Abstract: A pseudo rod, fabricated from several plate sections joined together at their edges and having a cross-section resembling a polygon approximates a rod having a circular cross section. Using multiple plates joined at their edges permits growing a crystalline material on the planar faced substrates and if the plates are crystalline material, the crystalline material grown thereon can have improved current carrying capability.

Abstract: The housing for an electronic circuit provided with a connection plug, particularly for control device electronics of an internal combustion engine of a vehicle, includes a cooling frame to which a printed circuit board having the electronic circuit is fastened and which has at least one cooling portion with which power components connected to the printed circuit board are connected so as to conduct heat, and also includes a cover enclosing the printed circuit board. For a simple construction, it is suggested that the cooling frame (5) be constructed as a flat frame (6) with flat frame legs (8, 8a, 8b, 8c, 8d) substantially parallel to the plane (7) of the printed circuit board (3), the housing cover pieces (12, 13) forming the cover (11) being arranged at the upper and lower sides (9, 10) of the flat frame (6).

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

Abstract: An EMI/RFI shield for seams and cracks in surfaces of shielded structures disclosed. At least one conductive screen is applied in electrical contact with the surfaces and a conductive coating is applied over the screen to physically bond the screen to the surfaces and to maintain electrical conduction.

Abstract: A high-frequency circuit package including a conductive substrate, and upper and lower shielding cases which come tightly into contact with opposite surfaces of the conductive substrate to define therein upper and lower shielding chambers. High-frequency circuits are mounted on the surfaces of the conductive substrate within the upper and lower chambers, respectively.

Abstract: An electronic proximity switch orientatable in various response directions includes a sensor housing, a rotatable angle member and a connecting piece, with the rotatable angle member being selectively attachable to the sensor housing in two different positions. A base member is provided which is adapted to be mounted to the rotatable angle member at an installation site, with the base member being selectively lockable in at least four rotary positions. The entire electronic circuitry is accommodated in the sensor housing and the base member is constructed as an assembly block, with a plug being rotatably disposed within the connecting piece. The assembly block carries a locking fastener which is receivable in passages provided in the connecting piece so that the rotary position of the rotatable angle member can be rotatably locked in a stepwise fashion and a rotary position of a plug can be rotatably locked in an infinitely variable manner.

Abstract: There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.

Abstract: A rotary connector is provided which includes a rotatable case having an inner cylindrical shaft, a fixed case having an engaging portion engaged with an end portion of the inner cylindrical shaft and coupled with the rotatable case with a clearance therebetween, and a spirally wound flat cable housed in the fixed and rotatable cases, the flat cable being allowed to loosen and tighten to thereby permit a predetermined number of rotations of the rotatable case relative to the fixed case. A projection protruding radially inward is provided at the engaging portion, such that a radially extending clearance is defined between the projection and the end portion of the inner cylindrical shaft.

Abstract: The disclosed invention relates to a video display system having a device for shielding electromagnetic radiation emitted from electrical wires which connect a video amplifier to a cathode ray tube. The device uses inexpensive unshielded wires which are recessed within a conductive shielding enclosure. The wires are connected to the cathode ray tube by a socket which is positioned at an access opening in the shielding enclosure. The invention further relates to a device for mounting a shielding enclosure to a base using tabs on the enclosure which are captured in an interference fit between the surface of the base and brackets coupled to the base.

Abstract: A high-voltage transformer, for an X-ray apparatus includes a high-voltage winding (4) which consists of at least one coil (5) which is supported by an insulating member (6). Heat dissipation from the coil is improved in that the coil is wound so as to be self-supporting and have a stable shape without requiring the use of supporting members and/or intermediate insulating elements, a small part of its surface being connected to the insulating member so that the greatest part of its surface is situated a distance from the walls of the insulating member.

Abstract: A self leaded header for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of feet extending downward from the base for supporting the same on a PC board, a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, an inductance coil mounted in the cavity, and a lead extending from the coil to and wound multiple turns around each of the lead support members and disposed for surface bonding to a PC board.

Abstract: An oscillator package includes a header substrate with a number of through holes formed therein, a copper post passed through each through hole, a ceramic substrate securely mounted to and supported by the copper posts for mounting a die and a crystal thereon, a substantially L-shaped lead securely attached to an underside as well as a lateral side of the header substrate and contacting each copper post, and a ceramic cover housing the die and crystal. A metal film is applied to an inner periphery of the hole, and the copper posts are mounted in the holes after the metal-film is sintered. An outer periphery of the copper post is plated by nickel then gold. The lead is mountable to a circuit board by soldering, and the solder covers an overall area of the lead. The ceramic cover has at least a 90% weight of aluminum oxide.

Abstract: A packaging unit consisting of two molded plastic boxes, each having one side open. One of the boxes is laid flat with the open side up and receives therein a thermal cutoff/clip/resistor assembly. The other molded plastic box is placed over the first and the two are held together by symmetrical interlocking devices. The covers serve as assembly fixtures and protective housing.

Abstract: This invention provides a superconducting magnetic shield and a magnetic shielding apparatus including the same, thereby accurately measuring an extremely weak magnetic field such as magnetoencephalographic waves by reducing the influence of magnetic field of the earth or magnetic noises.

Abstract: An environmentally sealed vehicular air bag sensor. The sensor employs a conventional ball and tube accelerometer which supplies an electrical signal when subjected to a deceleration of force equal to or greater than a preset limit. All of the electrical connections of the sensor are disposed in the interior thereof, and the interior is sealed from the operating environment of the vehicle, thus enhancing reliability and minimizing accidental damage thereto.

Abstract: A method for simultaneously manufacturing metallized carriers from wafer-shaped substrates is described, wherein such wafer-shaped substrates permit the use of standard IC fabrication apparatus and methods. As a result, very thin and finely dimensioned traces can be deposited. Thin-film manufacturing techniques are used to create the high-density traces on the surface of the chip carriers, thereby permitting direct connections from the IC to the periphery of the carrier without the need for vias. A lid hermetically seals and protects the package. The traces are comprised of a plurality of metals to facilitate bonding, each of the metals homogeneous for a portion of the trace. One metal portion of the trace is of a type compatible with an IC chip placed in the carrier. Another metal portion of the trace is of a type compatible with a trace on a printed circuit board. A metal barrier is interposed between the metals to prevent metal diffusion from one metal to an adjoining portion of another metal.

Abstract: A modular computer system is disclosed that includes a self-contained work-slate unit having a housing comprising a dense layer forming an external surface of the housing, a first layer of woven structural fiber material overlaying the relatively high density layer, a layer of closed cell foam material overlaying the first layer of structural fiber material preferably woven, a second layer of woven structural material overlaying the layer of closed cell foam material, a layer of electro-magnetic shielding material overlaying the second layer of woven structural material and a third layer of woven structural fiber material overlaying the layer of electromagnetic shielding. The first, second and third layers of woven structural fibers, the layer of electro magnetic shielding and the layer of closed cell foam are permeated with a thermoset resin for binding the respective layers of the composite housing together.

Abstract: A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

Abstract: A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.

Abstract: An improved transmission system for electrical energy comprising a plurality of ball members interspersed by mating members enclosed within at least one protective outer wrapping, with the ball members and the mating members being in contact with adjacent members and being formed of material which is electrically conductive at superconductor temperatures and each having an axial opening extending therethrough to permits passage of a suitable coolant fluid, such as liquid helium.