Abstract: The current and voltage transformer (10, 11) is intended for a metal-encapsulated, gas-insulated high-voltage installation. It has an annular supporting body (13) which can be fixed inside the metal encapsulation (7) and is used for holding a current sensor and a voltage sensor. The current sensor, held on the supporting body (13), is constructed as a toroidally wound coil (14) and the voltage sensor, held on the supporting body (13), is constructed as a hollow-cylindrical measurement electrode (15). After fitment in the installation, the coil (14) and measurement electrode (15) concentrically surround a current conductor (5) of the installation. This current and voltage transformer is intended to have small dimensions and is intended to be capable of fitment without problems at any point in the installation.

Abstract: A shield construction for electrical devices which comprises a conductive thin film mounted at least one of the surface of electrical devices. The shield construction is connected with ground leads of a electrical devices or the ground plane of the circuit board. The shield construction prevents the radiation of undesired waves from the electrical devices. As a result, the deterioration of the receiving sensitivity and noise generation becomes negligibly small even in the weak electric field area.

Abstract: A small bore or a cut portion is formed in a leading end portion of a lead terminal extended from a package main body. A gas produced when the leading end portion is contacted with and soldered to a land provided on a printed wiring board is allowed to escape through the small bore or the cut portion and, therefore, solder is easy to enter between the lead terminal and the land, which improves the soldering performance of the lead terminal. Also, the provision of the small bore or cut portion increases the area of a peripheral portion of the lead terminal to be in contact with the solder to thereby increasing the strength of the soldering.

Abstract: A hermetically sealed package for a microelectronic device, such as a solid-state image sensor, includes a ceramic housing defining a cavity in a major surface thereof and metal terminals extending through side edges thereof to the cavity. A microelectronic device is in the cavity and electrically connected to the terminals. A cover plate extends over the cavity and over a portion of the major surface around the cavity. An amalgam of a mixture of a liquid metal and a powdered metal is between the cover plate and the housing surface. The amalgam bonds the cover plate to the housing and forms a hermetical seal therebetween.

Abstract: A semiconductor device including a lead frame provided with a die pad and a plurality of leads arranged around the die pad, a semiconductor element mounted on the die pad, and a molding resin for sealing the semiconductor element. A spacing defined between the die pad and the leads is sized, i.e. made very small, that a flow velocity of a first portion of the molding resin flowing in a peripheral region of the semiconductor element becomes substantially equal to a flow velocity of a second portion of the molding resin flowing on at least an upper surface of the semiconductor element. That is, the first portion of the molding resin flowing in the peripheral region of the semiconductor element receives resistance due to the very small spacing between the die pad and the leads. Accordingly, the flow of the molding resin as a whole can be made uniform to thereby reduce or eliminate the generation of voids in the molding resin. As a result, reliability and productivity of the semiconductor device can be improved.

Abstract: A lid (2) for an electronic circuit housing (4) has inner (24) and outer (22) laminated layers that are formed from two different materials, joined to each other and bowed outward from the housing (4) so that the inner layer (24) is under tensile bending stress at the interface between the layers, and the outer layer (22) is under compressive bending stress at the interface. This forms a pre-stress on the lid that resists external loads, and causes the lid to deflect under loading in a linear, predictable and recoverable fashion. The lid is preferably formed by thermal bonding of two materials having different coefficients of thermal expansion, with the bow forming as the materials cool. In one example two different metals are used, and in another a metal is bonded to a glass-ceramic tape.

Abstract: A mother board assembly includes a mother board which has a top face and a first connector mounted on the top face. A first mounting seat is mounted on the top face on one side of the first connector and includes at least one resilient first positioning member which is substantially C-shaped. The first positioning member defines a first groove and has two spaced free ends. A second mounting seat is mounted on the top face on the other side of the first connector and includes at least one second positioning member which has a substantially U-shaped retaining portion that defines a second groove. A curved plate portion extends from the retaining portion in a direction away from the first mounting seat. An interface card has a front end, a rear end, a bottom face and a second connector mounted on the bottom face between the front and rear ends.

Abstract: A flexible grounding element comprises a rectangular base portion, and a pair of side portions extending obliquely and upward from the edges of the base portion. Each of the side portions includes a pair of slots at the intermediate portion of its edges. One of the side portions bends toward the other one of the side portions at the location adjacent to the slot to form a bend portion. The front end of the bend portion bends upward to form an end portion which contactably touches the inner side of the other side portion. As the side portions are being pressed, a portion of each side portion will pass through the hole of a mother board, and as the side portions are released, the slots thereof will urge against the inner rim of the hole to effect positioning. Furthermore, each corner of the base portion has a flexible plate which includes a protrusion at the bottom thereof.

Abstract: A chip electronic device wherein an electronic element such as an inductor and capacitor, and terminals are covered with a resin housing. Plated lower surfaces and edges of the terminals show on a bottom and sides of a housing respectively. The lower surfaces of the terminals are soldered onto conductive patterns of a printed wiring board, and fillets of solder are formed at the edges of the terminals.

Abstract: A hermetically sealed automotive module is disclosed wherein a cover of the module is sealed to a housing of the module by vibration welding. A weld contact surface is defined between the cover and housing of the module when the cover and housing undergo relative reciprocating motion under the application of a force. A method for hermetically sealing a module is also disclosed.

Abstract: The winding support comprises a first cylindrical portion (1) which comprises a winding space for a coil winding which is situated between a first wire fastener unit (7) and a wire guide (5), and a second portion (3) which is situated in the prolongation thereof and which is shaped as a semi-cylinder with a flat supporting face (17) for mounting an electronic component (23) which comprises contact pads (25, 27). The component (23) is mounted in a recess (19) at the area of the lacking cylinder half, which recess is axially bounded by the wire guide (5) on the one side and by a second wire fastener unit (21) on the other side. Lead-out wires (31, 41) of the coil winding are guided by way of the wire guide (5), across the contact pads (25, 27) to the second wire fastener unit (21) whereto they are fastened. Subsequently, soldered or welded joints (43, 45) are formed between the lead-out wires (31, 41) and the contact pads (25, 27) by way of a thermal treatment.

Abstract: A silicone based wedged surface radar absorbing structure operating at terahertz frequencies. The radar absorbing structure includes a silicone based elastomer loaded with iron oxide and formed with a wedged type surface geometry consisting of a plurality of grooves having small groove angles in the range of about 22.5.degree..

Abstract: A fully-populated Pin Grid Array (PGA) is vacuum-chucked to a pedestal, without mechanical clamping. The pedestal includes a cylindrical shaft having a vacuum passageway extending its length, and a vacuum reservoir block mounted atop the shaft, and an alignment/fixture plate mounted atop the vacuum reservoir block. The alignment/fixture plate is provided with holes extending partially through the plate, at least about its periphery, for receiving the outermost rows/columns of pins of the PGA, while maintaining a vacuum seal. In one embodiment, a central portion of the alignment/fixture plate is provided with a large through-opening for receiving the remaining pins of the PGA. In another embodiment, the central portion of the alignment/fixture plate is provided with a plurality of individual through holes corresponding to the remaining pins of the PGA. In this manner, the PGA is held securely and well aligned within a wire bonder, while avoiding damaging the pins.

Abstract: A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "opening" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.

Abstract: A large-area superconductor magnetic shield comprising a plurality of small superconductor unit layers stuck onto the surface of a large-area substrate, wherein the external peripheral sections of the adjacent unit layers are overlapped mutually or the end sections of the adjacent unit layers are abutted mutually such that the adjacent unit layers do not make contact with one another. Compared with conventional magnetic shields, the magnetic shielding amount at the overlapping sections of the magnetic shield of the present invention is substantially greater.

Abstract: A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to serve as a ground plane, and a second layer of conductive material adjacent the ceramic base to serve as a power plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground and power planes but physically separated therefrom. In one embodiment, integral decoupling capacitors are further included on the base substrate. Incorporation of ground and power planes and decoupling capacitors into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.

Abstract: A metal housing for electronic devices configured for electromagnetic compatibility includes a housing body whose opening can be closed by a closing element. Metal contact faces are provided around the opening at the housing body and correspondingly at the closing element. Thin contact strips of electrically conductive and corrosion resistant metal are applied to the contact faces. These contact strips may be subsequently melted or welded on by means of a laser beam as a weld trace or as a thin metal foil. To seal the groove between the housing body and the closing element against interfering electromagnetic radiation, the contact faces are brought into a good electrically conductive connection with one another by way of the bare metal surfaces of the contact strips applied thereonto, for example by means of an intermediately disposed elastic and electrically conductive seal.

Abstract: A semiconductor package is provided having a die attach flag (12) with integral flanges (13) which prevent high pressure plastic encapsulant (18) from escaping or entering between the die attach flag (12) and a mold cavity plate (15) during encapsulation. The die attach flag (12) is held flush against the cavity plate (15) by the packing pressure of the encapsulant (18) during low pressure stages of the encapsulation process. Plastic flowing along the flange (13) solidifies more rapidly than plastic in the body of the semiconductor package, thereby damming plastic flow at the edges of the die attach flag (12) during high pressure stages of the encapsulation process.

Abstract: A sensitive circuit area on a circuit board is isolated from an adjacent located non-sensitive circuit area by surrounding the sensitive circuit area with electrically interconnected ground planes positioned on the opposite sides of the circuit board. The isolation system further includes a "clam shell" RF/IF tight shield attached to each side of the circuit board enclosing the sensitive circuit area. A partially conductive gasket is placed between the clam shell and the top and bottom circuit board surfaces to enhance isolation performance.

Abstract: An electromagnetic shielding gasket attached to an end portion of a board member for contacting a desired contact portion and providing an electromagnetic shielding effect. The electromagnetic shielding gasket comprises a flat base portion linearly extending and having a width substantially equal to the thickness of the end portion of the board member. The gasket also comprises a plurality of pairs of resilient fingers arranged in an extending direction from the flat base portion. Each resilient finger transversely extends out from each side edge portion of the flat base portion. Some of the resilient fingers are bent downwardly toward one another, forming carrier strips for holding side walls of the board member therebetween. The other resilient fingers are bent downwardly or upwardly according to the position of the desired contact portion, forming resilient tabs for contacting the desired portion.