Abstract: A substrate connecting structure includes a substrate that includes a flat base material having a first surface and a second surface at a side opposite to the first surface, a first wiring layer arranged on the first surface, and a second wiring layer arranged on the second surface, a through hole extending through the base material, a connection metal body that includes a connecting portion connected to the second wiring layer and a projection inserted into the through hole, and a mounted component mounted on the substrate. The connection metal body is connected to the mounted component only at a distal end surface of the projection.

Abstract: The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.

Abstract: A cable connector system for connecting electrical cables includes a connector and a plug. The connector includes a connector body and a shear bolt. The connector body includes a connector outer surface and a bolt bore intersecting the connector outer surface at a bore opening. The connector outer surface is curved. The shear bolt is configured to be mounted in the bolt bore to secure an electrical cable in the connector body. The plug includes a head and is configured to be mounted in the bolt bore at the bore opening. The head has a head outer surface and the head outer surface is curved.

Abstract: Terminal crimping device and terminal crimping method is provided that collectively crimp-connects a terminal to an electric wire while suppressing displacement of the terminal at a crimp position. A terminal crimping device includes a cutting part configured to cut from the carrier each of the two or more terminals belonging to one terminal set at one end side in the terminal coupled body; a terminal conveyance part configured to convey the two or more terminals cut at the cutting part to a crimp position corresponding to the predetermined interval while adjusting a terminal interval of the two or more terminals to an arrangement interval of the covered electric wire at the crimp position in a conveyance direction (longitudinal direction) of the terminal coupled body; and a crimping part configured to collectively crimp-connect to the electric wire each of the two or more terminals conveyed to the crimp position.

Abstract: A component mounting device for mounting a component on a substrate includes a head unit, a driver to move the head unit on a stage, and a controller. The head unit includes a mounting head to hold the component and a stereo camera to capture a three-dimensional image of an object. The controller performs image capturing, calculating and mounting processes. The image capturing captures an image of a relevant area including a mounting point on the substrate by the stereo cameras before the component reaches the mounting point. The calculating calculates a correction amount with respect to X, Y and Z axes directions based on three-dimensional information on the relevant area with respect to the directions obtained in the image capturing process to mount the component on lands corresponding to the mounting point. The mounting includes correcting the mounting point based on the correction amount and mounting the component.

Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.

Abstract: A method of manufacturing a winding-type coil component, wherein at the time of manufacturing the winding-type coil component, the method can efficiently form an inclined external electrode, can change inclination of an external electrode, and can satisfy a demand for the manufacture of plural kinds of winding-type coil components provided with external electrodes having different inclination angles respectively.

Abstract: A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, a component feeder configured to feed the component to the mounting head, and an imager provided on the head unit and configured to be able to image a component feeding location of the component feeder from a plurality of directions. The component mounting device further includes a controller configured to acquire a horizontal position and a vertical height position of the component at the component feeding location based on images of the component feeding location captured from the plurality of directions by the imager.

Abstract: The production management device is applied to a production line for producing a board product. The production line includes a component mounter configured to mount a component on a circuit board under predetermined mounting conditions and an inspection device configured to inspect the mounting state of the component mounted on the circuit board, downstream from the component mounter. The production management device includes an information management section configured to store statistical information in which a mounting condition when a component, that is an inspection target, is mounted on a circuit board is linked to the results of multiple inspections by the inspection device.

Abstract: There is described a method of establishing an electrical connection through a flexible planar material. The method involves attaching an intermediate coupling element to the flexible planar material so as to align an aperture defined by the intermediate coupling element with a hole through the flexible planar material, and coupling an electrical connector to the intermediate coupling element so as to permit electrical connection through the flexible planar material. In this way, the intermediate coupling element can be attached to the garment during the garment manufacture process, and subsequently the electrical connector can be coupled to the intermediate coupling element separately from the main garment manufacture.

Abstract: A guide member includes a first diametrically directed side guide section and a second diametrically directed side guide section formed by bending a single member at a bent portion. The first diametrically directed side guide section guides predetermined portions of electric conductors on a diametrically directed side of a slot. Further, the second diametrically directed side guide section guides predetermined portions of the electric conductors on a diametrically directed side of another slot adjacent to the slot. The bent portion is supported by a supporting body.

Abstract: A manufacturing method of multilayer printed circuit boards has steps as follows: aligning circuit layers with a stacking location to form a substrate having multiple positioning portions; pre joining the substrate at the positioning portions; forming an alignment hole in each positioning portion; and placing the pre joined substrate over alignment pins of a press device for lamination. After the circuit layers are aligned, the substrate is pre joined at the positioning portions, and then the alignment holes are formed in the positioning portions for pins alignment at the press device. The alignment accuracy is enhanced. Dusts will not deposit onto surfaces of the circuit layers to damage circuits thereof.

Abstract: A method for manufacturing a printed wiring board includes forming a conductor layer including first and second pads on an insulating layer, forming a dry film resist layer on the insulating and conductor layers, forming first and second openings exposing the first and second pads, applying first metal plating to form first and second base plating layers on the first and second pads, applying second metal plating to form a first top plating layer of a first post and portion of a second top plating layer of a second bump post, applying the second metal plating further to form second portion of the second top layer of the second post, removing the dry film resist layer, forming a solder resist layer to cover the first and second posts, and thinning the solder resist layer over entire surface to position the first and second top layers outside the solder resist layer.

Abstract: The image including both of the component and the nozzle that is being lowered toward the component is captured. The target height at which the nozzle is stopped in the mounting process is controlled based on this image. This enables the target height at the time of lowering the nozzle toward the component to be controlled regardless of a flow rate of air sucked from the nozzle.

Abstract: A method of manufacturing a reactor is provided. The reactor include: a coil including a wound flat wire, the flat wire being covered with an insulating film, and the coil having a flat surface; and a cooler facing the flat surface, in which the flat wire on an outer periphery side of the coil may be not covered with the insulating film at the flat surface, and the flat wire at the flat surface may include a plurality of wire segments lying in a pitch direction. The method may include pressing a rod against a short side of the plurality of wire segments to form at least one thickened portion in each of the plurality of wire segments, the thickened portion being a portion of the flat wire thickened in the pitch direction.

Abstract: A wire connecting device for connecting and electrically communicating a first electrical wire and a second electrical wire can include: an electrical connector having a first end, a second end, and a concave portion between the first end and the second end, wherein the concave portion is configured for accommodating a second core wire of the second electrical wire; and a connecting member cooperating with the electrical connector and configured for guiding the first end and the second end of the electrical connector connected with the first electrical wire. A wire connection method using the wire connecting device can be further provided.

Abstract: Component mounting line includes multiple component mounting machines arranged along a conveyance direction of a board, feeder storage container that stores multiple feeders that are attachable and detachable to component mounting machine, and exchanging robot capable of exchanging feeder between feeder storage container and each of the component mounting machines, in which feeder storage container is installed in the same arrangement as the multiple component mounting machines, and exchanging robot moves along the conveyance direction of the board and exchanges feeder. Accordingly, regardless of which of the component mounting machines feeder is used in, replenishment and collection may be performed in feeder storage container, so that an operator can easily replenish and collect feeder.

Abstract: Systems and methods for releasing semiconductor devices during pick and place operations are disclosed. A representative system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a release station having a fluid delivery device coupleable to a source of release fluid, the fluid delivery device having an exit positioned to direct release fluid toward a semiconductor die carried by the support member at the release station.

Abstract: A component mounting machine including a head unit that has a head main body configured to hold multiple pickup members each capable of picking up a component at a predetermined interval along a predetermined circumference and to be capable of rotating forward and reverse directions; a moving device configured to move the head unit; a lifting and lowering device configured to lift and lower a pickup member; a component supply device configured to be capable of supplying the component to the pickup member; and a control device configured to control those described above. The control device performs a control such that the pickup members pick up the components supplied by the component supply device, and each component is mounted on a board after a completion of the pickup, while performing an operation of rotating the head main body and an operation of moving the head unit together.

Abstract: An method for operating an object printing system printer prints electrical circuits on non-planar areas of objects and accurately places electronic components within the printed circuits. The method includes operation of a direct-to-object printer to form an electrical circuit on an object secured within the direct-to-object printer and operation of an electronic component placement system to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to a generation of a signal by the direct-to-object printer for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.