Patents Examined by Courtney L Smith
  • System, method, and apparatus for integrating high power density power electronics on a mobile application
    Patent number: 11272638
    Abstract: A motor drive converter includes a cold plate having a first side and a second side, the first side being opposite to the second side. The motor drive converter may further include at least one motor phase power electronics disposed on the first side of the cold plate, and a capacitor array disposed on the second side of the cold plate. The cold plate may include slots therethrough for a conductor to pass through the cold plate. The conductor may be configured to electrically coupling the capacitor array and the at least one motor phase power electronics.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 8, 2022
    Assignee: Eaton Intelligent Power Limited
    Inventors: Thomas Joseph Stoltz, Glenn Clark Fortune, Elizabeth Jane Mercer, Viken Rafi Yeranosian
  • Electronic control device
    Patent number: 11266044
    Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: March 1, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Isamu Yoshida, Masaru Kamoshida, Toshikazu Shigyo, Shiro Yamashita
  • Electronic apparatus and exterior panel thereof
    Patent number: 11262810
    Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: March 1, 2022
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Yujin Morisawa, Kazutaka Eto, Yasuhiro Ootori, Yuta Tamaki, Toshihiro Ueda
  • Power conversion device
    Patent number: 11252845
    Abstract: A power conversion device includes an electronic component, a cooler, a housing, protruding pipes, and annular seal members. Each of the seal members includes a seal body portion interposed between a corresponding one of the protruding pipes and the housing, and a flange portion extending outward from the seal body portion in a radial direction and contacting an outer surface of the housing from an axial direction. The housing includes a peripheral wall surface formed to surround the flange portion from an outer peripheral side, and an annular groove portion formed along an outer peripheral edge of the flange portion inside the peripheral wall surface. The peripheral wall surface is formed to extend outward, in the axial direction, from an axial contact surface of the housing contacted by the flange portion.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 15, 2022
    Assignee: DENSO CORPORATION
    Inventors: Tomoya Miura, Kenshiro Hida, Hiroyoshi Sawada
  • Module, and server
    Patent number: 11246242
    Abstract: A module including a substrate; a cooling unit that cools a heat-generating component provided on the substrate; a connection terminal portion provided on the substrate; and a connection pipe that is connected to the cooling unit and that extends in a direction different from a direction of at least one of insertion and withdrawal of the connection terminal portion, wherein the connection pipe extends from a side towards the connection terminal portion.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: February 8, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Syoji Ochiai
  • Power electronics assembly
    Patent number: 11246244
    Abstract: A power electronics assembly comprises a heat sink, at least two half bridge modules mounted on one side of the heat sink, a circuit board mounted on the half bridge modules, and at least one capacitor mounted on the circuit boards, wherein each of the half bridge modules has a housing that has a cold side that is mounted on the heat sink, and the housing has a connection side from which numerous connection pins project for each DC connection in the half bridge module that are connected to the circuit board, and wherein conductors in the circuit board are designed to connect the half bridge modules in parallel and connect them to the at least one capacitor to form a DC link.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: February 8, 2022
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Marco Denk, Johannes Hager, Michael Sperber
  • Rack arrangement for a data center
    Patent number: 11240936
    Abstract: A rack arrangement for a data center includes at least one row of racks including a plurality of computer racks and an air handler rack. Each computer rack includes a computer rack frame including a housing unit for housing computer equipment. The air handler rack includes an air handler rack frame, a heat exchanger and at least one fan. The at least one fan is configured for pulling air into the air handler rack via an air inlet side and discharging air via an air outlet side of the air handler rack, directing air through the heat exchanger. An air inlet side of any one of the computer racks and the air outlet side of the air handler rack are on a cold aisle side of the at least one row of racks. At least one selected rack is stacked atop the air handler rack.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 1, 2022
    Assignee: OVH
    Inventors: Ali Chehade, Angelos Lyris, Henryk Klaba
  • Corrosion preventive heatsink for network device
    Patent number: 11234342
    Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 25, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Mehmet Onder Cap, Manigandan Boopalan, Joel Richard Goergen, Sandeep Mehdiratta, Manjunatha Reddy Shivashankara, Damaruganath Pinjala
  • System and method for shape memory alloy thermal interface
    Patent number: 11225339
    Abstract: An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: January 18, 2022
    Assignee: THE BOEING COMPANY
    Inventors: Eric S. Mindock, James H. Mabe, Frederick Theodore Calkins, Abraham Naroll Gissen, Miguel A. Estevez
  • Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections
    Patent number: 11226162
    Abstract: A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: January 18, 2022
    Assignee: Intel Corporation
    Inventors: Feras Eid, Adel Elsherbini, Johanna Swan
  • Electromagnetic mitigation modules for public utility facilities
    Patent number: 11224150
    Abstract: A method of operating a public utility facility includes receiving a commodity at a processing facility communicably coupled to a control system that includes primary electrical components configured to operate the processing facility, and transitioning operation of the processing facility to an electromagnetic pulse mitigation module communicably coupled to the processing facility via a fiber optic line when the primary electrical components are rendered inoperable. The electromagnetic pulse mitigation module comprises a continuous conductive enclosure that is impervious to radiated and coupled electromagnetic energy. Operation of the primary electrical components is then assumed with one or more backup electrical components housed within the electromagnetic pulse mitigation module.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: January 11, 2022
    Assignee: CenterPoint Energy, Inc.
    Inventors: Eric D. Easton, Kevin J. Bryant
  • Direct cooling of inverter switches
    Patent number: 11224147
    Abstract: A switch of an inverter module is disposed in a coolant channel, is configured to be immersed in coolant in the coolant channel, and includes: a first terminal disposed on a first plane and configured to connect to a direct current (DC) reference potential; a second terminal disposed on a second plane and configured to connect to an alternating current (AC) reference potential; a gate, an emitter, and a collector; first cooling features that extend away from the first and second planes, that directly contact the first terminal, and that are configured to allow coolant flow therethrough; and second cooling features that extend away from the first cooling features, the first plane, and the second plane, that directly contact the second terminal, and that are configured to allow coolant flow therethrough.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: January 11, 2022
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Chih-hung Yen, Goro Tamai, Konstantinos Triantos, David R. Clark, Tim M. Grewe
  • Assembly comprising an electrical device, a pressing member and a part for holding the pressing member
    Patent number: 11219139
    Abstract: The invention relates to an assembly including: at least one electrical device comprising a first face for being pressed against a surface, at least one pressing member positioned on a second face of the electrical device opposite to the first face, said pressing member being intended to participate in pressing said electrical device on said surface, at least one holding part which holds said pressing member on the second face of said electrical device by being attached around the pressing member on a peripheral portion of the electrical device.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: January 4, 2022
    Assignee: VALEO SIEMENS EAUTOMOTIVE FRANCE SAS
    Inventors: Alexandre Legendre, Aurélien Pouilly
  • Liquid drain mechanism for immersion cooling system
    Patent number: 11219142
    Abstract: An equipment assembly that allows easier replacement of heat-generating electrical components is disclosed. The assembly includes a rack for containing a heat-generating electrical component. The component includes a coolant inlet, a coolant outlet, and a drain connector. A cold manifold supplies coolant to the heat-generating electrical component through the coolant inlet. A hot manifold collects coolant from the heat-generating electrical component through the coolant outlet. A drain manifold includes a coupler. The coolant inlet and the coolant outlet are disconnected from the cold and hot manifolds. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electrical component before the heat-generating electrical component is removed from the rack.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 4, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Yung-Hsiang Lu
  • Multiple fed busbar system
    Patent number: 11217970
    Abstract: A busbar system includes a busbar with at least two parallel arranged phase conductors running between a first end and a second end of the busbar and at least two feeders connected onto the busbar, each feeder including contacts for at least some of the phase conductors of the busbar; a first supply line and a second supply line interconnecting the first feeder and the second feeder with a common power supply; wherein a first feeder of the at least two feeders is connected onto the first end of the busbar and a second feeder of the at least two feeders is connected onto the second end of the busbar; wherein each of the first supply line and the second supply line has a higher impedance than the busbar.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: January 4, 2022
    Assignee: ABB Schweiz AG
    Inventors: Harm de Roo, Tudor Baiatu
  • Power converter
    Patent number: 11218081
    Abstract: A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: January 4, 2022
    Assignee: DENSO CORPORATION
    Inventors: Masataka Deguchi, Akihiro Ueda, Koji Yasui, Hirotaka Ohno
  • Heat dissipation structure
    Patent number: 11219138
    Abstract: A heat dissipation structure capable of improving heat dissipation efficiency and regulating temperature distribution of a surface of a housing is provided. A heat dissipation structure 300 is provided in a housing 200 that accommodates a heat generating source 102 therein, the heat dissipation structure 300 including: top surface parts 213 and 223 opposed to each other, in which the top surface part 213 includes a plurality of concave-shaped parts 213B-F that are aligned, the top surface part 223 includes a plurality of concave-shaped parts 223B-F that are aligned, the concave-shaped parts 213B-F of the top surface part 213 are opposed to the concave-shaped parts 223B-F of the top surface part 223, outlets 213A are formed in the concave-shaped parts 213D, 213E, and 213F, and outlets 223A are formed in the concave-shaped parts 223C, 223D, 223E, and 223F.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: January 4, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Takahiro Yagi
  • Modular wall-mounted electrical control device
    Patent number: 11209845
    Abstract: A family of wall-mounted electrical fixtures, both for lighting control and electrical power or signal delivery, having a modular design. Said modular design predominately isolating those components that are directly connected to in-wall wiring within a wall-mounted base and low-voltage control and communication components, such as sensors, user-interface elements, programmable logic and wireless communication modules, within an aesthetically-appealing, easily-detachable faceplate assembly.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: December 28, 2021
    Inventor: Jean-Louis Iaconis
  • Universal pluggable datacenter cooling system
    Patent number: 11212943
    Abstract: A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: December 28, 2021
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Tubular heat spreaders for memory modules and memory modules incorporating the same
    Patent number: 11206749
    Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: December 21, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Thomas H. Kinsley, George E. Pax, Yogesh Sharma, Gregory A. King, Chan H. Yoo, Randon K. Richards