Abstract: A method of forming a capacitor includes, a) providing a node to which electrical connection to a capacitor is to be made; b) providing a first electrically conductive capacitor plate over the node, the capacitor plate comprising conductively doped polysilicon; c) providing a predominately amorphous electrically conductive layer over the first capacitor plate; d) providing a capacitor dielectric layer over the amorphous electrically conductive layer; and e) providing a second electrically conductive capacitor plate over the capacitor dielectric layer. A capacitor construction is also disclosed. The invention has greatest utility where the polysilicon layer covered with the amorphous conductive layer is a roughened outer layer, such as provided with hemispherical grain polysilicon. The preferred amorphous electrically conductive layer is metal organic chemical vapor deposited TiC.sub.x N.sub.y O.sub.z, where "x" is in the range of from 0.01 to 0.5, and "y" is in the range of from 0.99 to 0.

Abstract: An MIM capacitor includes a lower electrode; a first insulating film disposed on the lower electrode; a second insulating film disposed on the first insulating film and having a first opening exposing a portion of the surface of the first insulating film on the lower electrode, the first opening having a perimeter; a third insulating film disposed on the second insulating film and having a second opening exposing a portion of the surface of the second insulating film, the second opening having a perimeter that surrounds the perimeter of the first opening on the second insulating film; and an upper electrode disposed on the first insulating film through the first opening and extending onto the second insulating film.

Abstract: A printed circuit board has a plurality of layers. A first surface land is formed on an inner layer. A dielectric material is laminated on the inner layer. A second surface land is formed on the dielectric material overlapping the inner surface land or positioned along the border of the inner surface land. A hole is etched in the dielectric material exposing the first surface land to the second surface land. The second surface land does not completely surround the hole. A component lead is positioned over the second surface land. Solder is reflowed into the hole to interconnect the surface lands to each other and to the component lead. Because the second surface land does not completely surround the hole, the solder does not bridge across the hole and thereby forms a solid connection between the first and second surface lands.

Abstract: An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.

Abstract: A high energy multilayer ceramic capacitor formed of alternating ceramic and electrode layers, the capacitor being suitable for use in implantable medical devices. The ceramic layers are comprised of a dielectric composition of lead magnesium niobate with small amounts of dopants, namely, lithium niobate, copper oxide, magnesium titanate, manganese niobate, and zirconium oxide, with appropriate electrical terminations connected to the electrode layers. The capacitor thus fabricated exhibits greatly reduced ferroelectric effect, namely, less than 30% over a bias range of 0-1,000 volts. It has a breakdown voltage of at least 700 volts, a leakage current less than 10 pico amps at 1,000 volts, an energy density of greater than 10 J/cc, has a rectangular form factor 1.5 inches by 2.0 inches by 0.06 inch thick, and weighs no more than 30 grams.

Abstract: A method for forming a stacked container capacitor for use within integrated circuits. Formed successively upon a semiconductor substrate is a first dielectric layer, a second dielectric layer and a patterned mask layer. Within an isotropic etch process, the first dielectric layer etches slower than the second dielectric layer. By means of an anisotropic etch process employing the patterned mask layer as a mask, an aperture is etched at least partially through the first dielectric layer. By means of an isotropic etch process employing the patterned mask layer as a mask, the second dielectric layer is etched to yield a ledge formed above the first dielectric layer and below the patterned masking layer. The patterned mask layer is then removed. Formed then into the anisotropically and isotropically etched aperture is a first polysilicon layer, a third dielectric layer and a second polysilicon layer.

Abstract: An electronic device housing is constructed of multiple connecting panels. The panels are provided with deformations where they contact other panels. The deformations are spaced a distance which is a function of the frequency of the primary electromagnetic radiation emitted by the electronic device to provide positive grounding at that frequency. The housing may be a personal computer housing.

Abstract: A capacitor apparatus includes, a) a substrate having a node; b) an inner capacitor plate in ohmic electrical connection with the substrate node; c) an outer capacitor plate; d) a capacitor dielectric layer interposed between inner and outer capacitor plates; e) an electrically conductive reaction barrier layer interposed between the substrate node and the inner capacitor plate, the reaction barrier layer having outer lateral edges which are recessed beneath the inner capacitor plate; and f) oxidation barrier blocks being received over the recessed outer lateral edges beneath the inner capacitor plate. Methods of forming such a capacitor are also disclosed.

Abstract: A capacitor has first and second pin contacts. A first female contact receives the first pin contact of the capacitor, and a second female contact receives the second pin contact of the capacitor. Electrical contact is established between the first and second pin contacts and the corresponding first and second female contacts. The first and second female contacts are in corresponding first and second displaced planes.

Abstract: A solid electrolytic capacitor has a molded casing containing therein a capacitor element, a first lead member connected to its anode and a second lead member connected to its cathode through a fuse. The second lead member is designed such that a relatively large capacitor element can be contained inside the casing although it must also have a large enough hole to allow a portion of the casing to penetrate therethrough to fasten it to the casing.

Abstract: A 15 kv cable joint is enclosed within two half shells filled with sealant material. Displacement or thermal expansion of the sealant is accommodated by various configurations of stress cones that have apertures or surfaces that are flexible and arranged to maintain pressure on the sealant for example during thermal cycling of the joint.

Abstract: A low odor cover for a connector of a cable is disclosed, which has a sleeve which is chemically swellable and which is initially in dilated configuration, and which subsequently shrinks into place by evaporation of the volatile dilation composition. The sleeve is made of a high density elastomeric material, such as a natural or synthetic rubber, preferably (EPDM), neoprene or Hypalon.TM. rubbers. The volatile liquid combination dilation composition used is composed of a C.sub.7 -C.sub.8 aliphatic hydrocarbon component and a fluorocarbon component. The device provides a protective cover for a cable connection or splice which can be easily installed, quickly shrunk into tight vapor resistant protective covering within a matter of a few minutes, and can be installed without the need for any application of heat or use of special tools, equipment or materials.

Abstract: A capacitor has a bottomed outer casing housing a capacitor element therein, a lid closing the bottomed outer casing and having a pair of insertion holes defined therein, and a pair of electrode terminals mounted on the lid and connected to the extension leads. The capacitor element includes a plurality of current collectors with respective extension leads extending therefrom. Each of the electrode terminals has an insert inserted in one of the insertion holes with an insulator interposed between the insert and the lid, a flange contiguous to an end of the insert and held against a surface of the lid through the insulator, a joint projecting from the flange and connected to the extension lead, and a staked member contiguous to an opposite end of the insert and crimped over an opposite surface of the lid with the insulator interposed between the staked member and the lid.

Abstract: A casing 14 for a junction included in a flat cable 10, e.g. for a trigger stage of a sequential blasting system, consists of two casing portions 12, 13 adapted to be fixed to each other by screwing within the lead-through regions of the cable. The casing portions 12, 13 constitute cramping areas for fixing the cable 10 to the casing 14 in a direct, non-positive way, wherein the screws 23 which interconnect the two casing portions 12, 13 at the same time create the cramping pressure. An additional positive engagement between the cable 10 and the casing 14 is achieved by engagement between a tube 25 which receives the screw 23 and a hole 29 provided in a center web 28 of the cable. Tensile strain occurring within the cable 10 is thus diverted via the casing 14 around the electrical equipment provided in the casing and soldered to the wires 19 of the cable 10. Even under high tensile forces, the soldering points are thus not exposed to any strain.

Abstract: A ferroelectric capacitor structure and its method of making in which a ferroelectric stack of two metal-oxide electrodes sandwiching a ferroelectric layer is fabricated on a silicon substrate with an intervening barrier layer, preferably of TiN. In one embodiment, a platinum layer is grown between the TiN and the lower metal-oxide electrode at a sufficiently high temperature that provides crystallographically ordered growth of the ferroelectric stack. In another embodiment, the platinum layer was completely eliminated with the lower electrode being grown directly on the TiN. Although the conventional conductive metal-oxide used in the electrode is lanthanum strontium cobalt oxide (LSCO), lanthanum nickel oxide provides good electrical and lifetime characteristics in a ferroelectric cell. Alternatively, the electrodes can be formed of the rock-salt metal oxides, such as neodymium oxide (NdO).

Abstract: A wire protecting shield including an oblongated sheet metal plate having an upper surface, a lower surface, a right side, a left side, a right edge, a left edge, a first end, a second end, and having a midline axis; the right and left sides of the sheet metal plate being under-folded so that the right and left edges of the sheet metal plate are positioned substantially parallel with the midline axis, and respectively below and to the right and left of the midline axis, the sheet metal plate forming a wire protecting channel having a pair of sidewalls and a ceiling, the sidewalls including the right and left edges of the sheet metal plate, and the ceiling including the lower surface of the sheet metal plate.

Abstract: A circuit board assembly which includes a flexible printed circuit bonded to a substrate by an adhesive that is curable upon exposure to actinic radiation of a preselected wavelength is provided. The flexible circuit includes a dielectric layer made from a material that is transmissive to actinic radiation of a preselected wavelength and a conductive layer disposed on a surface of the dielectric layer. The conductive layer has an opening therethrough to allow passage of the actinic radiation through the flexible circuit. Preferably, the opening is in the region of the conductive layer that lacks metal tracings. The substrate of the assembly includes a top surface defining a mating region and a channel and a side surface defining a port that is in communication with the channel. The channel of the substrate is aligned and coincident with the opening of the conductive layer. The adhesive is disposed within the channel.

Abstract: A combined electronics mounting plate and heat exchanger and method of manufacturing same. The present invention provides an electronics mounting plate formed from a metal matrix composite and a metal heat exchanger in order to combine the low coefficient of thermal expansion and high heat dissipation characteristics of a metal matrix composite, with the cost effectiveness and relatively easy manufacturability of metal. In the preferred embodiment, the metal matrix composite is provided in the form of aluminum and silicon carbide, and the metal heat exchanger is provided in the form of aluminum fins. The method of manufacturing the present invention includes the steps of cleaning the metal matrix composite mounting plate and aluminum heat exchanger in a nitric acid fluoride salt before brazing the elements together.

Abstract: A device for opening of an electrical wire insulating cover allowing access to the interior walls of the insulating cover for purposes of inspection or cleaning. A preferred embodiment teaches a one piece rigid structure formed from a first wall having a semi-circular longitudinally rolled shape spaced apart from a second sidewall having a mirror shaped semi-circular longitudinally rolled formation wherein each sidewall forms a partial cavity allowing for placement of the leading edge of an electric insulating cover. The sidewalls are spaced apart by use of either an adjustable or fixed saddle portion which is used in biasing the outer surface of the insulating cover while the leading edges of the cover are placed within partial cavities. Upon placement, the insulating cover is maintained in an open position allowing inspection of the interior chamber.

Abstract: This invention is directed to a fully shielded printed circuit (PC) card holder, that may be readily "snapped" into the assembly, or disassembled, as the case may be. The holder is intended to receive a PC card, where at least one end of the card is adapted to be electrically connected to an I/O type connector. The holder comprises a generally rectangular bottom cover member formed of a conductive material, corner supports integrally molded to the bottom cover member at the respective corners thereof, where each support includes a lower flange portion to which the bottom cover member is exposed. Further, a generally rectangular upper cover member is provided where the periphery thereof includes a downwardly extending flange adapted to engage the lower flange portion in electrical contact with the bottom cover member over a substantial portion of the periphery thereof.