Abstract: A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 ?m on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) comprises a resin containing a structural unit (b1) with a specific structure, and another resin containing a structural unit (b2) with a specific structure.

Abstract: A base material for a pattern-forming material, a positive resist composition, and a method of resist pattern formation that are capable of forming a high resolution pattern with reduced levels of LER. The base material includes a low molecular weight compound (X1), which is formed from a polyhydric phenol compound (x) that contains two or more phenolic hydroxyl groups and satisfies the conditions (1), (2), and (3) described below, wherein either a portion of, or all of, the phenolic hydroxyl groups are protected with acid dissociable, dissolution inhibiting groups: (1) a molecular weight within a range from 300 to 2,500, (2) a molecular weight dispersity of no more than 1.5, and (3) an ability to form an amorphous film using a spin coating method.

Abstract: Radiation-sensitive negative working element comprising (a) a substrate with a hydrophilic surface and (b) a layer on the hydrophilic surface of the substrate, wherein said layer comprises a modified polymer obtainable by reacting (i) a polymer with —COOH, —SO3H, —P03H2 and/or —PO4H2 in the side chains, wherein the polymer is soluble in aqueous alkaline solutions and the solubility is not changed by IR radiation, and (ii) a salt with an inorganic or organic cation, wherein the modified polymer is soluble in aqueous alkaline solutions and the solubility is not changed by IR radiation, said layer being soluble in aqueous alkaline developer, but is rendered insoluble in aqueous alkaline developer by IR radiation.

Abstract: A radiation-sensitive composition (and method of fabricating a device using the composition) includes a nonpolymeric silsesquioxane including at least one acid labile moiety, a polymer including at least one member selected from the group consisting of an aqueous base soluble moiety and an acid labile moiety, and a radiation-sensitive acid generator. Another radiation-senstive composition (and method of fabricating a device using the composition) includes a nonpolymerc silsesquioxane including at least one aqueous base soluble moiety, a polymer including an aqueous base soluble moiety, a crosslinker, and a radiation-sensitive acid generator.

Abstract: A positive resist composition including a base material for a pattern-forming material (A), which contains a protector (X1) of a polyhydric phenol compound (x) having two or more phenolic hydroxyl groups and a molecular weight of 300 to 2,500, in which a portion of the phenolic hydroxyl groups are protected with an acid-dissociable, dissolution-inhibiting group, and an acid generator component (B) that generates an acid upon exposure, wherein the component (B) contains an onium salt-based acid generator (B1) with an alkylsulfonate ion as an anion.

Abstract: A radiation-sensitive composition and negative-working imagable element includes a polymeric binder that has a hydrophobic backbone and pendant salt groups that comprise a cation covalently attached to the hydrophobic backbone and a boron-containing anion forming a salt with the cation. The use of these particular polymers provides fast digital speed (high imaging sensitivity) and good printability (good shelf-life) even when the preheat step normally used between exposure and development, is omitted.

Abstract: A helical pixilated photoresist includes a photoacid generator, a photoimageable polymer comprising a self-assembly moiety and a solubility switch, the photoimageable polymer having a helical structure. In one embodiment the helical pixilated photoresist is formed of a photoimageable polymer comprising a pyridine-based quencher copolymer and a solubility switch copolymer, wherein the photoimageable polymer has a helical structure formed by pi-stacking of the pyridine-based quencher copolymer. The helical pixilated photoresist is applied to a substrate and irradiated and developed to form a patterned photoresist.

Abstract: A compound including a polyhydric phenol compound represented by general formula (I) shown below (wherein R11 to R17 each independently represents an alkyl group of 1 to 10 carbon atoms or aromatic hydrocarbon group which may contain a hetero atom in the structure thereof, and X represents an aliphatic cyclic group) and having a molecular weight of 300 to 2,500, in which some or all of the hydrogen atoms of the phenolic hydroxyl groups are substituted with acid dissociable, dissolution inhibiting groups; a positive resist composition containing the compound; and a method of forming a resist pattern using the positive resist composition.

Abstract: A lithographic printing process which comprises the steps of: imagewise scanning with a laser a presensitized lithographic plate which comprises a hydrophilic support and an image-recording layer containing a polymerization initiator, an ethylenically unsaturated polymerizable compound having no adherence to the hydrophilic support, and an ethylenically unsaturated polymerizable compound having adherence to the hydrophilic support and a molecular structure comprising a polyoxyalkylene group to polymerize the ethylenically unsaturated polymerizable compounds within the exposed area; removing the image-recording layer within the unexposed area from the lithographic plate mounted on a cylinder of a printing press; and then printing an image with the lithographic plate mounted on the cylinder of the printing press. A presensitized lithographic plate is also disclosed.

Abstract: There is provided a polymerizable composition comprising (A) a binder polymer, (B) a polymerizable compound having an unsaturated group, and (C) a diaryl iodonium salt having at least two electron-donating groups. The iodonium salt (C) preferably has three or more electron-donating groups. This polymerizable composition is useful as a recording layer of a negative type planographic printing plate precursor.

Abstract: A positive resist composition comprising (A) resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and capable of decomposing by the action of an acid to increase the solubility in an alkaline developer, (B) a compound capable of generating an acid upon treatment with one of an actinic ray and radiation and (F) a specific surfactant containing a fluorine atom in an amount of from 30 to 60 mass %, and a pattern-forming method using the same.

Abstract: There is provided a color resist composition comprising a resin (A), a photoacid generator or a photobase generator (B), a crosslinking compound (C) and a dye mixture (D) containing a dye having a structure of amino sulfonate ester or ammonium sulfonate salt in a proportion of 40 to 95% by weight on total dye content. Preferably, resin (A) is polyvinyl phenol or a copolymer thereof, and the color resist composition has an optical quality having at least a region with a transmittance of 70% or more and a region with a transmittance of 10% or less in wavelength range between 400 nm and 700 nm, and in which a variation in transmittance is 5% or less even when the composition is subjected to a temperature of 200° C. or more. The color resist composition is applicable for color filters which exhibits a high spectrum reproducibility, a high light-resistance and a heat-resistance, and has a high resolution of 5 ?m or less and no post development residue.

Abstract: A technique to acquire a photoresist composition which can reduce occurrence of defects of a resist pattern after development is provided. Further, a technique to obtain a photoresist composition having excellent storage stability characteristics as a resist solution (storage stability); and a technique to obtain a photoresist composition which reduces the change of sensitivity and resist pattern size after treatment almost completely are provided. A photoresist composition containing a resin component (A), an acid-generating component (B) for generating an acid under exposure, and an organic solvent (C) is passed through a first filter 2a equipped with a first membrane having zeta potential of more than ?20 mV but no more than 15 mV in distilled water of pH 7.0.

Abstract: A method of making a lithographic printing plate comprising the steps of: a) providing a lithographic printing plate precursor comprising (i) a support having a hydrophilic surface or which is provided with a hydrophilic layer, (ii) a photopolymerizable coating on said support, b) image-wise exposing said coating in a plate setter, c) developing the precursor, thereby removing the non-exposed areas of the coating from the support, whereby the developing step is carried out off-press in a gumming unit by treating the coating of the precursor with a gum solution.

Abstract: A dissolution modification agent suitable for use in a photoresist composition including a polymer, a photoacid generator and casting solvent. The dissolution modification agent is insoluble in aqueous alkaline developer and inhibits dissolution of the polymer in the developer until acid is generated by the photoacid generator being exposed to actinic radiation, whereupon the dissolution modifying agent, at a suitable temperature, becomes soluble in the developer and allows the polymer to dissolve in the developer. The DMAs are glucosides, cholates, citrates and adamantanedicarboxylates protected with acid-labile ethoxyethyl, tetrahydrofuranyl, and angelicalactonyl groups.

Abstract: Compounds of the formula (I), wherein R1, R2 and R10 independently of one another are C1-C20alkyl, phenyl, C1-C12alkylphenyl or phenyl-C1-C6alkyl; R3 and R4 independently of one another are hydrogen, C1-C20alkyl, NR6R7 or SR8, provided that at least one of R3 or R4 is NR6R7 or SR8; R5 is hydrogen or C1-C20alkyl; R6 and R7 independently of one another are C1-C20alkyl, or R6 and R7 together with the N-atom to which they are attached form a 5 or 6 membered ring, which optionally is interrupted by O, S or NR9 and which optionally additionally is substituted by one or more C1-C4alkyl; R8 is phenyl, biphenylyl, naphthyl, anthryl or phenanthryl, all of which optionally are substituted by one or more C1-C4alkyl; and R9 is hydrogen, C1-C20alkyl, C2-C4hydroxyalkyl or phenyl; exhibit an unexpectedly good performance in photopolymerization reactions.

Abstract: A photosensitive resin composition for forming a laser engravable printing element, comprising: (a) 100 parts by weight of a resin which is in a solid state at 20° C., wherein the resin has a number average molecular weight of from 5,000 to 300,000, (b) 5 to 200 parts by weight of an organic compound having a number average molecular weight of less than 5,000 and having at least one polymerizable unsaturated group per molecule, and (c) 1 to 100 parts by weight of an inorganic porous material having an average pore diameter of from 1 to 1,000 nm, a pore volume of from 0.1 to 10 ml/g and a number average particle diameter of not more than 10 ?m. A laser engravable printing element formed from the above-mentioned resin composition. A method for producing a laser engraved printing element by using the above-mentioned photosensitive resin composition.

Abstract: Antireflective coating compositions with reduced outgassing are disclosed.

Abstract: There is provided a color resist composition comprising a resin (A), a photoacid generator or a photobase generator (B), a crosslinking compound (C) and a dye mixture (D) containing a dye having a structure of amino sulfonate ester or ammonium sulfonate salt in a proportion of 40 to 95% by weight on total dye content. Preferably, resin (A) is polyvinyl phenol or a copolymer thereof, and the color resist composition has an optical quality having at least a region with a transmittance of 70% or more and a region with a transmittance of 10% or less in wavelength range between 400 nm and 700 nm, and in which a variation in transmittance is 5% or less even when the composition is subjected to a temperature of 200° C. or more. The color resist composition is applicable for color filters which exhibits a high spectrum reproducibility, a high light-resistance and a heat-resistance, and has a high resolution of 5 ?m or less and no post development residue.

Abstract: An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.