Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.

Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

Abstract: Example implementations relate to a method and system for pumping fluid with a pump assembly to cool waste-heat producing system of an apparatus. The pump assembly includes a first housing, a rotor assembly, a stator assembly, a second housing, an outlet connection port coupled to the second housing, and a guide vane insert. The first housing includes a first bore and first inlet guide vanes (IGVs) coupled to inlet of the first bore. The rotor assembly including an impeller, is disposed in the first bore. The stator assembly including a coil, is mounted around a portion of the first housing. The second housing has a second bore fluidically coupled to the first bore, and first outlet guide vanes (OGVs) coupled at an entrance of the second bore. The guide vane insert including second OGVs, is disposed within the outlet connection port and fluidically coupled to outlet of the second bore.

Abstract: A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.

Abstract: A contactor with a rotary actuation system, the contactor including a plurality of switching devices configured to switch a plurality of electrical circuits, a plurality of cam followers each operably coupled to one of the switching devices, wherein each cam follower is configured to actuate a switching device, and a cam mechanism, the cam pivotally attached to a point rotation, the cam having plurality of lobes about its perimeter, the cam in operable communication with each cam follower such that upon rotation of the cam mechanism, each cam follower engages a lobe of the plurality of lobes, it causes each cam follower to actuate the respective switching device. The contactor also includes an actuator connected to the cam, the actuator responsive to a control current and operable to rotate the cam and a controller, the controller operable to supply a control current the actuator.

Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

Abstract: A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.

Abstract: An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

Abstract: A switchgear assembly is provided with an integrated arc flash venting system. The switchgear assembly comprises a circuit breaker section including an arc flash vent stack having blow open flaps disposed on a switchgear roof to exhaust arc flash gases and contaminants away from a front of the circuit breaker section, towards a rear of the circuit breaker section and a top of the circuit breaker section. The circuit breaker section includes a circuit breaker compartment having a back wall with a back vent opening for the passage of all the arc flash gases and contaminants. The circuit breaker section further includes a bus compartment. All of the arc flash gases and contaminants pass through the back vent opening in the circuit breaker compartment and into the bus compartment which forms a single pathway for channeling all of the arc flash gases and contaminants to the arc flash vent stack.

Abstract: A heat sink is described for cooling an electrical component. The heat sink has heat dissipating structures connected to a base. The base is attached to a connector which makes contact with a heat transfer contact of the electrical component. The electrical component may be a power supply bus which supplies electrical current to a series of circuit breakers.

Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

Abstract: An indoor switchgear or controlgear arrangement with unmanned operation and maintenance, for use in low, medium, or high voltage, includes: an arrangement of switching devices in an inner housing, which is furthermore provided with an outer housing; and a robot system, acting mainly in the inner housing. At least the switching devices other than maintenance critical parts are withdrawable. The switchgear or controlgear is provided with interlocks in order to prevent a wrong sequence of operation and prevent access to potentially hazardeous compartments. Metallic segregation is provided internally in the inner housing in order to achieve a needed service continuty level.

Abstract: Hand held equipment has a body and a heat sink. The body defines an outer surface and a heat source therewithin. The heat sink forms a portion of the outer surface and is positioned in close proximity to the heat source so as to conduct heat therefrom. The heat sink has a base, a plurality of fins and a coating having low thermal conductivity (which may be a ceramic coating). The base has a lower and an upper surface. The lower surface is in close proximity to the heat source. The plurality of fins has a proximal end meeting the upper surface of the base, and a distal end extending away from the base. Each of the plurality of fins define a cross-sectional area and terminate at an outward surface. The coating extends over at least a portion of the outward surface of the plurality of fins. A heat sink is likewise disclosed.

Abstract: A modular power distribution apparatus and method includes a frame defined by a first set of parallel supports and a second set of parallel supports, the second set of parallel supports connecting the first set of parallel supports, the frame defining a generally planar assembly defining a first side and a second side opposite the first side, as well as a set of components extending from a side of the frame and operably coupled to the frame. The set of components includes a set of power modules.

Abstract: A wiring board includes a rod-shaped shaft member including at one end a flange that has a larger diameter than any other portion, a heat-releasing plate including a first through-hole in which the shaft member is inserted, and a board including a second through-hole in which the shaft member is inserted. In the wiring board, a gap is formed at least in part between the heat-releasing plate and the board.

Abstract: A gas-insulated line is provided. The gas-insulated line defines an axial direction and includes an enclosure configured to surround a nominal conductor and a pressurized insulation gas in the enclosure, wherein the enclosure includes: a first attachment point and a second attachment point, the first attachment point and the second attachment point being spaced apart from each other in the axial direction; a rope element fixed between the first attachment point and the second attachment point and loaded with a pretension; and a flexible enclosure element arranged between the first attachment point and the second attachment point.

Abstract: A power supply noise suppressor includes a housing configured to be fastened or adhered to a customer-premises equipment (CPE) device. A first connector is configured to connect to a cable. A second connector is configured connect to the CPE device. A circuit is positioned at least partially within the housing and connected to the first and second connectors. The circuit is configured to reduce an amount of a power supply switch noise that is transmitted in an upstream direction from the CPE device to the cable.

Abstract: A relay arrangement includes at least two series-connected relays, which are mechanically and electrically connected to a main printed circuit board via first terminals and second terminals, and at least one flat conductor for conducting current between the at least two series connected relays. The flat conductor is mechanically connected to the main printed circuit board and electrically and thermally connected to the first terminals of the relays, and the at least one flat conductor is configured to dissipate heat produced during operation of the relays.

Abstract: A liquid cooling system for a circuit board made up of a cold plate and heat sinks connected to the cold plate by flexible connections.

Abstract: A chassis-mounted electronic device includes a chassis, an upper EMI gasket, and a lower EMI gasket is provided. The chassis, including an upper chassis and a lower chassis, is constructed from a conductive sheet with a first thickness. The upper chassis and the lower chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and is thinner than the upper chassis. The lower EMI gasket is attached to the lower chassis, and is also thinner than the lower chassis. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. Both the upper EMI gasket and the lower EMI gasket are configured to resiliently contact a portion of the electronic device to provide EMI shielding for the electronic device.