Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Abstract: A circuit assembly comprises a plurality of electronic devices mounted on a circuit board, including a matched pair of devices intended for use together in the same circuit. In order to reduce the risk of using un-matched devices at the assembly stage the pair of matched devices are joined together prior to mounting them on the circuit board. For this purpose a simple bracket is disclosed into which the two devices can be inserted from opposite ends by push-fitting.

Abstract: An overmolded electrical connector including an insulative block, the insulative block receiving connecting members and being mechanically joined to a rear connection housing, the insulative block being protected by a first metal half-shell and a second metal half-shell adapted to be coupled together to form a shielded housing having electrical continuity with the rear connection housing, the rear connection housing being overmolded with an insulative material jacket. Both the first metal half-shell and the second metal half-shell are twinned and include a female member and a male snap-fastener member for coupling the first metal half-shell and the second metal half-shell together in pairs.

Abstract: Disclosed is an interconnection scheme which provides alignment when inserting or removing a circuit pack in a shelf. The circuit pack includes a pair of tabs which engage the connector housing on the backplane to prevent any significant rotation of the pack when inserting or removing the pack.

Abstract: A summing transformer having a core structure, first primary and secondary windings wound on the core structure for establishing a rotating electromagnetic field when the first primary winding is energized, and second primary and secondary windings wound on the core structure for establishing a rotating electromagnetic field when the second primary winding is energized, and wherein the second first and second secondary windings are connected together so that voltages induced therein are added.

Abstract: A connector cover for a wire harness includes a main cover composed of a hinged pair of half case bodies and a secondary cover composed of a hinged pair of semicylindrical bodies. The main cover is formed with an opening for affixing to the back of the connector and a circular opening with a circular ridge elongating inside surface for passing the wire extending from the connector when the half case bodies are closed. The secondary cover has both ends opened for receiving the wire harness and is formed with a cylindrical opening with a channel grove extending therearound for passing the wire when the semicylindrical bodies are closed, and is connected to the main cover such that the circular ridge of the main cover fits in the channel groove around the cylindrical opening. Accordingly, the secondary cover can rotate with respect to the main cover.

Abstract: A device for associative coding of printed circuit boards comprises a coding member comprising a central longitudinal member, attachment arms and a series of appendages the spacing between which is equal to the spacing between two board guide slideways. The front panel of each board incorporates a coding slot enabling an appendage to pass through it when the latter is aligned with the slot. The position of the coding slot is a characteristic common to all boards of a given family. After a first board is fitted into the subrack only other boards of the same family can be connected into the part of the subrack fitted with the coding member. This prevents the insertion into the same subrack or subrack compartment of boards from different and incompatible families although for a same product type and having the same functionality.

Abstract: An encapsulated electronic package (10) is made by bonding one or more semiconductor devices or integrated circuits (16) to a printed circuit board with an adhesive (14), and covering with a glob top encapsulant (15). The printed circuit board has a metal circuit pattern (12) on one side, and, optionally, solder pads (27) on the second side. The glob top encapsulant covers the integrated circuit, portions of the metal circuit pattern, and portions of the printed circuit board surface. The printed circuit board, the adhesive, and the encapsulant are all made from the same type of resin. In the preferred embodiment of the invention, the resin used to make the printed circuit board, the adhesive, and the encapsulant is an organosilicon polymer comprised substantially of alternating polycyclic hydrocarbon residues and cyclic polysiloxane or siloxysilane residues linked through carbon-silicon bonds.

Abstract: The disclosure relates to a forearm support strap for supporting various types of portable electronic equipment or instruments. The forearm support strap includes three exposed pile areas which will receive various types of equipment that has been provided with a mating Velcro loop strip on its base. A plurality of quick-release buckles are included to provide secure attachment to the user's forearm. A battery compartment is also included to provide electrical current to the attached instrument. Significant advantages of the forearm support strap include its ease of attachment, comfortable anti-rotation features and its availability to right-handed as well as left-handed users. Through the use of the forearm strap the user has both hands free to perform other tasks.

Abstract: After a semiconductor die is placed onto a leadframe and electrically connected to the die, the die and the ends of the leads adjacent to the die are encased in a packaged body. The exposed ends of the leads are trimmed so that the leads are of desired lengths for leadforming, or for connection to substrates or sockets. The ends of the leads are enclosed in a protective body, so that when the package is tested and handled, the protective body reduces undesirable bending of the leads. By trimming the leads before forming the protective body, the leadframe used need not be larger than those normally used.

Abstract: A method and apparatus for enclosing an optically active integrated circuit die mounted on a region of a printed circuit substrate within either a unitary optical plastic lens element and enclosure or a discrete lens element and enclosure formed with mechanical standoff tabs and positioning pins for attaching and securing the unitary or discrete enclosure to the circuit substrate. The mechanical tabs of the enclosure have catches that snap in place into receiving apertures in the substrate so as to position the molded plastic lens over the optically active integrated circuit device at a predetermined distance providing the desired focal length. The molded plastic lens of the optical plastic enclosure protects the optically active integrated circuit from damage and images light thereon or therefrom. In a preferred embodiment, the side walls of the plastic enclosure contact the surface of the substrate and enclose the die and the region that the die is mounted on.

Abstract: A plastic sealed type semiconductor apparatus includes at least two semiconductor devices which are disposed with a space therebetween in such a manner that circuit forming surfaces oppose each other, and an electric signal lead which is adhered to each of the circuit forming surfaces with an insulating member provided therebetween for electric insulation and which is electrically connected to the semiconductor device by a thin metal wire. The semiconductor devices and the electric signal leads are sealed with a resin in a state where the electric signal leads are laid on top of one another to form a plastic package. The overlaid portion of the electric signal leads has a surface contact portion of the leads and a resin providing portion. The resin providing portion is a recessed portion which is formed when the resin is molded in such a manner that it passes through the surface contact portion of the leads in the lateral direction thereof.

Abstract: In an equipment cabinet equipped with a rack for electronic and electrical insertable units, all casing components, including side walls, a rear wall, a door, a top and a bottom, are provided with mating contact faces along the component edges so as to provide a shield against electromagnetic radiation. Contact strips made of an electrically well conducting material are arranged between these contact faces.

Abstract: A terminal block arrangement for a timer device or system; which enables suitable heat dissipation wherein the terminal block is handling currents of the order of at least 30 amps, such that heat dissipation is a problem because the dissipation is limited either by the PC board track or, if wire is used, by the heat conduction of the wire. The terminal design of the present invention is unique because the terminal block provides the combined advantages of access to the end user, is a source of heat sinking required by the relay, is a reliable integral connection between relay and output, and by changing the size of the terminal, can provided an almost unlimited use for AC and DC applications requiring high voltages and currents. The relay connections can be welded or soldered.

Abstract: The present invention discloses a package for electronic components which reduces the unwanted electronic noise generated by the package and which can be fabricated by conventional manufacturing techniques. Accordingly, a lid for a package housing is fabricated from beryllium oxide and contains a small hole. During assembly, a wire attached to one of the electronic components is inserted through the hole of this lid, and the lid is attached by conventional methods. Finally, the wire protruding through the hole is soldered to the lid, which completes the sealing of the housing and which provides for a hermetic environment for the enclosed electronic components.

Abstract: A containment system for significantly reducing the emission of high frequency electromagnetic waves from a computer system into the external environment. The containment system includes the combination of two enclosures and a shielding assembly. One of the enclosures is associated with the high frequency components and the other with the low frequency components of the computer system. The shielding assembly is positioned between the two enclosures to prevent high frequency electromagnetic waves from passing from one chamber to the other over the connection between the two chambers.

Abstract: In a control device (11), the strip conductors (29) are applied to the interior wall (28) of the housing (15), consisting of plastic, with integrated plugs (16) with the aid of novel deposition processes. In this case the laser-assisted deposition process or the Ivonding.RTM. process can be used in a particularly advantageous manner. It is possible by means of these types of manufacture to dispose the plug connectors (24) in a simple manner in a through-bore (23) in the housing (15) and to connect them directly with the strip conductors (29) on the interior wall (28). Bonded connections (31) for connecting hybrid circuits (13), for example, can be attached in a simple manner at the other end of the strip conductors (29). Because of this, it is possible to automate the manufacturing process to a large degree and to make it inexpensive.

Abstract: A solar panel assembly (10) includes a power generating sheet (22) having two output terminals (30,32), and an electric cable (20) soldered at one end to terminals (30) and (32). A frame member is anchored to the solar panel in overlying relation to the terminals and an epoxy material (62) fills a cavity (58) defined by the frame member (40). A case (42) covers the frame member (40). The case includes an upper member (44) and a lower member (46) which are snap fitted together through apertures in the solar panel. The case (42) includes a tension relieving device which prevents tension on the cable (20) from being transferred to the cable end connected to the terminals (30) and (32). The epoxy provides a water resistant seal which allows the solar panel to be used in hostile environments.

Abstract: A personal computer cabinet with a cabinet base, an integral rear panel, a front panel, and two upwardly extending lips from the base. A cabinet cover engages with the front panel, the rear panel and includes two clips which engage with the lips of the base to negate or minimize any electromagnetic interference radiations from the electrical components inside a computer housing. These electrical components include the crystal oscillator, the microprocessor, and any other switching components.

Abstract: A superconducting conductor, having an excellent repeated temperature property with no reduction of critical current density against a temperature cycle, comprises an oxide superconductor and an fiber reinforced plastic ("FRP"), serving as a support member, which is composed with the oxide superconductor for integrally moving with the oxide superconductor in thermal expansion and thermal shrinkage. The oxide superconductor is bonded to the FRP with an adhesive agent, or wound on and fixed to the same with a Teflon tape or the like.