Abstract: A semiconductor memory device, in which a multi-bit region including multi-bit memory cells that store data of two or more bits and a region including memory cells that store data of bits that are less than the bits of the data stored in the multi-bit memory cells are installed, is provided, which can perform a high-speed writing and lengthen the life span of the product without increasing the storage capacity of the region of the memory cells storing the data of bits that are less than the bits of the data in the multi-bit memory cells. The semiconductor memory device includes a plurality of memory cells which store n-bit (where n is a natural number that is equal to or larger than 2) data for one cell. Among the plurality of memory cells, h-bit (h?n) data is stored in a memory MLC of a first region MLB, and i-bit (i<h) data is stored in a memory SLC of a second region SLB.

Abstract: A method of reading a dual-bit memory cell includes a controlling terminal, a first terminal, and a second terminal. The dual-bit memory cell has a first bit storage node and a second bit storage node near the first terminal and the second terminal respectively. First, a controlling voltage and a read voltage are applied to the controlling terminal and the first terminal respectively. The second terminal is grounded to measure a first output current value of the first terminal. Then, the controlling voltage and the read voltage are applied to the controlling terminal and the second terminal respectively. The first terminal is grounded to measure a second output current value of the second terminal. Afterward, the bit state of the first bit storage node and the bit state of the second bit storage node is read simultaneously according to the first output current value and the second output current value.

Abstract: An internal voltage generator according to an embodiment generates a reference voltage used for detecting data stored in a semiconductor memory. A first AD converter is configured to convert an external voltage supplied to the semiconductor memory into a first digital value. A second AD converter is configured to convert a temperature characteristic voltage that changes depending on a temperature of the semiconductor memory into a second digital value. An adder is configured to receive a reference voltage trimming address that specifies the reference voltage, the first digital value, and the second digital value, and to output a third digital value obtained by performing a weighted addition of the reference voltage trimming address, the first digital value, and the second digital value. A driver is configured to output the reference voltage responding to the third digital value.

Abstract: According to one exemplary embodiment, a memory cell in a semiconductor chip includes a non-volatile memory transistor, a control gate, and a floating gate. The control gate is capacitively coupled to the floating gate of the non-volatile memory transistor by a metal capacitor. The metal capacitor can be formed in one or more metal levels and in one embodiment is in a shape of a comb with multiple fingers. In one embodiment, the non-volatile memory transistor is an NMOS non-volatile memory transistor.

Abstract: A method of operating an integrated circuit includes applying at least one first programming pulse to a plurality of non-volatile memory cells to adjust a level of a storage parameter of each of the non-volatile memory cells, the at least one first programming pulse defined by a plurality of pulse parameters each having a fixed valued, and determining a fail count by measuring the number of non-volatile memory cells of the plurality of non-volatile memory cells having a storage parameter level exceeding a verify level. The method further includes determining a change in an programming behavior of the plurality of non-volatile memory cells based on the fail count, adjusting a value of at least one pulse parameter of at least one second programming pulse defined by the plurality of pulse parameters to a desired value based on the change in programming behavior, and applying the at least one second programming pulse to the plurality non-volatile memory cells.

Abstract: A thin provisioned storage system may have a file system manager that presents a logical storage system to a user and a storage management system that manages physical storage devices. When a block of data is freed at the logical layer, the file system manager may identify the freed block and send a command to the physical layer. The physical layer may identify the corresponding physical block or blocks and free those blocks on the physical layer. The storage management system may use a table to manage the location of blocks of data across multiple physical storage devices.

Abstract: A semiconductor device includes: a memory cell array having a plurality of memory cells arranged in arrays; a plurality of bit lines formed correspondingly to a column arrangement of the memory cells; a plurality of word lines formed correspondingly to a row arrangement of the memory cells; a plate line having one of a configuration in which the first electrodes of the respective memory cells are included in the plate line and a configuration in which the first electrodes are connected to the plate line; a column switch used to connect a selected bit line and a data access line; and a pre-charge portion that performs a pre-charge operation to pre-charge a non-selected bit line not selected by the column switch to potential of the plate line.

Abstract: Methods are disclosed to compensate for a second-bit effect during programming and reading of charge-trapping memory cells having left and right data regions. When only one of the left and right data regions is to be programmed, a two-step programming procedure is performed on the data region to be programmed. When the memory cell is to be read, threshold voltages for the left and right data regions are sensed with a joint decision regarding left and right data bit values being reached depending upon both sensed threshold voltage values.

Abstract: One or more embodiments of the present disclosure provide methods, devices, and systems for operating non-volatile multilevel memory cells. One method embodiment includes programming a memory cell to one of a number of different threshold voltage (Vt) levels, each level corresponding to a program state. The method includes programming a reference cell to a Vt level at least as great as an uppermost Vt level of the number of different Vt levels, performing a read operation on the reference cell, and determining a number of read reference voltages used to determine a particular program state of the memory cell based on the read operation performed on the reference cell.

Abstract: A ferroelectric memory having a plurality of ferroelectric memory cells, each ferroelectric memory cell including a ferroelectric capacitor is disclosed. The ferroelectric memory includes read and write lines and a plurality of ferroelectric memory cell select buses, one select bus corresponding to each of the ferroelectric memory cells. Each of the ferroelectric memory cells includes first and second gates for connecting the ferroelectric memory cell to the read line and the write line, respectively, in response to signals on the ferroelectric memory cell select bus corresponding to that ferroelectric memory cell. A write circuit causes a charge to be stored in the ferroelectric capacitor of the ferroelectric memory cell currently connected to the write line, the charge having a value determined by a data value having at least three states.

Abstract: Techniques for block refreshing a semiconductor memory device are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method for block refreshing a semiconductor memory device. The method may comprise arranging a plurality of memory cells in one or more arrays of rows and columns. Each of the plurality of memory cells may comprise a first region coupled to a source line, a second region, a first body region disposed between the first region and the second region, wherein the body region may be electrically floating and charged to a first predetermined voltage potential, and a first gate coupled to a word line, wherein the first gate may be spaced apart from, and capacitively coupled to, the first body region. The method may also comprise applying voltage potentials to the plurality of memory cells to refresh a plurality of data states stored in the plurality of memory cells.

Abstract: A memory device having a scalable bandwidth I/O data bus includes a semiconductor die having a substrate with a first and a second surface. The substrate includes contact pads arranged in rows across the first surface and across the second surface. The contact pads on one surface may be physically arranged in vertical alignment with a corresponding contact pad on the other surface and may be electrically coupled to the corresponding contact pad using a via. The substrate also includes a metallization layer formed on the second surface. The metallization layer includes external data contact pads each arranged in vertical alignment with a respective contact pad on the second surface. Each row of contact pads may be grouped, and the external contact pads within a group are electrically coupled to an adjacent contact pad on the second surface by effectively logically shifting to them to right one contact pad.

Abstract: A method and static random access memory (SRAM) circuit for implementing low power data predicting local evaluation for double pumped arrays, and a design structure on which the subject circuit reside are provided. A novel variation of a domino read local evaluation circuit accurately predicts the write data for the next cycle. The domino read local evaluation circuit uses static write data set up prior to a write enable signal to determine the value of the data that is being written into the array. When the data being written to the array matches the data last read the local bitlines stay in their previous state. When the data being written is opposite of the data last read then the bit lines are precharged to the precharge value.

Abstract: A latency counter includes an input selecting circuit that selects one of a plurality of signal paths and supplies an internal command to the selected signal path, a shift circuit that switches a correspondence relation between the signal paths and a latch circuit, and an output selecting circuit that causes the internal command taken in the latch circuit to be output. The input selection circuit includes a timing control circuit allocated to each of the signal paths. The timing control circuit includes an SR latch circuit that is set by the internal command and is reset in response to deactivation of a corresponding count value. Therefore, it becomes possible to suppress shortening of an active period of the internal command that is output from the input selecting circuit.

Abstract: Embodiments disclosed herein generally relate to switches that utilize micro-electromechanical systems (MEMS). By replacing transistors in many devices with switches such as MEMS switches, the devices may be used for logic applications. MEMS switches may be used in devices such as FPGAs, NAND devices, nvSRAM devices, AMS chips and general memory logic devices. The benefit of utilizing MEMS devices in place of transistors is that the transistors utilize more space on the chip. Additionally, the MEMS devices can be formed in the BEOL without having any negative impacts on the FEOL or necessitating the use of additional layers within the chip.

Abstract: Some embodiments include methods of reading memory cells. The memory cells have a write operation that occurs only if a voltage of sufficient absolute value is applied for a sufficient duration of time; and the reading is conducted with a pulse that is of too short of a time duration to be sufficient for the write operation. In some embodiments, the pulse utilized for the reading may have an absolute value of voltage that is greater than or equal to the voltage utilized for the write operation. In some embodiments, the memory cells may comprise non-ohmic devices; such as memristors and diodes.

Abstract: A semiconductor device including a memory cell is provided. The memory cell comprises a transistor and a capacitor, and one of a resistor and a diode. A gate of the transistor is electrically connected to a word line, and one of a source and a drain of the transistor is electrically connected to a bit line. One terminal of the capacitor is electrically connected to the other of the source and the drain of the transistor, and the other terminal of the capacitor is electrically connected to a wiring. One terminal of one of the resistor and the diode is electrically connected to the other of the source and the drain of the transistor, and the other terminal of one of the resistor and the diode is electrically connected to the wiring.

Abstract: A page buffer of a nonvolatile memory device comprises a sense unit coupled between the sense node and the bit lines of a memory cell array, comprising a number of memory cells, and configured to precharge the bit lines to different voltage levels in response to a page buffer sense signal of a first or second voltage level, a MUX unit configured to output the page buffer sense signal of the first or second voltage level in response to a control signal according to a value of program data, a flag latch configured to temporarily store the program data and to output the control signal to the MUX unit, and a main latch configured to sense the voltage levels of the bit lines via the sense node and to perform a program verification operation.

Abstract: A semiconductor memory device includes at least one sense amplifier, a controller and a sense amplifier driver. The sense amplifier includes a PMOS sense amplifier and an NMOS sense amplifier configured to be respectively activated in response to a first supply voltage and a second supply voltage, and to sense and amplify a voltage difference between a corresponding bit line pair. The controller is configured to set an operating mode in response to an external command, to control activation timing of a PMOS drive activation signal and an NMOS drive activation signal according to the set operating mode, and to output the PMOS drive activation signal and the NMOS drive activation signal. The sense amplifier driver is configured to apply the first and second supply voltages to the PMOS and NMOS sense amplifiers, respectively, in response to the PMOS drive activation signal and the NMOS drive activation signal.

Abstract: A semiconductor device including a plurality of repairable signal lines, the device including a first driver adapted to maintain a first portion of each defective one of the repairable signal lines at a first voltage level, and a second driver adapted to drive a second portion of each of the defective ones of the repairable signal lines being repaired to the first voltage level.