, and memory modules in the plenum are covered by a shroud that increases the air flow over the memory modules. The plenum establishes a first pathway for air flow and parallel to the plenum is a second pathway for air flow past cards such as graphics and network cards.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: August 3, 2010
    Assignee: Lenovo Singapore Pte. Ltd
    Inventors: Albert Vincent Makley, William Fred Martin-Otto, Jon W. Heim
  • Control device, in particular in the form of an electric switch for electric handtools
    Patent number: 7764502
    Abstract: A control device, in particular an electrical switch for use for an electrical tool such as a rechargeable-battery and/or plug-powered electrical tool having an electric motor. The switch has a housing for holding at least one heat-generating component such as a power transistor, a MOSFET, a triac or the like, which is arranged in particular in an electrical circuit arrangement which, for example, is used for open-loop and/or closed-loop control of the electric motor by appropriate open-loop and/or closed-loop control of the electrical load current flowing through the component to the electric motor. A means for thermal conduction is connected on the one hand to the housing of the electrical switch, and/or to the heat-generating component, in particular to the power semiconductor which is located in the housing, and on the other hand to a cooled area which is associated with the switch.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: July 27, 2010
    Assignee: Marquardt GmbH
    Inventors: Tino Erb, Dirk Pfeiffer, Klaus Fiederer
  • Electronic device
    Patent number: 7764501
    Abstract: An electronic device including a base and a pluggable unit is provided. The base includes a first heat sink having a first heat-transfer contacting surface. The pluggable unit includes a second heat sink and a heat source. The second heat sink has a second heat-transfer contacting surface. When the pluggable unit is plugged in the base, the first heat-transfer contacting surface gets in contact with the second heat-transfer contacting surface.
    Type: Grant
    Filed: December 29, 2008
    Date of Patent: July 27, 2010
    Assignee: Inventec Corporation
    Inventors: Hui-Fang Gu, Tsai-Kuei Cheng
  • Cooling system employing a heat exchanger with phase change material, and method of operation thereof
    Patent number: 7760502
    Abstract: A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: July 20, 2010
    Assignee: International Business Machines Corporation
    Inventors: Robert Ernst Meyer, III, Cary Michael Huettner, Joseph Kuczynski, Timothy Tofil
  • Thermal management system for card cages
    Patent number: 7760499
    Abstract: A system is provided herein which comprises (a) a plurality of circuit boards (207); (b) a plurality of slots (205), wherein each of said slots is adapted to provide power to a circuit board coupled thereto, and wherein each of said circuit boards is coupled to one of said slots; and (c) a thermal management card (209) disposed in one of said slots, said thermal management card containing at least one synthetic jet ejector.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: July 20, 2010
    Assignee: Nuventix, Inc.
    Inventors: Stephen P. Darbin, Samuel N. Heffington, John Stanley Booth, Raghavendran Mahalingam
  • Heat dissipation apparatus
    Patent number: 7755903
    Abstract: A heat dissipating apparatus includes a base, a heat sink received in the base, and a retaining cover attached to the base. The retaining cover defines two crossing slots for cooperatively forming at least one flap. Each free portion of flap has a free portion. The free portion of each flap elastically curves towards the heat sink to bias the heat sink towards the base.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: July 13, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Lung-Sheng Tsai, Li-Ping Chen
  • Electronic device
    Patent number: 7751190
    Abstract: An electronic device includes a cabinet, a first heat generating member, a second heat generating member, a fan unit, a first heat pipe and a second heat pipe. The first and second heat pipes are each formed by sealing an operation fluid which shifts its phase between gas and liquid into a pipe-like main body. In the second position, the first end portion of the first heat pipe is located at a position lower than that of the second end portion and the one end portion of the second heat pipe is located at a position higher than that of the other end portion. The second heat pipe includes a conveying mechanism that conveys the operation fluid in liquid phase from the other end portion to the one end portion.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: July 6, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Nobuto Fujiwara
  • Power distribution panel with modular elements
    Patent number: 7751180
    Abstract: A power distribution panel having circuit elements such as KTK and GMT fuses removably mounted to a unit housing by means of module members, thereby allowing for ease of customization of the circuit elements of the power distribution panel.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: July 6, 2010
    Assignee: ADC Telecommunications, Inc.
    Inventors: David E. Schomaker, Carlos Arroyo Gonzalez, Delfino Hernandez, Luis Manuel Sanchez Aguilar, Narciso Delgado Guevara, Celsa Mora Curiel
  • Heatsink method and apparatus
    Patent number: 7751192
    Abstract: A heatsink having tapered geometry that improves passive cooling efficiency is discussed. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing cooling gas upon heating. Thus, the tapered heatsink elements result in higher velocity of gas flow and increased cooling efficiency of the heatsink. Optionally, the heatsink is made from a thermally conductive polymer allowing the heatsink to be created in complex shapes using injection molding.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: July 6, 2010
    Assignee: Sensys Medical, Inc.
    Inventors: Roxanne E. Abul-Haj, N. Alan Abul-Haj, Timothy W. Stippick, Kevin H. Hazen
  • Electronic device
    Patent number: 7746638
    Abstract: An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part and the heat generated by the first component.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: June 29, 2010
    Assignee: Fujitsu Limited
    Inventors: Hiroshi Takawa, Noboru Izuhara, Mitsuru Yumoto
  • Heat sink and a method for manufacturing the same
    Patent number: 7746642
    Abstract: A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
    Type: Grant
    Filed: September 1, 2008
    Date of Patent: June 29, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chi-Yuan Lai, Zhi-Yong Zhou, Cheng-Tien Lai
  • Canister housing
    Patent number: 7746639
    Abstract: According to one embodiment, a housing for a pedestal canister includes a first side plate and a fan. The first side plate includes a plurality of fins disposed on an exterior portion of the first side plate. The fan is coupled to the exterior portion of the first side plate. The pedestal canister is configured to be disposed within a pedestal aperture of a pedestal mounting block.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: June 29, 2010
    Assignee: Raytheon Company
    Inventors: Jayson K. Bopp, Martin G. Fix
  • Package assembly with heat dissipating structure
    Patent number: 7746644
    Abstract: A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer is a single-layered metal layer and has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: June 29, 2010
    Assignee: National Taiwan University
    Inventor: Wei-Hsing Tuan
  • Control device housing for an electronic brake
    Patent number: 7742304
    Abstract: A control device housing for an electronic brake system includes a lid, a housing part closable by the lid, a component support member for electronic components, and a cooling element that is in direct or indirect thermal contact with at least part of the electronic components. The cooling element may be either a planar additional cooling plate or a lid that is at least partly made of metal. The cooling element and the component support member are spaced from each other, and thin heat conductive elements are arranged in the resulting intermediate space between the cooling element and the electronic components that are to be cooled or the component support member. The heat conductive elements are configured flexibly for tolerance compensation and inhere good heat conductivity in addition.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: June 22, 2010
    Assignee: Continental Teves AG & Co. oHG
    Inventors: Andreas Heise, Michael Jürgens, Jürgen Peter Gilb
  • Piezo fans for cooling an electronic device
    Patent number: 7742299
    Abstract: A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: June 22, 2010
    Assignee: Intel Corporation
    Inventors: Ioan Sauciuc, Sandeep Ahuja, Ashish Gupta