Abstract: The layout of latches in a common clock domain is efficiently optimized to shrink the physical size of the domain while maintaining timing requirements. The latches are placed in a first layout preferably using quadratic placement, and a star object is built representing an interim clock structure. The latches are weighted based on wire distance from a source of the star object, and then re-placed using the weighting. The weighted placement and repartitioning may be iteratively repeated until a target number of bins is reached. The boundary of the latches in the final global placement is used to define a movebound for further detailed placement.

Abstract: A method of designing an integrated circuit is provided in which the design layout is optimized using a process model until the design constraints are satisfied by the image contours simulated by the process model. The process model used in the design phase need not be as accurate as the lithographic model used in preparing the lithographic mask layout during data prep. The resulting image contours are then included with the modified, optimized design layout to the data prep process, in which the mask layout is optimized using the lithographic process model, for example, including RET and OPC. The mask layout optimization matches the images simulated by the lithographic process model with the image contours generated during the design phase, which ensures that the design and manufacturability constraints specified by the designer are satisfied by the optimized mask layout.

Abstract: A method for generating a simulated aerial image of a mask projected by an optical system includes determining a coherence characteristic of the optical system. A coherent decomposition of the optical system is computed based on the coherence characteristic. The decomposition includes a series of expansion functions having angular and radial components that are expressed as explicit functions. The expansion functions are convolved with a transmission function of the mask in order to generate the simulated aerial image.

Abstract: A method of manufacturing a photomask is described. The graphic data of the photomask are provided, and than an optical proximity correction is performed to the graphic data. A process rule check is then performed to the graphic data with the optical proximity correction. When at least one failed pattern not passing the process rule check is found in the graphic data, a repair procedure is performed only to the failed pattern so that the failed pattern can pass the process rule check. The patterns of the photomask are then formed according to the corrected and repaired graphic data.

Abstract: The invention is a method of placement of components and networks (nets), utilized for interconnecting the components, of a circuit layout. The method includes forming for electrical devices, pads (or lands) and networks (nets) of a circuit layout a listing of the positions thereof with respect to one another, connections therebetween and the orientation of each net or subnet thereof in the circuit layout. The thus formed list is processed subject to at least one objective regarding the size of the circuit layout, whereupon a placement of the electrical devices and the pads is determined simultaneously with the placement of the networks.

Abstract: Methods of detecting unwanted logic in an integrated circuit (IC) design. Any unwanted logic added to a design (e.g., to monitor or interfere with operation of the design) will draw power from one or more power supplies on the IC. Hence, by monitoring power drawn from various portions of a circuit design implemented in an IC, the unwanted logic can be detected and reported to the user. One way of monitoring power draw is by the use of oscillator circuits. If power goes down locally (e.g., due to the operation of unwanted logic), the frequency of an oscillator circuit in that vicinity will be reduced relative to the frequencies of other oscillator circuits in the design, and/or relative to an expected value. When a variation in the relative power consumption is detected, unwanted logic can be inferred and an error signal is output.

Abstract: A test solution for one or more circuits implementing a communication standard is based on a design specification received from a development organization and a communication standard. The test solution is evaluated with one or more prototype circuits and is selectively modified based on the evaluation with the prototype circuits. The test solution is then evaluated with one or more manufactured circuits and is selectively modified based on the evaluation with the manufactured circuits.

Abstract: A single channel or multi-channel system that requires the execution time of a pipeline stage to be extended to a time longer than the time interval between two consecutive input data. Each processor in the system has an input and output port connected to a “bypass switch” (or multiplexer). Input date is sent either to a processor, for processing, or to a processor output port, in which case no processing is performed, through a register using at least one clock cycle to move date from register input to register output. For a single channel requiring an execution time twice the time interval between two consecutive input data, two processors are interconnected by the bypass switch. Data flows from the first processor at the input of the system, through the bypass switches of the interconnected processors, to the output. The bypass switches are configures with respect to the processors such that the system data rate is independent of processor number.

Abstract: In a System-in-Package (SiP) module, a method and a system for optimizing the timing margin of source-synchronous interface clocks is provided. Clock signals generated by first device are transmitted to serpentine traces located on a Printed Circuit Board (PCB) which adjusts the active edge of one signal relative to another signal. The serpentine trace introduces a delay in the clock signal thereby optimizing timing margins. By providing access to signals otherwise internal the SiP, testing and signal verification is also simplified.

Abstract: Validation of at least some of a proposed semiconductor design layout is disclosed. According to one or more aspects of the present invention, a first voltage dependent design rule is applied to an edge of an area of the layout if the edge is not covered by a pseudo layer. A second voltage dependent design rule is, on the other hand, applied to the edge of the area if the edge is covered by the pseudo layer.

Abstract: Computer aided design tools are provided that assist circuit designers in optimizing circuit performance. A circuit designer who is designing an integrated circuit may supply circuit design data and constraint data. Computer aided design tools may process the data to produce output data. The output data may include information on an implementation of the circuit design in a given type of integrated circuit device and may include report data on how the implementation of the circuit design is expected to perform. An optimization assistance tool analyzes the design and constraint data and the report data to identify potential problem areas. Recommendations may be provided to the circuit designer on how to address potential problems. Selectable options are displayed for the circuit designer. By selecting an appropriate option, the circuit designer can automatically launch a tool to make recommended settings adjustments.

Abstract: Disclosed is an improved approach for performing crosstalk and signal integrity analysis in which multiple variables are taken into account when analyzing the effects of on-chip crosstalk, such as for example coupled wire length, ratio of coupling capacitance, and aggressor and victim driver types. Rather than performing a full-chip simulation, the potential crosstalk effects can be pre-characterized by performing simulation/modeling over specific net portions by systematically changing the values of these multiple variables. A set of patterns characterized from the variables are formed from the modeling. During the analysis process, the IC design is checked of the presence of the patterns, from which is produced the expected delay impact for crosstalk in the design.

Abstract: Roughly described, high-stress volumetric regions of an integrated circuit structure are predicted by first scanning one or more layout layers to identify planar regions of high 2-dimensional stress, and then performing the much more expensive 3-dimensional stress analysis only on volumetric regions corresponding to those planar regions that were found to have high 2-dimensional stress. A windowing method can be used for the 2-dimensional scan, optionally with an overlap region extending slightly into adjacent windows. Very narrow features arising at the edges of an analysis window can be relocated to the edge of the analysis window in order to avoid numerical artifacts.

Abstract: According to the present invention a method for the placement of electronic circuit components is provided that supports design modifications by realizing and maintaining relations between the layouts of the components (i1 to i6). These relations are based on relations between the geometrical shapes represented by the layouts for the components. The invention can be implemented by an interactive layout editor. When a layout or the placement of a layout is changed manually, then the placement of the components that are placed already is changed automatically such that the all the relations between the components are realized or maintained. A parent-child relationship can be defined between components such that when the parent component is changed or moved then only the placement of its children is updated automatically. The prioritisation of relations allows resolving conflicts between conflicting relations.

Abstract: Secondary electrons and back scattered electrons generated by irradiating a wafer to be inspected such as a semiconductor wafer with a charged particle beam are detected by a detector. A signal proportional to the number of detected electrons is generated, and an inspection image is formed on the basis of the signal. On the other hand, in consideration of a current value and irradiation energy of a charged particle beam, an electric field on the surface of the inspection wafer, emission efficiency of the secondary electrons and back scattered electrons, and the like, an electric resistance and an electric capacitance are determined so as to coincide with those in the inspection image. In a state where a difference between a resistance value in a normal portion and a resistance value in a defective portion is sufficiently increased by using the charging generated by the irradiation of electron beams, an inspection is conducted to thereby detect a defect.

Abstract: A system and method for integrated circuit design are disclosed to enhance manufacturability of circuit layouts through generation of hierarchical design rules which capture localized layout requirements. In contrast to conventional techniques which apply global design rules, the disclosed IC design system and method partition the original design layout into a desired level of granularity based on specified layout and integrated circuit properties. At that localized level, the design rules are adjusted appropriately to capture the critical aspects from a manufacturability standpoint. These adjusted design rules are then used to perform localized layout manipulation and mask data conversion.

Abstract: In some embodiments, a method is provided for determining a localized region of overlap of first and second features from respective first and second conductive layers, and determining which enclosure rules to apply to vias formed between the first and second features. In a further aspect of the invention, a method may be provided to determine whether to apply symmetric or asymmetric via metal enclosure rules to a feature as a function of the local environment of the feature. In another aspect of the invention, a computer program product is provided to encode instructions for performing such a process.

Abstract: Circuit models for the simulation of charge pumps facilitate design of integrated circuits containing charge pumps. Such models facilitate accurate simulation of actual charge pump behavior without the need to rigorously simulate the multiple capacitive stages of an actual charge pump and the dedicated oscillator clocking the charge pump. The various embodiments utilize a charge pump model having multiple pull-up stages. At lower output voltages, the pull-up stages each provide an output current. These output currents are added together as the output current of the charge pump. Each pull-up stage automatically shuts off when the output voltage approaches a dedicated voltage source for that pull-up stage. As the output voltage increases, less current is output due to the deactivation of pull-up stages.

Abstract: A method of improving the electronic component testability rate is provided. The method includes the steps of: designing a circuit, providing electronic component data of the circuit, extracting the test data of electronic components, providing a circuit board and making a test position table, providing an electronic component test fixture and a test program, determining whether the test program is appropriate, debugging the test program, and obtaining a test report. This increases the electronic component testability rate. At the same time, it improves the conventional test method that only provides information of where test points are still needed but no further detail.

Abstract: A method for designing a system on a field programmable gate array (FPGA) includes using binary decision diagrams (BDDs) to perform functional decomposition on a design for the system after placement.