Abstract: The present disclosure provides a power module including a circuit board, a first heat-generating component and a second heat-generating component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first heat-generating component and the second heat-generating component are disposed on the first plane and the second plane, respectively. The first heat-generating component and the second heat-generating component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are located at a first collaborative plane of the power module. It benefits to reduce the design complexity of a heat sink, and enhance the heat dissipation capability and the overall power density of the power module simultaneously.

Abstract: The disclosure relates to a holding device and an electronic device assembly and an electronic apparatus having the same. The holding device is able to hold an insertion device. At least one holding structure of the holding device includes a first holding portion and a second holding portion, and the second holding portion is located closer to the insertion opening than the first holding portion. The first holding portion is configured to hold the insertion device at an installed position, and the second holding portion is configured to hold the insertion device at a non-installed position.

Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: A solid-state drive (SSD) heat dissipation device is disclosed. The SSD heat dissipation device comprises a solid-state drive substrate, a chip heat dissipation component, a memory heat dissipation component, and a spacer. A control IC and a flash memory are disposed on the solid-state drive substrate, the chip heat dissipation component is disposed on the control IC, and the memory heat dissipation component is disposed on the flash memory. The chip heat dissipation component and the memory heat dissipation component are disposed separately.

Abstract: A cooling device includes a circulation channel through which a refrigerant is circulated, a heat receiving part which is disposed in the circulation channel and in which the refrigerant receives heat generated by a heat generating component, a heat dissipating part which is disposed in the circulation channel and in which the refrigerant dissipates the heat received in the heat receiving part, a pump which is disposed in the circulation channel and which sends the refrigerant to the heat receiving part, and a tank which is coupled to the circulation channel and which has a space therein, wherein the tank is disposed at a higher position in a vertical direction than the pump in a state where the pump is located on an upper side in the vertical direction with respect to the heat receiving part and the heat dissipating part.

Abstract: A multiple input power distribution shelf and a bus bar assembly thereof are provided. The power distribution shelf is installed in the server rack and comprises plural power supply units. The bus bar assembly comprises a first linking bus bar, a second linking bus bar, an insulation member and plural power connectors. The first linking bus bar comprises a first main bar, plural first bending parts and at least one first output part. The second linking bus bar comprises a second main bar, plural second bending parts and at least one second output part. The insulation member is disposed between the first main bar and the second main bar for insulation. The power connectors are mounted on the bending parts and connect with the power supply units. The first output part and the second output part are electrically connected with a rack bus bar of the server rack.

Abstract: An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

Abstract: In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.

Abstract: A cooling system for a server rack may cool one or more servers and one or more components thereof. The cooling system may comprise an air mover, an air delivery manifold, and one or more injection ducts for the one or more servers. The air mover may be located in an air mover module positioned in the server rack and may generate a pressurized airflow. The air delivery manifold receives the pressurized airflow generated by the air mover, and may have delivery ports and provide a fluid path for airflow out of the delivery ports to the injection ducts. The injection ducts may be used to inject the airflow of cooling air into the servers to cool the servers and one or more components thereof.

Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

Abstract: Modular switchgear systems are provided including at least two separate modules including components of switchgear. The at least two separate modules are independent of one another. One of the at least two separate modules is a stationary module and remaining ones of the at least two separate modules are removable such that the remaining ones of the at least two separate modules are configured to engage and/or disengage easily from the stationary module and an electrical power system. Related removable modules are also provided.

Abstract: Certain aspects of the present disclosure provide an apparatus comprising a battery encapsulated within a sealed enclosure, an electronic device encapsulated within the sealed enclosure, a power control circuit encapsulated within the sealed enclosure, and a loop of conductive medium connected to the power control circuit. The electronic device is in a deactivated state. At least a portion of the loop of conductive medium passes out of and back into the sealed enclosure. In response to severing of the at least portion of the loop of conductive medium which is outside of the sealed enclosure, the power control circuit is configured to cause activation of the electronic device.

Abstract: An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.

Abstract: Systems, methods, and software are disclosed herein having enhanced modular carrier form factors. In an implementation, a network card apparatus comprises a network card assembly. The network card assembly comprises a network interface card and a connector card coupled to the network interface card and comprising a U.2 connector configured to mate with a U.2 connector of the modular bay of the rackmount chassis assembly.

Abstract: A programmable AC power distribution device includes a control circuit board disposed on a connecting plate. A fixing plate is disposed in a case. The connecting plate is connected to the fixing plate through a coupling member. Thereby, the connecting plate with the control circuit board can be disassembled only by removing the coupling member. When the control circuit board is to be reinstalled, the connecting plate can be easily fixed to the fixing plate through the coupling member. The assembly and disassembly of the control circuit board can be improved effectively, thereby greatly improving the efficiency of the check and repair of the control circuit board.

Abstract: A system for an electrical power distribution network includes a plurality of electrical apparatuses, each electrical apparatus including a mechanical connection and at least one electrical connector; and a single-piece unitary support configured to receive and hold the plurality of electrical apparatuses, the support including: a frame including a plurality of mechanical interfaces, each of the mechanical interfaces configured to receive and hold a mechanical connection of one of the plurality of electrical apparatus; a cover extending from a side of the frame; and a panel integrated with the frame, the panel including a plurality of electrical interfaces, each of the plurality of electrical interfaces configured to couple to an electrical connector of one of the electrical apparatuses, the cover positioned over the panel.

Abstract: A motor unit includes a motor and an amplifier section including a drive circuit that drives the motor. The amplifier section includes an amplifier cover. A power line for supplying power to the motor is bound to the amplifier cover.

Abstract: A multi-embedded radio frequency board includes a plurality of printed circuit boards stacked one on the others, at least one of the printed circuit boards of the plurality of printed circuit boards being configured so as to have a different processing function than another processing function of another printed circuit board of the plurality of printed circuit boards, and an interconnection join layer disposed between adjacent printed circuit boards of the plurality of printed circuit boards so as to physically and electrically couple the adjacent printed circuit boards to each other so as to form an integrated printed circuit board module having a predetermined radio frequency communication characteristic.

Abstract: A display device includes a display panel; a bottom chassis in which the display panel is accommodated, the bottom chassis defining: a first surface adjacent to the display panel, a second surface opposing the first surface, and a hole extending from the first surface to the second surface; and an adhesive film removably attachable to the second surface of the bottom chassis, the adhesive film including a guide line forming an enclosed shape. The adhesive film attached to the second surface of the bottom chassis disposes the enclosed shape formed by the guide line of the adhesive film, overlapping the hole, and a minimum dimension of the enclosed shape formed by the guide line is greater than a dimension of the hole.