Abstract: A clamp assembly is operable to engage at least three heat-generating electrical components arranged side-by-side and clamp the electrical components relative to a heat sink. The clamp assembly includes a clamp bar and a fastener to secure the clamp bar to the heat sink. The clamp bar includes at least three spaced apart projections configured to be located in engagement with the respective electrical components. The clamp bar presents a slot positioned between a spaced apart pair of the projections and defines respective clamp bar sections on opposite sides thereof. The slot permits the clamp bar sections to shift relative to one another and thereby facilitate clamping engagement of the projections with the electrical components.

Abstract: Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

Abstract: A pressing member is used for pressing semiconductor modules and cooling pipes which are alternately disposed, and includes a plate and an elastic member. The plate includes a contact plate section that faces an end surface of the fixed unit in the fixed direction and contacts with the end surface of the fixed unit, and plate ribs standing in the fixed direction from an end portion of the contact plate section in a width direction of the contact plate section. The elastic member is disposed in a side of the plate opposite to a side of the plate where the fixed unit is disposed, the elastic member pressing the plate towards a fixed unit side in the fixed direction. The contact plate section has an inner plate surface including a concave surface formed at a portion apart from the plate ribs in a contact region.

Abstract: A heat transfer interface structure and a method of manufacturing the same are disclosed. A substrate has a plurality of raised features formed on at least one surface the substrate. The raised features are deformable under a compressive force and have respective openings at end portions thereof. A thickness of a raised feature at the end portion thereof is smaller than a thickness of the raised feature at an intermediate portion of the raised feature.

Abstract: There is disclosed a motor vehicle electronic control unit casing. The casing includes a housing (1) for electronic components, and a cover (15). The housing and cover (15) are inter-engageable. The housing (1) has a base (2), and an upstanding peripheral side wall (3) defining a peripheral edge (4) in spaced relation to the base (2) and which extends around an access opening of the housing. The cover (15) has a closure part (16) and is configured to close the access opening via engagement between the closure part (16) and the housing (1) around the peripheral edge (4). The cover (15) also has a mounting portion configured to be mounted to a mounting surface (27) in a motor vehicle.

Abstract: Disclosed herein is a telecommunications enclosure. The telecommunications enclosure includes a housing defining an interior and including at least one cable port. The telecommunications enclosure also includes a printed circuit board in the interior of the housing and heat generating components on the printed circuit board. The telecommunications enclosure further includes a heat sink assembly in the interior of the housing. The heat sink assembly includes a thermally conductive plate mounted to transfer heat to the housing; and heat sink components extending from a first face of the thermally conductive plate. Each heat sink component corresponds to and is in alignment with one of the heat generating components. The heat sink assembly is a separate component from the housing.

Abstract: A fluid conditioner 1 for use in a tank 110 containing electronic devices, immersed in fluid F, comprises a housing 10 having a chamber 38, an outlet 14, a heat exchanger 18 located in the chamber, and one or more pumps 16 such that the fluid passes into contact with the heat exchanger. The heat exchanger 18 has an inlet 30 for cooling medium to enter and an outlet 32 for cooling medium to exit. In the upright, operational orientation, the pumps 16 and the heat exchanger 18 are vertically spaced relative to one another and the heat exchanger 18 is located above the outlet. Fluid F is moved through the pumps 16 and passes into contact with the heat exchanger 18. The cooled fluid F exits via the outlet 14 of the fluid conditioner 1 and passes into the lower region of the tank 110 for circulation therethrough.

Abstract: A power converter device includes a power element module, a conductor, and a magnetic-conductive assembly. The power element module includes at least two electrodes and a power semiconductor unit. Voltage among these electrodes is AC voltage. The power semiconductor unit includes at least one pure die, and the pure die includes plural surfaces. The surface which occupies the most area of the pure die is the pure die surface. The conductor is coupled to the power element module. A current loop forms between the power element module and the conductor. A magnetic loop forms in the magnetic-conductive assembly. The magnetic-conductive assembly includes a chamber. The current loop passes through the chamber and intersects the magnetic loop to form inductance which the current loop needs. A part of the power element module is disposed in the chamber.

Abstract: A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate, a heat dissipation member accommodated inside the housing, at least one antenna module disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna module being disposed to be inclined or perpendicular relative to the front plate or the rear plate, and a fixing member coupled to and at least partially surrounding the antenna module. The fixing member may include a first heat transfer portion at least partially surrounding a rear face of the antenna module, and a second heat transfer portion disposed in contact with the heat dissipation member.

Abstract: The present disclosure provides a coupling system for coupling a medical accessory to an accessory support is provided. The present disclosure also provides a system for powering a medical accessory with an accessory support.

Abstract: Cradle-assist assemblies attached to the breaker cradle housing and/or base or residing at least partially in the breaker cradle housing and/or base include at least one actuator configured to laterally translate the at least one right and the at least one left lock members from the extended lock position to the retracted unlocked position in response to input from a user. The at least one actuator and/or transverse member(s) can be held in a defined position so that the lock members of the cradle can be locked in the respective retracted or extended positions until the cradle assist (internal) lock is manually or automatically released.

Abstract: A configuration system for reconfiguring a switch cabinet includes a detection unit—which detects functional units of an electric circuit, which are mounted within a switch cabinet, by way of characteristic features of the functional units, which have unambiguous identification features which are read out by the detection unit. A configuration unit contains a processor, which determines an electric circuit diagram of the electric circuit on the basis of the functional units of the electric circuit which are detected by way of the characteristic features and automatically replaces the detected functional units of the determined circuit diagram with associated replacement functional units which are stored in a database. An output unit is provided for outputting the determined replacement functional units.

Abstract: A fluid cooling module (or system) for peripheral component interconnect express (PCIE) electronics housed within a chassis is disclosed. The system includes a mounting rail attached to a chassis, a cold/cooling plate having one or more mounting bolts attached to a side of the cold plate, the one or more mounting bolts to lock the cold plate to a fixing channel of the mounting rail to position a surface of the cold plate against a surface of the PCIE electronics, locking teeth of the fixing channels ensure a proper pressure being loaded horizontally on the PCIE electronics by the cold plate, and a fluid loop along a length of the mounting rail to circulate a fluid to the cold plate to cool the PCIE electronics.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may receive a digital voltage value from an analog to digital converter; may determine a resistance value of a device that includes a plurality of conductors separated from each other by a distance and a material that includes a substance that forms an electrically conductive solution when dissolved by a polar solvent and that is configured to receive a liquid that removes heat from one or more components of the information handling system; may determine that the resistance value of the device is at or below a threshold resistance value; and in response to determining that the resistance value of the device is at or below the threshold resistance value, may provide information that indicates a leak of the liquid.

Abstract: A circuit breaker and panel system includes a panel including a base pan having a plurality of base pan electrical connections. A circuit breaker including a housing having a plurality of circuit breaker electrical connections arranged to contact the base pan electrical connections when the circuit breaker is coupled to the base pan. The circuit breaker is rotatably coupleable with the base pan via a pivot joint for engaging the plurality of base pan electrical connections with the plurality of circuit breaker electrical connections per a predetermined electrical connection coupling sequence. One of the housing and the base pan includes a protrusion and the other of the housing and the base pan includes a corresponding recess which, when engaged with each other, retain the housing to the base pan to prevent reverse rotational movement of the breaker with respect to the base pan.

Abstract: The disclosure generally relates to an exemplary cooling system for an enclosure that can house an electrical network protection element and provide protection to the electrical network protection element against damage in various environments such as when the enclosure is placed in an underground vault that may be flooded during rain, or when a liquid (oil, for example) comes in contact with the enclosure. The exemplary cooling system may include a coolant reservoir, one or more false walls coupled to the exterior of the enclosure, one or more pancake panels coupled to the false walls through one or more header pipes, and one or more coolant pipes for circulating coolant from the coolant reservoir, through the one or more pancake panels, false walls, and header pipes, and back to the coolant reservoir. The cooling system may only be in contact with the exterior portion of the enclosure. That is, the cooling system may not directly contact the electronics within the enclosure.

Abstract: The present disclosure provides a power module including a circuit board, a first heat-generating component and a second heat-generating component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first heat-generating component and the second heat-generating component are disposed on the first plane and the second plane, respectively. The first heat-generating component and the second heat-generating component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are located at a first collaborative plane of the power module. It benefits to reduce the design complexity of a heat sink, and enhance the heat dissipation capability and the overall power density of the power module simultaneously.

Abstract: The disclosure relates to a holding device and an electronic device assembly and an electronic apparatus having the same. The holding device is able to hold an insertion device. At least one holding structure of the holding device includes a first holding portion and a second holding portion, and the second holding portion is located closer to the insertion opening than the first holding portion. The first holding portion is configured to hold the insertion device at an installed position, and the second holding portion is configured to hold the insertion device at a non-installed position.

Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.