Abstract: A method for preparing a latent hardener includes, in the order recited, introducing a hardener into a dry mixer that is a high-energy-type mixer; injecting carbon dioxide gas or an inert gas into the dry mixer; and mechanochemically deactivating only a surface of the hardener using the dry mixer. The hardener may be an amine-based adduct, an imidazole-based adduct, dicyandiamide, a dihydride-based compound, a dichlorophenyl dimethylurea compound and combinations thereof. The inert gas may be helium, nitrogen, argon, neon, krypton, and combinations thereof.

Abstract: The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.

Abstract: A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90° C. to 130° C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.

Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion. The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.

Abstract: The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

Abstract: Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×103 Pa·s to 5×106 Pa·s.

Abstract: A super absorbent polymer produced by the preparation method of the super absorbent polymer according to the present invention has excellent dryness while maintaining excellent absorption performance, and thus is preferably used for hygienic materials such as diapers and can exhibit excellent performance.

Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.

Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.

Abstract: A polycarbodiimide compound represented by the following general formula (1): wherein R1 and R3 are defined in the specification; R2 comprises a group represented by formula (i) or (ii) as defined in the specification; the proportion of the groups represented by the formula (i) relative to all the R2 groups in the polycarbodiimide compound is 30 to 70 mol %, and the proportion of the groups represented by the formula (ii) relative to all the R2 groups in the polycarbodiimide compound is 30 to 70 mol %; X1 and X2 each represent a group formed by the reaction of the organic compound and isocyanate, and X1 and X2 may be the same as or different from each other; and n represents an integer of 2 to 50.

Abstract: The present invention relates to a process for the manufacture of an epoxy-functional polyester, and to solid epoxy-functional polyesters made by such process and to a coating composition, in particular a powder coating composition, comprising such solid epoxy-functional polyester. The polyester made as disclosed herein is particularly useful in powder coatings.

Abstract: The present invention provides an epoxy resin including a reaction product of 1,2,4-trihydroxybenzene and an epihalohydrin, the epoxy resin containing a cyclic compound that has a cyclic structure containing, as constitutional atoms, oxygen atoms at 1-position and 2-position derived from 1,2,4-trihydroxybenzene, the cyclic compound being contained in an amount of 0.003 to 0.070 mol based on 100 g of the epoxy resin. The epoxy resin is liquid and is excellent in pyrolysis resistance.

Abstract: This invention relates to a hardener composition for an epoxy resin based two-pack coating formulation wherein the hardener composition comprises moieties having at least one structural element of formula >N-D1-NH2, and moieties having at least one structural element of formula >N-D2-NH—C(O)-Q, wherein D1 is a bivalent group, D2 is a bivalent group, and Q is a univalent group, to epoxy resin based two-pack coating formulations comprising at least one epoxy resin which is a polymer containing, on average, at least two epoxide groups per molecule, and the hardener composition, and at least one of diglycerides which are esters of glycerol with two molecules of fatty acid, monoglycerides which are esters of glycerol with one molecule of fatty acid, or glycerol, or the reaction products of at least one of diglycerides or monoglycerides or glycerol with organic compounds having at least one reactive group selected from the group consisting of acylesters, acylanhydrides, isocyanates, epoxides, cyclocarbonates,

Abstract: This invention provides a self-healable epoxy resin and its preparation, recycling and remolding method. With the catalyst of potassium iodide, an ester solution of 2-mercaptoacetic acid was oxidated by 30% H2O2 to form 2,2?-dithiodiacetic acid; then 2,2?-dithiodiacetic acid was dehydrated and cyclizated by anhydride to form 1,4,5-oxadithiepane-2,7-dione; 1,4,5-oxadithiepane-2,7-dione and methylhexahydrophthalic anhydride were mixed by mass ratio and cured with epoxides to get the self-healable epoxy resin. Through controlling dynamic and permanent three-dimensional crosslinked network, the self-healable epoxy resins provided in this invention exhibit high thermal resistance and improved mechanical properties as well as excellent self-healing ability, recyclability and remoldability. This invention provides a preparation method with the merits of low cost, simple production processes, broad application prospects and strong utility.

Abstract: Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound; 0.20?b/a?0.60; and??(i) 0.002?c/a?0.014;??(ii) wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).

Abstract: A cement composition is disclosed that includes a cement slurry and an epoxy resin system that includes at least one epoxy resin and a curing agent. The cement slurry has a density in a range of from 65 pcf to 180 pcf and includes a cement precursor material, silica sand, silica flour, a weighting agent, and manganese tetraoxide. The epoxy resin system includes at least one of 2,3-epoxypropyl o-tolyl ether, alkyl glycidyl ethers having from 12 to 14 carbon atoms, bisphenol-A-epichlorohydrin epoxy resin, or a compound having formula (I): (OC2H3)—CH2—O—R1—O—CH2—(C2H3O) where R1 is a linear or branched hydrocarbyl having from 4 to 24 carbon atoms; and a curing agent.

Abstract: A resin composition including the following (A) to (D): (A) a resin containing epoxy groups in the range of 140 to 5000 g/eq as an epoxy equivalent; (B) a phenolic curing agent; (C) a curing accelerator; and (D) at least one compound selected among what is expressed by the following formulae (0-1) to (0-5). This provides a resin composition having small warpage and excellent adhesive force, a high adhesion resin composition film made into a film form from the composition, a semiconductor laminate having a cured product of the film and its production method, a semiconductor device obtained by dicing the semiconductor laminate into individual chips and its production method.

Abstract: The embodiments described herein generally relate to methods and chemical compositions of phenolic epoxy systems. In one embodiment, a composition comprising a phenolic epoxy resin system includes an epoxy resin component and an alkoxylated phenol-aldehyde novolac resin.

Abstract: The present teachings contemplate relatively high glass transition temperature (Tg) polymers and/or other reaction products. A method may include reacting a diepoxide with a bisphenol in amounts and under conditions to produce a material that has a Tg as measured by differential scanning calorimetry according to ASTM E1358-08(2014) of at least about 90° C. at least about 100° C. (at least about 110° C., or at least about 120° C.

Abstract: Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.