Abstract: A cooling device to be provided is capable of being reduced in size, capable of cooling a heating component uniformly, having high radiating performance, and facilitating implementation of a work in a flat state. A first cooler body includes a first base plate and first blades. The first base plate has a first component mounting surface. A second cooler body includes a second base plate and second blades. The second base plate has a second component mounting surface. With the second cooler body maintained connected to the first cooler body, a rotary mechanism allows the second cooler body to rotate relative to the first cooler body between a state in which the first component mounting surface and the second component mounting surface are pointed to the same direction and a state in which the second blades get into gaps between the first blades without interfering with the first blades.

Abstract: A die heat dissipation structure includes a heat dissipation unit and a die. The heat dissipation unit has a first side and a second side. The second side is formed with a contact section raised from the second side. One end of the contact section has a slightly convex form. The die has an upper surface and a lower surface. One end of the contact section attaches to and is in contact with the upper surface of the die. The upper surface has a slightly concave form in adaptation to the slightly convex form of the contact section.

Abstract: A power management system includes a generator, a meter mounted transfer switch, and a power management module. The generator includes a controller positioned in the housing of the generator. The generator connects to the power management module to provide power to one or more electrical loads. The controller is configured to selectively disconnect at least one of the electrical loads by communicating, via a wireless gateway, to a transfer switch of the power management module to move between first and second positions for connecting the generator to the one or more electrical loads.

Abstract: A magnetic electrical switch apparatus includes: a switch assembly that includes: a switch body housing including a stationary contact; a shaft configured to move relative to the switch body housing, the shaft including: a moveable contact; and a first magnet; and a movable support member including a second magnet. The moveable contact and the first magnet are configured to move with the shaft. Moving the movable support member moves the second magnet relative to the first magnet, and a magnetic interaction between the second magnet and the first magnet moves the moveable contact relative to the stationary contact to thereby change a state of the switch assembly.

Abstract: A gas insulated switchgear (GIS) system is provided including at least two separate modules including components of GIS, the at least two separate modules being independent of one another and configured to be assembled into the GIS system at a destination, wherein one or more of the at least two separate modules includes one of cabling and a solid insulated bus bar to connect the GIS system to an electrical power system at the destination. Related cabling modules are also provided.

Abstract: A water-cooled motor controller includes a capacitor, a water-cooled plate, and a power module stacked in a controller housing. The power module is fixedly connected to the water-cooled plate. The water-cooled plate is provided with a cooling medium flow channel on one side facing the power module, and the other side of the water-cooling plate on which the cooling medium flow channel faces away from the power module side contacts the capacitor through an insulating and thermally conductive material for heat exchange. The water-cooled plate and the controller housing are fixedly connected to each other with a cooling medium passage provided therebetween. A cooling medium flows in from the controller housing, and then flows out of the controller housing after being heat exchanged by the water-cooled plate. The present invention utilizes upper and lower surfaces of the water-cooled plate to dissipate heat from the capacitor and the power module simultaneously.

Abstract: A layered DC busbar structure includes a positive DC substrate arranged to carry a positive DC voltage, the positive DC substrate being arranged on a first layer, and a negative DC substrate arranged to carry a negative DC voltage, the negative DC substrate being arranged on a second layer. A DC neutral substrate is arranged on a central layer between the first and second layers. An AC substrate is arranged to carry an AC voltage, the AC substrate being arranged on the central layer and substantially coplanar with the DC neutral substrate.

Abstract: A switching device has an encapsulation housing and lashing points. The lashing points are arranged in such a manner that a center of gravity of the switching device lies below the lashing points in a lashing direction.

Abstract: A polymer composition comprising a polymer matrix within which a plurality of flake-shaped mineral particles and mineral whiskers are distributed is provided. The polymer composition exhibits an in-plane thermal conductivity of about 0.2 W/m-K or more as determined in accordance with ASTM E 1461-13.

Abstract: A design for the electrical infrastructure of a data center enables two different configurations to be utilized, including a distributed, redundant configuration that provides higher reliability and a non-redundant configuration that provides higher capacity. In the distributed, redundant configuration, each server in the data center draws power from at least two different power supply systems. This enables load shifting when a power supply system becomes unavailable, which can have the effect of increasing server reliability. In the non-redundant configuration, each server in the data center draws power from only one power supply system. Load shifting is not utilized in the non-redundant configuration, which eliminates the need to maintain reserve capacity and thereby increases capacity. Advantageously, it is possible to switch between these two configurations without making any internal changes to the data center other than modifying connections between sets of server racks and power buses.

Abstract: An electronic device according to various embodiments of the present invention may comprise: at least one sensor; a processor electrically connected to the at least one sensor; a memory electrically connected to the processor; and a support structure formed to have one end connected to a boundary between a first region and a second region of a rear surface of the electronic device and rotate in one direction with reference to the one end so as to cover the second region in a closed state thereof and support the electronic device in an opened state thereof.

Abstract: An electrical power or electronic data distribution system includes a power supply or electronic data module that receives electrical power or electronic data signals from a source, a flat-conductor strip for routing electrical power or electronic data along a generally planar surface such as a floor, wall, room divider, or ceiling, and a power or data output block. The power supply has a pair of power outfeed conductors, and the flat-conductor strip has a pair of generally planar electrical conductors in spaced arrangement, which are electrically coupled to respective power outfeed conductors. The output block has a pair of power-receiving contacts along a lower surface thereof, and an electrical receptacle at the output block, the receptacle being positioned above the lower surface. The power-receiving contacts electrically engage respective planar electrical conductors and convey electrical power to respective contacts of the electrical receptacle, for powering electrical or electronic devices.

Abstract: An electronic module includes a circuit board having a mounting surface; a heat generating component mounted on the mounting surface; a frame supporting the circuit board; a cover covering the heat generating component and the mounting surface; and a heatsink mounted on the mounting surface. The heatsink includes at least one wall including a particular wall to which the heat generating component is attached. The heatsink further includes a shade portion provided at the at least one wall. The shade portion is located between the cover and the heat generating component in a direction perpendicular to the mounting surface.

Abstract: A display device including a carrying main body, a flexible display panel and at least one fan is provided. The flexible display panel is disposed on the carrying main body and adapted to be unfolded on the carrying main body. A gap is formed between the flexible display panel and the carrying main body. The fan is disposed on the carrying main body and adapted to generate an airflow, and a flow path of the airflow is located at the gap.

Abstract: The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.

Abstract: A clamp configured to be coupled to a printed circuit board to cool and compress one or more electrical connections subject to repeated power and thermal cycling. A first conductive column of the clamp is configured to compress a first electrical connection between a first power device lead and a first printed circuit board trace of the printed circuit board, and draw thermal energy away from the first power device lead. The first conductive column extends from a load spreading plate. The load spreading plate is an insulator that electrically isolates a fastener extending therefrom from the first conductive column. The fastener is configured to cooperate with the circuit board to connect the clamp to the circuit board, compress the load spreading plate against the first conductive column to compress the first electrical connection, and connect the clamp to ground.

Abstract: Server racks that are integrated with cold air delivery are described. Each server rack has a tube having a hollow space therein. The hollow space is used to deliver cold air via one or more valves to one or more servers. The one or more valves are either integrated or fitted to the server racks. The use of the hollow space by itself increases pressure of the cold air. There is no need to use a large fan that consumes a large amount of energy to pressurize the cold air and no need to use a raised floor.

Abstract: An auxiliary-cooled electronics assembly comprises a metal extrusion that includes: one or more cooling conduits extending axially along a length of the metal extrusion with a first open end in fluid communication with the cooling conduit(s); and a second open end in fluid communication with the cooling conduit(s); a first end cap coupled to the first open end forming a fluid-tight seal between the first end cap and the metal extrusion; a second end cap coupled to the second open end forming a fluid-tight seal between the second end cap and the metal extrusion; and one or more electrical circuit components, electrically linked together to form an electrical circuit, mounted to the metal extrusion.

Abstract: Functional modules of a modular system include two or more ferrous conductors, each conductor having a separate magnet associated therewith that is electrically isolated from other conductors and magnets. Circuitry within functional modules is electrically connected to the ferrous conductors. The ferrous conductors of the functional modules are configured to be magnetically attracted to, contact, and receive power from ferrous conductors of a power delivery module.

Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.