Patents Examined by Derris Banks
  • Patent number: 8056220
    Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: November 15, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang-Hoon Kim, Je-Gwang Yoo, Joon-Sung Kim, Han Seo Cho
  • Patent number: 8051559
    Abstract: A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: November 8, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ki-Hwan Kim, Jong-Kuk Hong, Jin-Yong An
  • Patent number: 8051557
    Abstract: The invention provides a substrate with multi-layer interconnection structure, which includes a substrate and a multi-layer interconnection structure formed on the substrate. The multi-layer interconnection structure is adhered to the substrate in partial areas. The invention also provides a method of manufacturing and recycling such substrate and a method of packaging electronic devices by using such substrate. The invention also provides a method of manufacturing multi-layer interconnection devices.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: November 8, 2011
    Assignee: Princo Corp.
    Inventor: Chih-kuang Yang
  • Patent number: 8046887
    Abstract: In a method of operating a gearwheel machining tool having a machining wheel situated on a drive axis, for reworking a gearwheel, a fixed axial distance between both wheels is set. In this manner, the engagement of the gearwheel in the teeth of the machining wheel may be performed without damage in a technically simple way, which is achieved in that the gearwheel to be machined is placed on the arbor in an arbitrary rotational angle position, tooth areas of its lateral external faces facing toward the machining wheel coming to rest on lateral tooth areas of the machining wheel, upon which the machining wheel is set into rotation and the gearwheel to be machined slides axially on the arbor into its machining position. After which the tooth gaps of the two overlapping areas of the wheels are rotated one over the other and the wheels are mutually engaged.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: November 1, 2011
    Inventor: Wolfgang Linnenbrink
  • Patent number: 8046907
    Abstract: In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: November 1, 2011
    Assignee: Panasonic Corporation
    Inventors: Hideki Sumi, Takahiro Noda
  • Patent number: 8046895
    Abstract: A system and method for assembling a vehicle body structure. The system includes first and second end effectors for positioning first and second body structure components. The second end effector engages the first end effector to position the second body structure component relative to the first body structure component.
    Type: Grant
    Filed: January 21, 2008
    Date of Patent: November 1, 2011
    Assignee: Ford Motor Company
    Inventors: Cary R. Sherrill, Douglas P. Heerema, Richard D. Pastrick
  • Patent number: 8042246
    Abstract: A tool and method of repair for removing a bulge in a stained glass window by providing at least one aperture in the metal earning of the stained glass window; positioning at least one threaded rod member through at least one of such aperture(s); further positioning two tool members one on each side of the stained glass window, each tool member having at least one aperture defined therein and a flat surface with the flat surface of one tool member being positioned against the bulge in the stained glass window and the other positioned behind the bulge, each of such tool members receiving such rod member(s), respectively, in such tool member aperture(s).
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: October 25, 2011
    Inventor: Peter B. Ureneck
  • Patent number: 8042249
    Abstract: A method and apparatus for providing motor vehicle sub-assemblies with unrestricted model mix and quick changeover between models. The apparatus includes a track; a carriage mounted for longitudinal movement along the track between first and second positions; and first and second turrets rotatably mounted on the carriage at longitudinally spaced locations and each including a plurality of circumferentially spaced individual faces and unique tooling fixtures on the respective faces for receiving unique work piece components corresponding to a plurality of motor vehicle body styles.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: October 25, 2011
    Assignee: Camau, Inc.
    Inventor: Velibor Kilibarda
  • Patent number: 8037596
    Abstract: A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.
    Type: Grant
    Filed: November 28, 2007
    Date of Patent: October 18, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Shigetsugu Muramatsu, Yasuhiko Kusama
  • Patent number: 8033011
    Abstract: A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate. The frame is used to support the double-side tape and can be designed to fit the conventional production line for holding, picking and transferring wafers. The carrier substrate can be a sapphire substrate, a quartz substrate or other substrates that can sustain further processing, such as thermal treatments and/or chemical etchings. The method of the present invention not only prevents possible damages to the highly brittle chip after wafer thinning, but also fits the conventional production line for processing semiconductor wafers.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: October 11, 2011
    Assignee: Win Semiconductors Corp.
    Inventors: Jason Chou, Chang-Hwang Hua, Ping-Wei Chen, Sen Yang
  • Patent number: 8033012
    Abstract: A space transformer for a semiconductor test probe card and method of fabrication. The method may include depositing a first metal layer as a ground plane on a space transformer substrate having a plurality of first contact test pads defining a first pitch spacing, depositing a first dielectric layer on the ground plane, forming a plurality of second test contacts defining a second pitch spacing different than the first pitch spacing, and forming a plurality of redistribution leads on the first dielectric layer to electrically couple the first contact test pads to the second contact test pads. In some embodiments, the redistribution leads may be built directly on the space transformer substrate. The method may be used in one embodiment to remanufacture an existing space transformer to produce fine pitch test pads having a pitch spacing smaller than the original test pads. In some embodiments, the test pads may be C4 test pads.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: October 11, 2011
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming Cheng Hsu, Clinton Chih-Chieh Chao
  • Patent number: 8033013
    Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: October 11, 2011
    Assignee: Compeq Manufacturing Co., Ltd.
    Inventors: Yen Ching Chiang, Shih Chia Fang, Jun Yi Wang, Hsiu Lin Huang
  • Patent number: 8024859
    Abstract: A replacement oil pump plate for attachment to an original equipment manufacture oil pump within a transfer case for elimination of mechanical wear by replacing the abrasive aluminum tabs formed on the oil pump with low-friction plastic tabs is disclosed. The present plastic tab design redistributes the surface-to-surface contact between the magnesium transfer case and the aluminum pump tabs away from the original wear points so that any necessary weld repairs to the transfer case will not be disturbed. The present replacement pump plate is provided in a kit format including a pump plate, machine screws, plastic tabs, and installation instructions. The present invention also describes a method of installing the pump plate kit on the original equipment manufacture oil pump subassembly.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: September 27, 2011
    Assignee: Sonnax Industries, Inc.
    Inventors: Maura J. Stafford, Gregg A. Nader
  • Patent number: 7712210
    Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: May 11, 2010
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Thomas R. Miller, Duane A. Stanke, Robert J. Testa
  • Patent number: 7059362
    Abstract: An adaptable hand operated tool for tensioning safety cable to a predetermined tension limit, crimping a ferrule onto the cable, and cutting the cable. The tool comprises a body for adapting the tool to a hand operated hydraulic tool, a cable tensioner, and an elongated, removable nose. The cable tensioner comprises a wheel for applying tension to a cable wrapped around the wheel, and a clutch for prohibiting a rotational force from being applied to the wheel when a predetermined cable tension is applied. The elongated has an aperture for receiving a ferrule and passing the cable therethrough. A plunger is reciprocally operative in the nosepiece to crimp the ferrule on the safety cable and simultaneously severing a free end of the cable. The plunger is actuated by a piston of a hand operated hydraulic base tool.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: June 13, 2006
    Assignee: Daniels Manufacturing Corporation
    Inventors: Kirk C. Koons, Walter J. Plyter
  • Patent number: 7048211
    Abstract: A flexible automated apparatus for isolating and purifying viruses, proteins and peptides of interest from a plant material is disclosed, the apparatus being applicable for large scale purification and isolation of such substances from plant material. The flexible automated apparatus provides an efficient apparatus for isolating viruses, proteins and peptides of interest with little waste material. The automated apparatus for isolating viruses, proteins and peptides of interest includes a grinding apparatus for homogenizing a plant to produce a green juice, a means for adjusting the pH of and heating the green juice, a means for separating the target species, either virus or protein/peptide, from other components of the green juice by one or more cycles of centrifugation, resuspension, and ultrafiltration, and finally purifying virus particles by such procedure as PEG-precipitation or purifying proteins and peptides by such procedures as chromatography and/or salt precipitation.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: May 23, 2006
    Assignee: Large Scale Biology Corporation
    Inventors: Barry Bratcher, Stephen J. Garger, R. Barry Holtz, Michael J. McCulloch
  • Patent number: 7048212
    Abstract: The present invention provides a sound activated detection system disposed within the conveyor and/or hammer roll area of a reduction mill for detecting unshredable materials fed into the machine. More specifically, an embodiment of this invention comprises a unshredable debris detector disposed in operative relationship in the material input path and includes a transducer, preferably a piezoelectric crystal, acoustically coupled to a sensing surface disposed transversely across a portion of the input path. Alternative embodiments may include one or more accelerometers, microphones, or other vibration or acoustic sensors either alone or in conjunction with the transducer for detecting the unshredable material.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: May 23, 2006
    Inventor: Alan Carey
  • Patent number: 7017380
    Abstract: A bending assembly on a bending machine for the bending of rod and/or bar-shaped workpieces (8) includes a bending tool (10) and a bending drive unit (11) with a swivel arm (21) and a bending-drive motor (22). The bending tool (10) has at least one workpiece thrust block (12, 13), and the swivel arm (21) has at least one thrust pad (17, 18). The bending-drive motor (22) rotates the swivel arm (21) with the thrust pad (17, 18) around a bending axis (14) that extends in the transverse direction of the workpiece. The workpiece is bent when the thrust pad (17, 18) forces it against and around the associated workpiece thrust block (12, 13). The shaft of the bending drive motor (22) extends parallel to the bending axis (14), and both ends of the shaft are drive-connected to the swivel arm (21).
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: March 28, 2006
    Assignee: Trumpf Rohrtechnik GmbH &Co. KG
    Inventors: Frank Schmauder, Winfried Richter
  • Patent number: 6994377
    Abstract: The invention relates to a sheet-retaining system for securing sheets on a sheet carrier, in particular for securing paper sheets in a cover, having a retaining and connecting device for securing at least one sheet at the sheet edge and for connecting the at least one sheet to the sheet carrier indirectly via the retaining and connecting device. According to the invention, the retaining and connecting device has a retaining bar which is connected to the at least one sheet, may possibly be subdivided into separate sections and extends along the sheet edge which is directed towards the sheet carrier.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: February 7, 2006
    Inventor: Matthias Büttner
  • Patent number: 6969091
    Abstract: A book that is capable of displaying one or more coins related to its theme, including a front cover and a back cover. At least one book cover defines one or more apertures that are capable of receiving coins. The book theme is displayed on at least one of the book covers. The book may optionally include one or more caps that may be inserted into and removed from the coin-receivable apertures. These caps will preferably display images that are related to the theme of the book. The invention provides a coin specific display that stores and displays one or more coins in an appealing manner, and that also conveys or provides additional information about the theme displayed on the coin.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: November 29, 2005
    Assignee: Anderson Press Incorporated
    Inventors: Richard Hilicki, Harold Anderson