Patents Examined by Derris Banks
  • Method of a package on package packaging
    Patent number: 8141247
    Abstract: A method of manufacture of an integrated circuit package-on-package system includes providing a base package and providing solder caps on the top of the base package configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the base package, and configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: March 27, 2012
    Assignee: Stats Chippac Ltd.
    Inventor: Rajendra D. Pendse
  • Insulating material and printed circuit board having the same
    Patent number: 8141244
    Abstract: An insulating material, a printed circuit board that utilizes the insulating material, and a method of manufacturing the printed circuit board. The method includes perforating at least one through-hole corresponding with the at least one, which is in correspondence with the via, in a first insulator; applying a surface treatment on the first insulator by irradiating an ion beam; forming a first seed layer over an inner wall of the through-hole and over one or either side of the first insulator; forming a first plating resist over one or either side of the first insulator on which the first seed layer is formed; performing electroplating in correspondence with the circuit pattern and the via; removing the first plating resist; and removing a portion of the first seed layer by flash etching. This method can improve adhesion between the insulator and the circuit patterns to allow fine-line circuit patterns.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: March 27, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jong-Seok Song
  • Manufacturing method for micro-SD flash memory card
    Patent number: 8141240
    Abstract: A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: March 27, 2012
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Nan Nan, Paul Hsueh, Abraham C. Ma, Ming-Shiang Shen
  • Method of fabricating structure having out-of-plane angular segment
    Patent number: 8136212
    Abstract: A structure fabricating method plastically deforms a target portion of a substrate, to thereby fabricate a structure having an inclined segment that is inclined relative to a principal surface of the substrate. The method includes forming a projection on the target portion to project from the principal surface of the substrate or from an opposing surface of the substrate on the side opposite to the principal surface, and applying a force to the projection to plastically deform the target portion such that the target portion is bent in a direction from one surface of the substrate on the side where the projection is formed, toward another surface on the side opposite to the one surface.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: March 20, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshitaka Zaitsu, Chienliu Chang, Masao Majima
  • Electronic component mounter and mounting method
    Patent number: 8136219
    Abstract: A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: March 20, 2012
    Assignee: Panasonic Corporation
    Inventors: Tadashi Endo, Akira Noudo, Takeyuki Kawase, Osamu Okuda, Hiroshi Ogata
  • Integrated heat spreader and method of fabrication
    Patent number: 8136244
    Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: March 20, 2012
    Assignee: Intel Corporation
    Inventor: Kazuo Ogata
  • Method of manufacturing coil for stator incorporated in rotary electric machine
    Patent number: 8136221
    Abstract: A method is provided for manufacturing a stator coil for a rotary electric machine, which is formed by winding up a plurality of phase wires. The method includes a shaping step for shaping a plurality of shaped wire members from electrically conductive wires, an integrating step for integrating the plurality of shaped wire members with each other to form an integrated body, and a winding-up step for winding the integrated body about a core member to form a wound body. At the winding-up step, curve forming is performed by plastically deforming turn portions of the integrated body into a curved shape, during conveyance of feeding the integrated body to the core member.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: March 20, 2012
    Assignee: Denso Corporation
    Inventors: Masahiro Takada, Akito Akimoto, Atsuo Ishizuka
  • Method of forming a substrate having a plurality of insulator layers
    Patent number: 8136240
    Abstract: A mechanism is disclosed for providing horizontally split vias in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: March 20, 2012
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Kevin Albert Splittstoesser, Timothy Jerome Tofil, Paul Alan Vermilyea
  • Apparatus for forming a wireless communication device
    Patent number: 8136223
    Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying items comprises cutting techniques that allow the size of antenna elements for the wireless communication device to be adjusted. Rollers cut tabs that form the antenna elements. In one embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be adjusted so as to shorten or lengthen the antenna element. In another embodiment, the rollers are independently positionable to shorten or lengthen the antenna element. A radiator may be configured to assess a capacitance of the antenna elements prior to cutting to determine an appropriate size for the antenna elements.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: March 20, 2012
    Assignee: Mineral Lassen LLC
    Inventors: Ian J. Forster, Patrick F. King
  • U-joint extracting tool and method of use therefor
    Patent number: 8132331
    Abstract: An apparatus that aids in the removal of heavy-duty universal joints or Spicer® joints is herein disclosed. The apparatus is comprised of a metal plate approximately four (4) inches long and two-and-a-half (2½) inches wide. Two (2) outer apertures in the metal plate attach to the corresponding retaining bolt holes on an existing universal joint. The inner hole has a driver shaft driven by a three-quarter (¾) inch hex fitting. This driver shaft facilitates the removal of the joint caps of the universal joint. The apparatus is secure and will not slip or reposition itself while in use. When finished, the apparatus is removed from the drive shaft. The use of the apparatus allows for the removal of heavy-duty universal joints in an efficient manner.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: March 13, 2012
    Inventor: Brian Rutherford
  • Coaxial cable installation tool
    Patent number: 8132323
    Abstract: A tool for installing an end of a cable into a connector generally includes a front jaw assembly adapted to retain the cable connector and a back jaw assembly movably coupled to the front jaw assembly. The cable connector includes a connector body and a compression sleeve and the back jaw assembly is adapted to insert an end of the cable into the cable connector upon movement of the back jaw assembly toward the front jaw assembly and subsequently press the compression sleeve into the connector body upon further movement of the back jaw assembly toward the front jaw assembly.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: March 13, 2012
    Assignee: Belden Inc.
    Inventor: Julio Rodrigues
  • Method for assembling components of a microstimulator
    Patent number: 8127424
    Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: March 6, 2012
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Matthew I. Haller, Tom Xiaohai He, Jay Daulton
  • Method of resin sealing permanent magnets in laminated rotor core
    Patent number: 8127431
    Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: March 6, 2012
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Katsumi Amano, Kazutoshi Ueda
  • Method for integrating heat transfer members, and an LED device
    Patent number: 8127445
    Abstract: Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: March 6, 2012
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Yuji Saga, Narumi Une, Yoshinobu Uchida
  • Electronic component mounting apparatus
    Patent number: 8127435
    Abstract: The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: March 6, 2012
    Assignee: Hitachi High-Tech Instruments Co., Ltd.
    Inventors: Yutaka Mitsumochi, Yoshihiro Onoguchi, Masami Iizuka, Hiroomi Kobayashi, Kazuyoshi Oyama, Hisayoshi Kashitani, Koichi Izuhara
  • Quartz crystal unit, quartz crystal oscillator having quartz crystal unit, and electronic apparatus having quartz crystal oscillator
    Patent number: 8127427
    Abstract: A quartz crystal oscillator has an amplifier, a capacitor, a resistor and a quartz crystal unit comprised of a case, a quartz crystal tuning fork resonator vibratable in a flexural mode and a lid connected to the case. At least one groove with a first surface opposite a first side surface and a second surface connected to the first surface through a third surface is formed in each of first and second main surfaces of each of first and second quartz crystal tuning fork tines. The width of each groove is greater than a distance in the width direction of the groove measured from an outer edge of the groove to an outer edge of the corresponding tuning fork tine. A first electrode is disposed on the first surface of the groove and a second electrode is disposed on the first side surface so that the first electrode has an electrical polarity opposite to the electrical polarity of the second electrode.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: March 6, 2012
    Assignee: Piedek Technical Laboratory
    Inventor: Hirofumi Kawashima
  • Method for fabricating electroactive polymer transducer
    Patent number: 8127437
    Abstract: Electroactive polymer transducers for sensory feedback applications are disclosed.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: March 6, 2012
    Assignee: Bayer MaterialScience AG
    Inventors: Michael G. Lipton, Ilya Polyakov, Alireza Zarrabi, Otto Hui, Silmon James Biggs, Thomas A. Kridl, Gordon Russell, Jonathan R. Heim, Roger Hitchcock, Chris A. Weaber
  • Method of manufacturing a glass substrate for magnetic disk
    Patent number: 8127433
    Abstract: In a manufacturing method of a glass substrate for a magnetic disk including a cleaning process of the glass substrate, the cleaning process includes a process of contacting the glass substrate with a cleaning solution containing a compound, such as thioglycolic acid or a thioglycolic acid derivative, having a thiol group as a functional group.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: March 6, 2012
    Assignee: Hoya Corporation
    Inventor: Yoshinori Marumo
  • Device for handling an article
    Patent number: 8127416
    Abstract: The invention relates to a device (11) for handling an article (13) such as a coil spring, and to an installation for handling an article. The device (11) comprises a body (10) having an internal housing (12) suitable for containing said article (13), said housing (12) presenting at least one open end (10A, 10B) and a constriction zone (14) that is suitable in a stable state, in which said constriction zone (14) presents a reduce dimensions (D14X) that is reduced in a first direction (X), for retaining said article (13) inside the body (10), and for being deformed to adopt a deformed configuration enabling said article (13) to be inserted into the housing (12) or enabling said article (13) to be extracted from the housing (12). The installation includes force-application means for acting on the device to change it between its stable state and its deformed configuration.
    Type: Grant
    Filed: October 4, 2010
    Date of Patent: March 6, 2012
    Assignee: Tech Group Europe Limited
    Inventor: Stephane Chevallier
  • Method of manufacturing ceramic/metal composite structure
    Patent number: 8127441
    Abstract: A method of manufacturing a ceramic/metal composite structure includes the steps of: providing a ceramic substrate; forming a metal interface layer on the ceramic substrate; placing a copper sheet on the metal interface layer; heating the ceramic substrate, the metal interface layer and the copper sheet so that the metal interface layer forms strong bonds with the ceramic substrate and the copper sheet. Multiple stages of pre-oxidizing processes are performed on the copper sheet at different temperatures and in different atmospheres with different oxygen partial pressures before the copper sheet is placed on the metal interface layer. The metal interface layer provides a wetting effect for the copper sheet to the ceramic substrate at a high temperature so that the copper sheet wets a surface of the aluminum oxide.
    Type: Grant
    Filed: January 24, 2008
    Date of Patent: March 6, 2012
    Assignee: National Taiwan University
    Inventors: Wei-Hsing Tuan, Tsong-Jen Yang