Abstract: A universal lattice assembly for use in a magnetic-type electronic article surveillance system is disclosed which comprises a frame formed of two identical molded plastic half-shells, a metal chassis within which specific electronic sub-assemblies may be positioned and a coil assembly including a field-producing coil and a detector coil. The frame includes a substantially continuous series of tabs and notches which are positioned to be inter-connected as the half-shells are pressed together, the resulting assembly becoming dimensionally rigid, thus firmly anchoring a coil assembly in place, preventing any relative movement as the assembled unit may be jostled in operation.

Abstract: A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are arranged at opposing surfaces of the molds and symmetrically formed with respect to a parting face of the mold tool to connect with the cavities. A method for forming the component includes the steps of inserting the supporting member with the chip in the cavities of the molds of the mold tool, clamping the molds, injecting molten resin into the cavities of the clamped molds through the upper and lower gates, cooling the molten resin in the cavities, and separating the molds from each other and removing the component from the cavities.

Abstract: Using specially designed molded plastic I/O output brackets having differently arranged connection opening series formed therein, a variety of differently configured computers may be manufactured using identical sheet metal chassis. Each bracket has an identical peripheral configuration, is complementarily receivable in an end wall cutout area of any of the chassis, and has a series of I/O connections formed therein which are arranged to complementarily receive the I/O connector devices mounted on the system planar board selected for incorporation within the particular chassis. When the bracket is operatively installed in the cutout area of the chassis wall a peripheral groove formed in the bracket receives an edge portion of the chassis wall and forms therewith an EMI seal having a labyrinth configuration.

Abstract: A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.

Abstract: An interconnection system for high performance electronic hybrids employs micro-machined features on a substrate to connect directly to miniature electronic components, such as integrated circuits. The micro-machined features may include posts for connecting to bonding pads of standard components and may also include rails for alignment of components and connections to specially made components.

Abstract: A printed circuit board capable of resilient deformation having two major surfaces and a contact edge. Electrically conductive traces are provided on each major surface of the board which lead to electrically conductive contact pads at the contact edge of the board. A gap is provided between the two major surfaces of the board along the contact edge. The gap permits resilient deformation of the board so that a force is created upon deformation which will bias the major surfaces toward their undeformed position. An elastomeric biasing member may be provided in the gap.

Abstract: The present invention relates to a film carrier for semiconductor devices, the film carrier comprising a dielectric film 1 having at least one opening 9 formed therein, and a support ring 2 disposed in the opening and made of a material the same as that of the dielectric film, the support ring 2 being thinner than other portions, without deteriorating the entire mechanical strength of the film carrier, the electric characteristics at the support ring can differ from the electrical characteristic at the other portions of the film carrier.

Abstract: The present invention provides a method and an apparatus for manufacturing a pin grid array package assembly. According to this invention, the leads of the pin grid array package assembly are removably inserted into an electrically conductive plate containing detachable pin-clasp contacts. The plate clamps onto the ends of the leads, thereby forming a common electrical contact for the electroplating process. After the electroplating process has been completed and prior to shipping the package, the plate is detached without requiring the step of cutting ends of the leads from the plate.

Abstract: In a semiconductor device, an on chip coaxial cable reduces noise from adversely affecting a signal transmitted by a signal conductor. The signal conductor lies within and is isolated from a second conductor. A dielectric, such as oxide, may provide isolation. In multi level metal devices, such as double level metal devices, the signal conductor can be formed of a first level of metal and a portion of the second conductor can be formed of the first level of metal also. After forming a first level of metal, it is patterned to separate the first signal conductor from a first conductive noise shield and a second conductive noise shield. A second level of metal and a conductive level of material such as polysilicon can complete formation of the second conductor. Oxide insulators can provide isolation between the signal conductor and the second conductor by lying between the top conductive noise shield and the signal conductor and by lying between the bottom conductive noise shield and the signal conductor.

Abstract: This invention is directed to a fully shielded printed circuit (PC) card holder, that may be readily "snapped" into the assembly, or disassembled, as the case may be. The holder is intended to receive a PC card, where at least one end of the card is adapted to be electrically connected to an I/O type connector. The holder comprises a generally rectangular bottom cover member formed of a conductive material, corner supports integrally molded to the bottom cover member at the respective corners thereof, where each support includes a lower flange portion to which the bottom cover member is exposed. Further, a generally rectangular upper cover member is provided where the periphery thereof includes a downwardly extending flange adapted to engage the lower flange portion in electrical contact with the bottom cover member over a substantial portion of the periphery thereof.

Abstract: A rectangular cage formed of near identical grooved support panels (290,292,294,296) slidably mounts horizontal and vertical stacks of circuit boards and circuit board frame assemblies (280,282), with each board of one stack connected to some or all boards of the other stack in edge to edge relation. The cage is open at both front and rear to slidably receive the circuit board frame assemblies that are latched in place by a lever (208) operated cam (210) arrangement on each board frame that engages pairs of latch rods (218) on front and rear edges of the support panels. The support panels are apertured (302,304) to allow air to be blown over the circuit boards and two of the panels (290,292) carry mid-plane terminating panels (342,330) for support of cable connector sockets (38).

Abstract: An electronic card (10) has a housing (12) containing integrated circuitry. On a surface (14) of the card are contact pads (26, 28) connected to the internal circuitry. The contact pads are covered by a movable shield (32). An electrical connector assembly (50) mounted on a printed circuit board (52) includes a base member (56) having contact members (62, 64) in contact with contact pads (54) on the printed circuit board. The connector assembly further includes a hollow casing (66) pivotably mounted on the base member (56). The electronic card (10) is inserted within the casing (66), which is arranged to move the shield (32) so as to expose the contact pads (26, 28) of the card (10). The casing (66) holding the card (10) is then pivoted so that the contact pads (26, 28) of the card (10) engage the contact members (62, 68). A latch member (112) is provided for maintaining the contact pads in engagement with the contact members.

Abstract: An integrated circuit package for a charge-coupled image sensor. The package comprises first and second ceramic bodies being fused together to form a unitary structure; a CCD image sensor mounted on the first ceramic body; and, electrical circuitry mounted on the second ceramic body.

Abstract: A chip packaging configuration prevents differential electrical coupling within a plurality of associated bit lines (14 and 16) by associating, under lead frame (26), a first packaging material having a first dielectric constant and a second packaging material having a second dielectric constant and where the first packaging material and second packaging material are configured to expose the plurality of associated bit lines (14 and 16) to allow approximately equal coupling to lead frame (26) for each bit line (14 and 16) through the first and second dielectric constant to thereby prevent differential electrical coupling of the plurality of bit lines (14 and 16) with lead frame (26).

Abstract: A simplified construction is suggested for an electrical construction assembly, or an assembled electrical component, having a circuit board, a liquid crystal display, a light conductor, and a sheet-metal screen. In this regard, a leg of the sheet-metal screen extends about one edge of the circuit board and effects, on the one hand, a secure contacting of the liquid crystal display and, on the other hand, in an uncomplicated manner, a releasable clamping together of the assembly.

Abstract: In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable film member which in turn is fixedly mounted on the circuit substrate by adhesive at the opposite side or all the sides of the heat-shrinkable film member. When the heat-shrinkable film member is heated, the shrinkage of the heat-shrinkable film member presses the LSI against the circuit substrate under pressure. Thus, the bumps of the LSI can be electrically connected with the wiring pattern on the circuit substrate. Therefore, the LSI can be easily mounted on the circuit substrate or replaced by a new one.

Abstract: A card file adapter assembly for mounting a plurality printed wiring cards of a smaller size than are normally permitted on an associated electronic equipment mounting rack. The adapter is so constructed in size as to be able to be slid directly into existing mounting hardware of an older type providing mounting space for printed wiring cards of a more reduced size.

Abstract: Packaging for an electronics assembly. A base card has a row of elongated slots. A number of individually insertable subassemblies have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.

Abstract: An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

Abstract: An apparatus according to the present invention is capable of housing a plurality of plug-in packages, each plug-in package being provided with a first connector. The apparatus includes, a housing having a front panel on which a plurality of insertion openings is provided through which openings the plug-in packages can be inserted into the housing, a first edge of each of the plug-in packages leading and a second edge of each of the plug-in packages trailing when inserting, a mother board mounted in the housing, the mother board having a plurality of second connectors fixed thereon, each second connector corresponding to one of the insertion openings formed on the panel, and a supporting member for pivotably supporting the first edge of each of the plug-in packages which was inserted in the housing so that the first connector faces to a corresponding one of the second connectors of the mother board.