Patents Examined by Bot Ledynh
  • Electrical component arranged for locking and electrically conecting in an opening of a panel fromexternally of the panel
    Patent number: 5381308
    Abstract: A device and method for locking an electrical component, having a body and a flange portion, with a panel through a panel opening, in which the flange abuts a first face of the panel, which includes moving an actuator on the body of the component to displace a cam follower on the body from a first to a second position in which the cam follower projects beyond the contour of the body enough to abut another panel face.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: January 10, 1995
    Inventors: Richard W. Wolpert, Alan T. Wolpert, Richard A. Wolpert
  • Electrical assemblies
    Patent number: 5379189
    Abstract: An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad on the capacitor. Two further contact pads on the substrate are soldered to the other connector pad on the capacitor. The contact pads on the substrate are connected to tracks that extend to plated-through holes and are electrically connected to one another at a point remote from the capacitor.
    Type: Grant
    Filed: November 2, 1993
    Date of Patent: January 3, 1995
    Assignee: Smiths Industries Limited Company
    Inventor: Terence C. Merriman
  • Wire support and guide
    Patent number: 5376756
    Abstract: Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.
    Type: Grant
    Filed: December 20, 1991
    Date of Patent: December 27, 1994
    Assignee: VLSI Technology, Inc.
    Inventor: Young I. Kwon
  • Ceramic wall hybrid package with washer and solid metal through wall leads
    Patent number: 5374786
    Abstract: A package for electrical circuitry and method of making same wherein the package is provided with apertured ceramic side walls. Ceramic layers, which have been previously co-fired together and have an aperture therethrough for receiving a copper-based lead, are positioned in each of the apertures along with a copper-based lead. A Kovar braze washer, which has an aperture therein having approximately the same dimensions as the outside dimensions of the lead is positioned over the lead and against the ceramic layers and brazed to these layers and the lead to provide an hermetic seal. A good electrical conductor is then brazed to the portion of the lead extending external to the package.
    Type: Grant
    Filed: March 18, 1994
    Date of Patent: December 20, 1994
    Assignee: Texas Instruments Incorporated
    Inventor: William C. Weger
  • Multi-chip module with multiple compartments
    Patent number: 5369552
    Abstract: The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.
    Type: Grant
    Filed: July 14, 1992
    Date of Patent: November 29, 1994
    Assignee: NCR Corporation
    Inventors: Lawrence C. Barnes, Gary R. Thornberg
  • Aluminum based article having an insert with vitreous material hermetically sealed thereto
    Patent number: 5367125
    Abstract: An insulating electrical feed-through connector extending through a wall of aluminum is obtained by using a sintered sleeve comprising phosphate glass in which a conductive pin is inserted. The sleeve is raised to a firing temperature in excess of the dilatometric softening temperature of the vitreous material in the presence of a first effective quantity of alumina between the sleeve and the wall and of a second effective quantity of nickel oxide between the sleeve and the pin, which makes it possible to achieve a simultaneous and direct hermetic sealing of the sleeve to the wall and of the pin to the sleeve.
    Type: Grant
    Filed: January 4, 1994
    Date of Patent: November 22, 1994
    Assignee: Dassault Electronique
    Inventors: Paul Viret, Bernard Ledain
  • Electromagnetic compatibility enclosure
    Patent number: 5365410
    Abstract: The invention relates to an EMC enclosure (4) used in radiotelephones as protection of the radiotelephone components, the enclosure (4) having no separate cover in order to service or to repair the components. Between the cover (16) and the side walls (15) the EMC enclosure has necks (7,11) with openings (8,12,13,14) between them. Due to these openings it is possible to open the cover (16) with a suitable tool. When the cover has (16) been opened it is possible to solder it back or to use a repair cover.
    Type: Grant
    Filed: October 19, 1992
    Date of Patent: November 15, 1994
    Assignee: Nokia Mobile Phones Ltd.
    Inventor: Pekka Lonka
  • Chassis with immovable attachment elements affixed thereto
    Patent number: 5365408
    Abstract: An appliance chassis (1) contains attachment elements (52) for supporting, holding and affixing electrical and/or mechanical components (55), and, in the vicinity of certain attachment elements, has one attaching device (57) for inserting and affixing repair elements (56) assigned to the attachment elements, in the event of damage to the attachment elements. When inserted into the attaching device, the repair elements replace parts (14.1) of the holding device (14), which were lost because of damage to the attachment element.
    Type: Grant
    Filed: August 5, 1993
    Date of Patent: November 15, 1994
    Assignee: Nokia Technology GmbH
    Inventor: Siegfried Apitz
  • Memory card
    Patent number: 5363274
    Abstract: A memory card having no ordinary type circuit board and a reduced thickness. Insulating layers are disposed on reverse surfaces of a pair of metallic panels, and circuit patterns are formed on the insulating layers. A plurality of electronic parts are mounted on the metallic panels by, for example, being soldered to the circuit patterns. The pair of metallic panels on which the electronic parts are mounted are fitted and bonded to openings formed in a frame of the card so that the electronic parts are accommodated inside the frame facing each other.
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: November 8, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Makoto Omori, Jun Ohbuchi, Hajime Maeda, Yasushi Kasatani
  • Apparatus for containing and supporting electronic components
    Patent number: 5363276
    Abstract: An apparatus for containing and supporting electronic components includes a first housing portion having a first support, and a second housing portion having a second support. The apparatus further includes an elastomeric isolating member being secured between the first support and the second support so as to position the isolating member within the apparatus. Moreover, the apparatus further includes a base upon which electronic components are mounted, the base being attached to the elastomeric isolating member.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: November 8, 1994
    Assignee: NCR Corporation
    Inventor: Robert J. Crockett
  • Magnetically permeable electrostatic shield
    Patent number: 5360941
    Abstract: A permeable electrostatic shielding method and apparatus is disclosed that is suitable for use in shielding portable electronic devices such as calculators, smart cards and radios. Such electronic devices require protection from the electrostatic discharge occurring when a user accumulates an electrostatic charge and contacts a conducting surface of the electronic device. The resulting electrostatic discharge creates capacitively-coupled voltage transients in the digital circuits within the electronic device. The present invention prevents local charge accumulation on the surfaces of such electronic devices, which transmit and receive electromagnetic radio waves, without blocking the electromagnetic radiation essential to device function.
    Type: Grant
    Filed: October 28, 1991
    Date of Patent: November 1, 1994
    Assignee: Cubic Automatic Revenue Collection Group
    Inventor: John B. Roes
  • Printed circuit board having a cutout
    Patent number: 5359495
    Abstract: A printed circuit board includes electrical circuit components electrically connected to a plurality of male connectors mounted on the board and extending outwardly of one edge for connecting the board into an electrical system. The printed circuit board is formed with a cutout adjacent a second edge to define a first board section bordering one side of the cutout and including the first edge mounting the male electrical connectors outwardly thereof, and a second board section bordering another side of the cutout and including the second edge facing outwardly of the board and another edge facing inwardly of the board. The inwardly-facing edge of the second board section includes a plurality of female connectors connected to the circuit components to permit mounting an electrical device to extend inwardly of the second board section into the cutout.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: October 25, 1994
    Assignee: Aladdin Knowledge Systems Ltd.
    Inventors: Yanki Margalit, Danny Margalit
  • Superconductive device for helping shield magnetic field
    Patent number: 5359149
    Abstract: A superconductive device for helping shield magnetic field comprises at least two members; a layer containing superconductive oxide over each of the members; connecting component for connecting the members to form a substrate; and connecting element for connecting the layers containing superconductive oxide along a joint in which the members are connected.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: October 25, 1994
    Assignee: NGK Insulators, Ltd.
    Inventors: Shoji Seike, Hideki Shimizu, Makoto Tani
  • Mounting structure of piezoelectric element
    Patent number: 5359494
    Abstract: An opening 11 is formed in a region of a circuit board 10 opposite to a vibration region E of a piezoelectric element 5. The piezoelectric element 5 is mounted on the circuit board 10, and electrode connection portions 9 of the piezoelectric element 5 are connected with and fixed to the circuit board by a solder. In succession, soldered connection portions kept away from the vibration region E of the piezoelectric element 5 are filled with a bonding agent 8. Thereupon, an excess bonding agent 8 with which the soldered connection portions are filled is eliminated by the opening 11, and hence is prevented from invading the vibration region E of the piezoelectric element 5. Further, any stress exerted on the circuit board 10 is dispersed because of its being mostly received by the bonding agent 8, and hence any stress exerted on the piezoelectric element 5 is reduced.
    Type: Grant
    Filed: October 8, 1993
    Date of Patent: October 25, 1994
    Assignee: Murata Mfg. Co., Ltd.
    Inventor: Ryoichi Morimoto
  • Card-receiving electronic device having grounding spring
    Patent number: 5357402
    Abstract: A grounding spring is provided for discharging static electricity on a card as the card is inserted into an electronic device and for thereafter grounding the card, which minimizes electromagnetic radiation during electrostatic discharge in a simple and easily mounted construction. The grounding spring (60, FIG. 3) is formed of sheet metal and has a card-engaging part 64 lying within a recess of a card-guiding track (72). The grounding spring has a downwardly extending leg (90) that extends down into a hole (92) of a circuit board lying under the card-receiving mechanism, and has a substantially 180.degree. loop (112) connecting the card-engaging part to the downward leg.
    Type: Grant
    Filed: May 15, 1992
    Date of Patent: October 18, 1994
    Assignee: ITT Corporation
    Inventor: John W. Anhalt
  • Electrostatic shielding sheet for making a box used for shipping and storing electronic components and a shipping box made thereof
    Patent number: 5354950
    Abstract: An electrostatic shielding material sheet (10) for making a shipping box (12, 12a) to enclose and protect electronic components and/or assemblies--and the box itself--is characterized by different layers (14, 16, 18, 20) forming an electrostatic shielding material sheet (10), one layer (16) thereof being highly conductive with a surface resistivity of less than 1.times.10.sup.4 Ohm/sq--preferably 10.sup.2 to 10.sup.3 Ohm/sq--and being allocated to electrostatic dissipative layers (14, 18) with a surface resistivity of between 1.times.10.sup.5 Ohm/sq and 1.times.10.sup.12 Ohm/sq. The highly conductive layer (16) is sandwiched between electrostatic dissipative layers (14, 18) or embedded in one of the other layers (14, 18, 20). Additionally, the electrostatic shielding layer (16) shall contain highly conductive fibers.
    Type: Grant
    Filed: May 18, 1992
    Date of Patent: October 11, 1994
    Assignee: Firma Wolfgang Warmbier Systeme gegen Elektrostatik
    Inventor: Meir Golane
  • Ball grid array with via interconnection
    Patent number: 5355283
    Abstract: A ball grid array is formed by mounting and electrically connecting one or more electronic devices to a substrate in which vias are formed to interconnect electrically conductive traces formed in a surface of the substrate to solder ball pads formed at an opposite surface of the substrate. The vias are formed by mechanical or laser drilling. Solder balls are formed on each of the pads and are reflow-attached to, for instance, a printed circuit board. The electronic components can include one or more integrated circuit chips, as well as passive components. The electronic components are attached to the substrate using wirebonding, TAB or flip chip connection. An encapsulating material is applied to encapsulate the electronic devices.
    Type: Grant
    Filed: April 14, 1993
    Date of Patent: October 11, 1994
    Assignees: Amkor Electronics, Inc., Teijin Limited
    Inventors: Robert C. Marrs, Tadashi Hirakawa
  • Process transmitter with inner conductive cover for EMI shielding
    Patent number: 5353200
    Abstract: A transmitter comprises a housing, an electronics assembly, an inner cover, and an outer cover. The electronics assembly includes an actuatable switch and fits within an open-ended cavity in the housing. The inner cover is positionable over the open end to cover the electronics assembly and has a deflectable button portion which is alignable with the actuatable switch and accessable from the open end while the electronics assembly is energized. The inner cover is electrically conductive and has a sleeve which frictionally mates with electrically conductive walls of the housing to shield the electronics assembly from electromagnetic interference (EMI). The inner cover is preferably an insulating molded plastic part with a thin metallic coating.
    Type: Grant
    Filed: February 24, 1993
    Date of Patent: October 4, 1994
    Assignee: Rosemount Inc.
    Inventors: Joel J. Bodin, Garrie D. Huisenga, Theodore L. Johnson, William C. Rauth
  • Shield device for printed circuit boards
    Patent number: 5353201
    Abstract: A shield device for a printed circuit board includes a shield body and a receiving member to be fitted to the shield body which has a plurality of first legs extending perpendicularly to the upper surface of the printed circuit board. The receiving member has a plurality of second legs formed at the corresponding positions to the respective first legs of the shield body to form pairs of first and second legs, each of the pairs of legs penetrating through a slit formed in the printed circuit board, and being joined together. The receiving member can be attached to the shield body by means of simple mechanical engagement, so that the operation therefor becomes much easier.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: October 4, 1994
    Assignee: Funai Electric Co., Ltd.
    Inventor: Osamu Maeda
  • Self-leaded surface mounted rod inductor
    Patent number: 5351167
    Abstract: An electronic component adapted for surface mounting on a PC board has an elongate bobbin made of a dielectric material. A coil of wire is wound about the winding support surface of the bobbin. The coil has a pair of lead terminations which are wrapped around a pair of T-shaped lead termination support members extending from the same side of the bobbin. When the bobbin rests on top of a PC board, the support members position the wrapped lead terminations slightly above solder pads.
    Type: Grant
    Filed: May 17, 1993
    Date of Patent: September 27, 1994
    Assignee: Pulse Engineering, Inc.
    Inventors: Ka K. Wai, Aurelio J. Gutierrez