Abstract: An electronic component or assembly that is assembled within a case that is designed to operate as a liquid phase to gas phase heat pipe where the electronic component or assembly is introduced into a liquid or partially liquid partially gaseous environment; whereby said liquid evaporates into a gas absorbing heat energy and transferring it to and through the component's or assembly's case. The case will be engineered out of materials that do not contaminate the liquid and electronics with ions and will be engineered to include a plurality of chambers/towers that extend in various directions providing enhanced heat pipe functionality in any physical orientation.

Abstract: A frame-type computer cooling device for installation in a host computer is provided. The host computer has a heat-generating source and a slot compartment. The slot compartment communicates with the inside of the host computer and the outside of the host computer. The frame-type computer cooling device includes a frame and a cooling circulation device. The frame is insertedly disposed in the slot compartment and includes a receiving recess. The cooling circulation device includes an evaporator, a compressor, a condenser, and an expansion valve connected to one another by a pipeline filled with a coolant. The compressor, the condenser, and the expansion valve are received in the receiving recess. The evaporator adjoins the heat-generating source. Accordingly, the cooling circulation device is easy to install, and heat dissipation of the heat-generating source is swift and efficient.

Abstract: A heat dissipating structure of a 1U power supply is installed in an industrial computer host system of a universal standard specification 1U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage with the computer host system for guiding a heat dissipated airflow through the airflow passage to improve the poor heat dissipation at both distal ends of the traditional 1U power supply due to the same height of the power supply and the computer host system or the proximity of both sides of the power supply with an installed electronic device such as a hard disk.

Abstract: An electronic assembly includes a printed circuit board mounted with an electronic component, a heat sink, and a clip securing the heat sink on the printed circuit board to enable the heat sink to have an intimate contact with the electronic component. The printed circuit board forms two engaging portions each defining a receiving hole therein. The heat sink includes a base and a plurality of fins. The clip includes a pressing member pressing the heat sink to the electronic component, two V-shaped operating members extending slantwise from ends of the pressing member, and two clasps extending outwardly from ends of the operating members. Height of each of the clasps is larger than that of each of the receiving holes of the engaging portions. The clasps of the clip lock with the engaging portions by manipulating the operating members.

Abstract: An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Abstract: A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.

Abstract: A digital micromirror device (DMD) module includes a circuit board, a DMD element, a soft elastic pad, a heat dissipation pad and a heat sink. The circuit board includes a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface. The DMD element is electrically connected to the circuit board. The soft elastic pad is disposed on the first surface of the circuit board and surrounds the through hole. The heat dissipation pad passes through the through hole and contacts the DMD element. The soft elastic pad is sandwiched between the circuit board and the heat sink, the heat dissipation pad is sandwiched between the heat sink and the DMD element, and the heat sink contacts the soft elastic pad and the heat dissipation pad, so as to apply a force to the soft elastic pad and the heat dissipation pad.

Abstract: A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

Abstract: A plasma display device that includes a plasma display panel adapted to display images on a front side thereof, a chassis base including conductive material and arranged behind the plasma display panel, a plurality of circuit boards adapted to drive the plasma display panel, the plurality of circuit boards being fixed on the chassis base with a gap between each of the plurality of circuit boards and the chassis base and a driving circuit portion including a plurality of cables and adapted to electrically connect the circuit boards, wherein the chassis base includes at least one holding unit that is adapted to hold the plurality of cables on one side of the chassis base. The holding unit being adapted to attenuate EMI before it reaches the cables within.

Abstract: A power distribution apparatus includes a housing holding a plurality of electrical outlets, a plurality of independent electrical circuits within the housing, and a plurality of cord sets serving the plurality of independent electrical circuits and extending from the housing.

Abstract: A power control system may use power semiconductor devices such as insulated gate bipolar transistors (IGBT's) in a switching unit to provide motor control. The IGBT's may be cooled with a system that is configured and sized to provide proper cooling at steady-state operating conditions of the switching unit. The IGBT's may be placed in thermal communication with a compartment that may contain phase change material (PCM). When and if the switching unit is operated under transient high load conditions, excess heat may be absorbed by melting of the PCM. When steady state operating conditions are restored the PCM may solidify and release its latent heat to a coolant. The PCM may thus act as a thermal buffer for the cooling system and thus may provide that the cooling system may be minimally sized.

Abstract: In an assembly of an electronic device and a heat-dissipating module, the electronic device includes an electronic component disposed within a housing provided with an air outlet port, and the heat-dissipating module includes a heat-dissipating fin base disposed within the housing adjacent to the air outlet port, and a dust removing mechanism disposed on the heat-dissipating fin base. The heat-dissipating fin base includes two spaced-apart upright sidewalls, and a plurality of heat-dissipating fins arranged between the upright sidewalls. The dust removing mechanism includes a scraping plate disposed between the upright sidewalls and accessible outwardly of the air outlet port. The scraping plate has scraping teeth extending respectively into clearances among the heat-dissipating fins. By manipulating the scraping plate to displace upwardly and downwardly relative to the heat-dissipating fin base, dust that accumulates among the heat-dissipating fins can be scraped off.

Abstract: There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element.

Abstract: An electronic equipment cabinet is provided, which includes an upper portion, a lower portion and a support configured to receive electronic equipment. The bottom portion defines a base plenum configured to receive a low temperature gas and communicates with a gas flow distribution pathway, which includes a first plenum communicating with the base plenum and configured to direct the low temperature gas to the support. The gas flow distribution pathway further includes a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the top portion. The top portion includes at least one fan configured to direct the high temperature gas flow from the gas flow distribution pathway. A temperature sensor senses the temperature of the high temperature gas flow and communicates with a control module to control the first plenum and the at least one fan for regulating temperature.

Abstract: An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching elements mounted on the heat sink, a circuit board arranged in opposition to the heat sink, a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other, and a plate spring urging the semiconductor switching elements against the heat sink. The plate spring has engagement portions press-fitted to and engaged with inner sides of holding portions which are formed on the housing, and the housing has engagement portions engaged with protruded portions of the heat sink.

Abstract: One of the purpose is to obtain a motor drive circuit and an outdoor unit for an air conditioner using the same, which can flexibly support change of a model at a low price and in a small lot without using unnecessary materials, wherein a stress in a soldering part due to self-heating is low, a solder reliability is high, and design constraints are small, while maintaining a low-noise and low-loss power wiring due to lowering inductance.

Abstract: When an electric connection box (P) is received inside a cover (50A), a part reception section (34) is exposed to the outside, in an opening (51H) in the upper surface of the cover (50A). As a consequence, there is fear that water on the upper surface of the cover (50A) enters onto the upper surface of a case (20) from a gap between the opening (51H) and the part reception section (34). Water discharge grooves (35, 36) reaching a water discharge path (38) in an outer surface of the case (20) is formed in the upper surface of the case (20), and as a result, water collecting on the upper surface of the case (20)(body section (30)) flows into the water discharge grooves (35, 36) to be reliably discharged.

Abstract: A computer cooling apparatus is provided. The computer cooling apparatus includes a case, a fan, a CPU (central processing unit), and a heat radiating device. The case has an air outlet formed in one side. The fan is formed at another side of the case to suction external air. The CPU is installed in the case. The heat radiating device radiates heat generated from the CPU. The fan and the air outlet are formed in mutually opposite positions, and direct a flow of the external air suctioned by the fan in one direction.

Abstract: A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.

Abstract: In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred lead-free piezoelectric layers and electrodes stacked on top of each other and formed around a central opening, and a diaphragm coupled to the piezoelectric layers and substantially covering the central opening to vibrate and blow air when an operating voltage is applied to the electrodes. Other embodiments are also disclosed and claimed.